Patents by Inventor Youko Nishiwaki

Youko Nishiwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
    Patent number: 6261671
    Abstract: The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: July 17, 2001
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Yoshitaka Ono, Masato Kawade, Kouta Noda, Youko Nishiwaki
  • Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
    Patent number: 6248428
    Abstract: Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: June 19, 2001
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Yoshitaka Ono, Masato Kawade, Kouta Noda, Youko Nishiwaki