Patents by Inventor Youichirou Mansei

Youichirou Mansei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE
    Publication number: 20150299520
    Abstract: Provided is an adhesive sheet for an image display device (1), the adhesive sheet including a film-like adhesive layer (2), and a pair of substrate layers (3) and (4) laminated so as to interpose the adhesive layer (2) therebetween, in which the adhesive layer (2) contains a structural unit derived from stearyl (meth)acrylate as a main component, and has a haze value of 1.5% or less.
    Type: Application
    Filed: October 11, 2013
    Publication date: October 22, 2015
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Youichirou Mansei, Kouji YAMAZAKI, Tomoyuki nakamura, Satoshi OHKAWA, Kazuo AIZU, Katsunori HAYASHI, Kenichi SHINYA, Junichi IMAIZUMI, Hiroaki TAKAHASHI
  • Adhesive composition and adhesive film using the same
    Patent number: 8697244
    Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: April 15, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigehiro Nakamura, Toshihiko Itou, Youichirou Mansei
  • Flexible multilayer wiring board
    Patent number: 8232476
    Abstract: It is an object of the present invention to provide a flexible multilayer wiring board that can be easily reduced in thickness and that also has sufficient durability against repeated bending or heat shock. A preferred mode of the flexible multilayer wiring board comprises a flexible inner layer board obtained by forming an inner layer wiring on both sides of an insulating layer, an outer layer wiring situated on at least one side of the inner layer board, and insulating adhesive sheets lying between the inner layer board and outer layer wiring. One of the insulating adhesive sheets are composed of an imide group-containing polymer.
    Type: Grant
    Filed: February 20, 2008
    Date of Patent: July 31, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigehiro Nakamura, Toshihiko Itou, Masayoshi Joumen, Youichirou Mansei
  • ADHESIVE COMPOSITION AND ADHESIVE FILM USING THE SAME
    Publication number: 20100240821
    Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.
    Type: Application
    Filed: May 20, 2008
    Publication date: September 23, 2010
    Inventors: Shigehiro Nakamura, Toshihiko Itou, Youichirou Mansei
  • FLEXIBLE MULTILAYER WIRING BOARD
    Publication number: 20100084169
    Abstract: It is an object of the present invention to provide a flexible multilayer wiring board that can be easily reduced in thickness and that also has sufficient durability against repeated bending or heat shock. A preferred mode of the flexible multilayer wiring board comprises a flexible inner layer board obtained by forming an inner layer wiring on both sides of an insulating layer, an outer layer wiring situated on at least one side of the inner layer board, and insulating adhesive sheets lying between the inner layer board and outer layer wiring. One of the insulating adhesive sheets are composed of an imide group-containing polymer.
    Type: Application
    Filed: February 20, 2008
    Publication date: April 8, 2010
    Inventors: Shigehiro Nakamura, Toshihiko Itou, Masayoshi Joumen, Youichirou Mansei