Patents by Inventor YouJoung Choi

YouJoung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
    Publication number: 20240128201
    Abstract: A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: HunTeak Lee, Gwang Kim, Junho Ye, YouJoung Choi, MinKyung Kim, Yongwoo Lee, Namgu Kim
  • Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation
    Patent number: 11894314
    Abstract: A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: February 6, 2024
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: HunTeak Lee, Gwang Kim, Junho Ye, YouJoung Choi, MinKyung Kim, Yongwoo Lee, Namgu Kim
  • Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
    Publication number: 20230081706
    Abstract: A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: HunTeak Lee, Gwang Kim, Junho Ye, YouJoung Choi, MinKyung Kim, Yongwoo Lee, Namgu Kim