Patents by Inventor Youji MATSUBARA

Youji MATSUBARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMAGING ELEMENT PACKAGE AND METHOD OF MANUFACTURING IMAGING ELEMENT PACKAGE
    Publication number: 20230005975
    Abstract: An imaging element package according to the present disclosure includes a circuit board, an imaging element substrate, and a light-transmissive substrate. The imaging element substrate is stacked on the circuit board. The light-transmissive substrate is stacked on the imaging element substrate via a void by an adhesive member provided on the peripheral edge of the light receiving surface of the imaging element substrate, and has higher heat resistance than the imaging element substrate. The imaging element package further includes a frame-shaped frame body stacked on the circuit board. The imaging element substrate and the light-transmissive substrate are housed in a region surrounded by the frame body.
    Type: Application
    Filed: December 2, 2020
    Publication date: January 5, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kei FUSENO, Takashi KIMURA, Shohei TAKEKUMA, Youji MATSUBARA