Patents by Inventor Youmin Yu

Youmin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240203820
    Abstract: A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. The substrate includes at least one dielectric layer and a plurality of interconnects.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 20, 2024
    Inventors: Youmin YU, Wei WU, Guoping XU, Nader NIKFAR
  • Publication number: 20190139852
    Abstract: A semiconductor package includes a substrate, a die coupled to the substrate, the die being smaller in size than the substrate and placed on top of the substrate, a mold formed around and over the die, the mold having a top surface and a mold volume, wherein the mold includes at least one of thermally conductive fin and pillar formed within the mold volume to enhance heat transfer within the package, and a film layer formed over the top surface of the mold volume. The mold includes a plurality of grooves and holes formed above and around the die, and a thermally conductive material is filled into the grooves and holes forming at least one of thermally conductive fin and pillar within the mold volume.
    Type: Application
    Filed: November 6, 2017
    Publication date: May 9, 2019
    Inventors: Youmin YU, Nader NIKFAR, Ryan LANE
  • Patent number: 9417017
    Abstract: A method is provided for heat transfer from a surface to a fluid. The method includes directing a first fluid flow towards the surface in a first direction and directing a second fluid flow towards the surface in a second direction. The first and second fluid flows cooperate to cool the surface.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 16, 2016
    Assignee: Thermal Corp.
    Inventors: Anthony Ciulla, Nelson Gernert, Mark T. North, Donald Wood, Smita Agrawal, Tianhong Cui, Longzhong Huang, Vinnee Bharathi A. Selvi, Terrence W. Simon, Taiho Yeom, Youmin Yu, Min Zhang, Congshun Wang, Xuelin Zhu, Tao Zhang
  • Patent number: 9329646
    Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: May 3, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Victor Adrian Chiriac, Youmin Yu, Dexter Tamio Chun, Stephen Arthur Molloy
  • Publication number: 20150268704
    Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.
    Type: Application
    Filed: March 20, 2014
    Publication date: September 24, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Victor Adrian Chiriac, Youmin Yu, Dexter Tamio Chun, Stephen Arthur Molloy
  • Publication number: 20140060783
    Abstract: A method is provided for heat transfer from a surface to a fluid. The method includes directing a first fluid flow towards the surface in a first direction and directing a second fluid flow towards the surface in a second direction. The first and second fluid flows cooperate to cool the surface.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 6, 2014
    Inventors: Anthony Ciulla, Nelson Gernert, Mark T. North, Donald Wood, Smita Agrawal, Tianhong Cui, Longzhong Huang, Vinnee Bharathi A. Selvi, Terrence W. Simon, Taiho Yeom, Youmin Yu, Min Zhang, Congshun Wang, Xuelin Zhu, Tao Zhang