Patents by Inventor You Jin CHOI

You Jin CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240080320
    Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 7, 2024
    Inventors: You Jin KIM, Jung Woo CHOI, Jenog Ryeol CHOI, Joong Seon KIM, Hong Chan YUN, Ju Ho CHUNG, Do Hyun YOUN, Hyung Min KIM, Hyun Ok CHOI, Chun Ho KIM, Soo Beom KIM, Min Jeong KIM, Chang Oh HEO, Eun Soo HEO
  • Publication number: 20240079642
    Abstract: The present invention relates to a method for preparing an alkali metal ion conductive chalcogenide-based solid electrolyte, a solid electrolyte prepared thereby, and an all-solid-state battery comprising the same.
    Type: Application
    Filed: January 11, 2022
    Publication date: March 7, 2024
    Applicant: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yoon Cheol HA, Sang Min LEE, Byung Gon KIM, Gum Jae PARK, Jun Woo PARK, Jun Ho PARK, Ji Hyun YU, Won Jae LEE, You Jin LEE, Hae Young CHOI
  • Publication number: 20230170923
    Abstract: Disclosed according to an embodiment is a communications module comprising: a first substrate having a first hole formed herein; a communications unit including a second substrate and a plurality of elements disposed on one side of the second substrate; and a heat sink disposed on the other side of the second substrate, wherein a peripheral region of the second substrate is disposed so as to vertically overlap with the periphery of the first hole of the first substrate. Accordingly, the communications module can realize an optimized heat dissipation structure in which the communications unit and the heat sink are in contact with each other on the substrate by using a thermally conductive member as a medium.
    Type: Application
    Filed: June 15, 2021
    Publication date: June 1, 2023
    Inventors: Sang Hoon SHIN, You Jin CHOI
  • Patent number: 11302558
    Abstract: An apparatus for processing a substrate includes a housing having a processing space therein, a transfer robot that loads the substrate into the processing space or unloads the substrate from the processing space, a support unit including a chuck that supports the substrate in the processing space and a lift pin that moves the substrate in an up-down direction, a dielectric plate having a lower surface disposed to face an upper surface of the chuck, and a gap measurement unit that measures a gap between the dielectric plate and the substrate supported by the lift pin or a gap between the dielectric plate and the chuck.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: April 12, 2022
    Assignee: PSK INC.
    Inventors: Jong Chan Lee, Min Ho Choi, You Jin Choi, Da In Kim
  • Publication number: 20220051922
    Abstract: An apparatus for processing a substrate includes a housing having a processing space therein, a transfer robot that loads the substrate into the processing space or unloads the substrate from the processing space, a support unit including a chuck that supports the substrate in the processing space and a lift pin that moves the substrate in an up-down direction, a dielectric plate having a lower surface disposed to face an upper surface of the chuck, and a gap measurement unit that measures a gap between the dielectric plate and the substrate supported by the lift pin or a gap between the dielectric plate and the chuck.
    Type: Application
    Filed: August 24, 2020
    Publication date: February 17, 2022
    Inventors: Jong Chan LEE, Min Ho CHOI, You Jin CHOI, Da In KIM
  • Publication number: 20210108086
    Abstract: The disclosed embodiment relates to a display apparatus that improves the coating method of a display apparatus and a manufacturing method thereof. In accordance with one aspect of the disclosure, a display apparatus includes a display panel configured to display an image and a frame coupled to surround the outside of the display panel, and the frame includes a base member, an upper coating layer coated on the upper part of the base member, a lower coating layer coated on the lower surface of the base member. According to the disclosed embodiment, cracks can be prevented from occurring during slitting, and excessive camber and twisting can be prevented.
    Type: Application
    Filed: December 21, 2018
    Publication date: April 15, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Soo KIM, You Jin CHOI
  • Publication number: 20200363677
    Abstract: Disclosed embodiment provides a display apparatus including a polysiloxane layer formed by using a polysiloxane containing a pigment on the surface of an aluminum oxide layer of a display apparatus chassis. A display apparatus according to an embodiment includes: a display panel; and a chassis disposed on the outside of the display panel, and the chassis includes an aluminum oxide layer; and a polysiloxane layer disposed on the aluminum oxide layer, on its surface.
    Type: Application
    Filed: September 6, 2018
    Publication date: November 19, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin Soo KIM, You Jin CHOI
  • Patent number: D916893
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Min Lee, Hee- Jin Ko, You-Jin Choi
  • Patent number: D916894
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Min Lee, Hee-Jin Ko, You-Jin Choi