Patents by Inventor Youn Baek JEONG
Youn Baek JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11977269Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: GrantFiled: November 28, 2022Date of Patent: May 7, 2024Assignee: LG INNOTEK CO., LTD.Inventor: Youn Baek Jeong
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Publication number: 20230358996Abstract: A lens assembly can include: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module. The conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.Type: ApplicationFiled: July 11, 2023Publication date: November 9, 2023Inventor: Youn Baek JEONG
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Patent number: 11782329Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.Type: GrantFiled: October 27, 2022Date of Patent: October 10, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Sang Ok Park, Tae Young Kim, Hyun Ah Oh, Youn Baek Jeong
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Patent number: 11740429Abstract: A lens assembly can include: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module. The conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.Type: GrantFiled: January 14, 2021Date of Patent: August 29, 2023Assignee: LG INNOTEK CO., LTD.Inventor: Youn Baek Jeong
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Publication number: 20230091927Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: ApplicationFiled: November 28, 2022Publication date: March 23, 2023Inventor: Youn Baek Jeong
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Publication number: 20230070041Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.Type: ApplicationFiled: October 27, 2022Publication date: March 9, 2023Inventors: Sang Ok PARK, Tae Young KIM, Hyun Ah OH, Youn Baek JEONG
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Patent number: 11536931Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: GrantFiled: August 23, 2019Date of Patent: December 27, 2022Assignee: LG INNOTEK CO., LTD.Inventor: Youn Baek Jeong
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Patent number: 11513424Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.Type: GrantFiled: March 8, 2021Date of Patent: November 29, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Sang Ok Park, Tae Young Kim, Hyun Ah Oh, Youn Baek Jeong
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Publication number: 20210191234Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.Type: ApplicationFiled: March 8, 2021Publication date: June 24, 2021Inventors: Sang Ok PARK, Tae Young KIM, Hyun Ah OH, Youn Baek JEONG
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Publication number: 20210173173Abstract: The present embodiment relates to a lens assembly comprising: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module, wherein the conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.Type: ApplicationFiled: January 14, 2021Publication date: June 10, 2021Inventor: Youn Baek JEONG
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Patent number: 10969659Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.Type: GrantFiled: November 1, 2017Date of Patent: April 6, 2021Assignee: LG INNOTEK CO., LTD.Inventors: Sang Ok Park, Tae Young Kim, Hyun Ah Oh, Youn Baek Jeong
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Patent number: 10921545Abstract: The present embodiment relates to a lens assembly comprising: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module, wherein the conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.Type: GrantFiled: January 6, 2017Date of Patent: February 16, 2021Assignee: LG INNOTEK CO., LTD.Inventor: Youn Baek Jeong
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Publication number: 20210018818Abstract: An embodiment comprises: a lens barrel moving in the direction of the optical axis; a holder disposed below the lens barrel and having a seating portion recessed in the top surface thereof; a filter disposed on the bottom surface of the seating portion of the holder; a blocking member disposed on the upper surface of the filter; and an image sensor disposed below the filter, wherein the seating portion includes an inner side surface facing the side surface of the filter, the inner side surface of the seating portion includes a first surface and a second surface located below the first surface, the separation distance from the first surface to the side surface of the filter is greater than the separation distance from the second surface to the side surface of the filter, and the thickness of the filter is greater than the separation distance from the second surface to the side surface of the filter.Type: ApplicationFiled: March 18, 2019Publication date: January 21, 2021Applicant: LG INNOTEK CO., LTD.Inventors: Won Jun CHA, Youn Baek JEONG, Ji Yoon HONG
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Publication number: 20190377156Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: ApplicationFiled: August 23, 2019Publication date: December 12, 2019Inventor: Youn Baek Jeong
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Patent number: 10437007Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: GrantFiled: January 11, 2016Date of Patent: October 8, 2019Assignee: LG Innotek Co., Ltd.Inventor: Youn Baek Jeong
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Publication number: 20190258141Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.Type: ApplicationFiled: November 1, 2017Publication date: August 22, 2019Inventors: SANG OK PARK, TAE YOUNG KIM, HYUN AH OH, YOUN BAEK JEONG
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Publication number: 20190033553Abstract: The present embodiment relates to a lens assembly comprising: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module, wherein the conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.Type: ApplicationFiled: January 6, 2017Publication date: January 31, 2019Inventor: YOUN BAEK JEONG
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Publication number: 20170363838Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.Type: ApplicationFiled: January 11, 2016Publication date: December 21, 2017Inventor: Youn Baek Jeong
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Patent number: 9531933Abstract: Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.Type: GrantFiled: November 2, 2015Date of Patent: December 27, 2016Assignee: LG Innotek Co., Ltd.Inventors: Hyun Ah Oh, Youn Baek Jeong, Se Jin Lee
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Publication number: 20160057327Abstract: Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.Type: ApplicationFiled: November 2, 2015Publication date: February 25, 2016Applicant: LG INNOTEK CO., LTD.Inventors: Hyun Ah OH, Youn Baek JEONG, Se Jin LEE