Patents by Inventor Youlin Jin
Youlin Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230409093Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.Type: ApplicationFiled: September 6, 2023Publication date: December 21, 2023Inventors: John Aguirre, Youlin Jin, Ralph Remsburg, Guillermo Padin Rohena, Evan Francis Rynk, Carlos Julio Suate Pedroza, Gary Quartana, Jr., Bradley Fraser, Haney Awad, William Wheeler, Shigeru Natsume
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Patent number: 11797065Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.Type: GrantFiled: December 18, 2020Date of Patent: October 24, 2023Assignee: MAGIC LEAP, INC.Inventors: John Aguirre, Youlin Jin, Ralph Remsburg, Guillermo Padin Rohena, Evan Francis Rynk, Carlos Julio Suate Pedroza, Gary Quartana, Jr., Bradley Fraser, Haney Awad, William Wheeler, Shigeru Natsume
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Publication number: 20210240236Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.Type: ApplicationFiled: December 18, 2020Publication date: August 5, 2021Inventors: John Aguirre, Youlin Jin, Ralph Remsburg, Guillermo Padin Rohena, Evan Francis Rynk, Carlos Julio Suate Pedroza, Gary Quartana, JR., Bradley Fraser, Haney Awad, William Wheeler, Shigeru Natsume
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Patent number: 10871806Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.Type: GrantFiled: May 29, 2018Date of Patent: December 22, 2020Assignee: Magic Leap, Inc.Inventors: John Aguirre, Youlin Jin, Ralph Remsburg, Guillermo Padin Rohena, Evan Francis Rynk, Carlos Julio Suate Pedroza, Gary Quartana, Jr., Bradley Fraser, Haney Awad, William Wheeler, Shigeru Natsume
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Publication number: 20180348826Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.Type: ApplicationFiled: May 29, 2018Publication date: December 6, 2018Inventors: John Aguirre, Youlin Jin, Ralph Remsburg, Guillermo Padin Rohena, Evan Francis Rynk, Carlos Julio Suate Pedroza, Gary Quartana, JR., Bradley Fraser, Haney Awad, William Wheeler, Shigeru Natsume
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Patent number: 9961800Abstract: Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.Type: GrantFiled: October 20, 2014Date of Patent: May 1, 2018Assignee: Huawei Technologies Co., Ltd.Inventors: Youlin Jin, Taqing Feng
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Patent number: 9196564Abstract: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.Type: GrantFiled: April 17, 2013Date of Patent: November 24, 2015Assignee: Futurewei Technologies, Inc.Inventors: Vadim Gektin, Youlin Jin
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Publication number: 20150034271Abstract: Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.Type: ApplicationFiled: October 20, 2014Publication date: February 5, 2015Inventors: Youlin Jin, Taqing Feng
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Publication number: 20140262449Abstract: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.Type: ApplicationFiled: April 17, 2013Publication date: September 18, 2014Applicant: FutureWei Technologies, Inc.Inventors: Vadim Gektin, Youlin Jin
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Patent number: 8767391Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.Type: GrantFiled: August 27, 2012Date of Patent: July 1, 2014Assignee: Futurewei Technologies, Inc.Inventors: Youlin Jin, Jiye Xu, Vadim Gektin
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Publication number: 20140055951Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.Type: ApplicationFiled: August 27, 2012Publication date: February 27, 2014Applicant: FUTUREWEI TECHNOLOGIES, INC.Inventors: Youlin Jin, Jiye Xu, Vadim Gektin