Patents by Inventor Youn Chul Kim

Youn Chul Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210177796
    Abstract: The present invention relates to a pharmaceutical composition for preventing or treating inflammatory diseases and a food for preventing or alleviating inflammatory diseases, both of which contain curvularin-type metabolites as an active ingredient and, more specifically to a pharmaceutical composition for preventing or treating inflammatory diseases and a food for preventing or alleviating inflammatory diseases, both of which contain, as an active ingredient, marine fungus Penicillium sp. SF-5859-derived curvularin-type metabolites. A pharmaceutical composition, according to the present invention, for preventing or treating inflammatory diseases, containing curvularin-type metabolites derived from marine fungus Penicillium sp. SF-5859 (KCTC 13354 BP) inhibits the production of proinflammatory cytokines and mediators, thereby being effectively usable for the prevention or treatment of inflammatory diseases.
    Type: Application
    Filed: February 28, 2018
    Publication date: June 17, 2021
    Inventors: Joung Han YIM, Il-Chan KIM, Se Jong HAN, Ui Joung YOUN, Hyun Cheol OH, Youn-Chul KIM, Jae Hak SOHN, Minh Ha TRAN, Wonmin KO, Seung Jun LEE, Jae-Young SON
  • Patent number: 10059804
    Abstract: There is provided a novel polymer including a repeating unit expressed as a following formula 1: where each of R1 and R2 independently represents an alkylene group with 2 to 6 carbon atoms, and each of n and m independently represents 10 to 10,000.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: August 28, 2018
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Ji Heung Kim, Bich Ngoc Tran, Youn Chul Kim
  • Publication number: 20170088680
    Abstract: There is provided a novel polymer including a repeating unit expressed as a following formula 1: where each of R1 and R2 independently represents an alkylene group with 2 to 6 carbon atoms, and each of n and m independently represents 10 to 10,000.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 30, 2017
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Ji Heung KIM, Bich Ngoc TRAN, Youn Chul KIM
  • Patent number: 9421668
    Abstract: Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: August 23, 2016
    Assignees: EHWA DIAMOND INDUSTRIAL CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seh Kwang Lee, Youn Chul Kim, Joo Han Lee, Jae Kwang Choi, Jae Phil Boo
  • Patent number: 9314901
    Abstract: This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: April 19, 2016
    Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Seh Kwang Lee, Youn Chul Kim, Joo Han Lee, Jae Kwang Choi, Jae Phil Boo
  • Publication number: 20150140900
    Abstract: Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.
    Type: Application
    Filed: June 7, 2012
    Publication date: May 21, 2015
    Applicants: SAMSUNG ELECTRONICS CO., LTD., EHWA DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Seh Kwang Lee, Youn Chul Kim, Joo Han Lee, Jae Kwang Choi, Jae Phil Boo
  • Publication number: 20140094101
    Abstract: This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.
    Type: Application
    Filed: May 15, 2012
    Publication date: April 3, 2014
    Applicants: SAMSUNG ELECTRONICS CO., LTD., EHWA DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Seh Kwang Lee, Youn Chul Kim, Joo Han Lee, Jae Kwang Choi, Jae Phil Boo
  • Publication number: 20130344779
    Abstract: The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a soft pad, and a method of manufacturing the same, wherein the conditioner can be used under CMP conditions using a slurry having a small amount of polishing particles, and/or a porous pad having comparatively low hardness and very high porosity.
    Type: Application
    Filed: March 7, 2012
    Publication date: December 26, 2013
    Applicant: EHWA DIAMOND INDUSTRIAL. CO., LTD.
    Inventors: Seh Kwang Lee, Youn Chul Kim, Joo Han Lee, Jong Jae Lee
  • Patent number: 7223751
    Abstract: The present invention relates to a novel sulfonamide derivatives and novel intermediates thereof, preparation thereof, and a pharmaceutical composition comprising the same, and more particularly, to novel sulfonamide derivatives and intermediates thereof that are used as angiogenesis controlling material and that can inhibit overexpression of matrix metalloproteinase that decomposes protein constituents in extracellular and basement membranes of connective tissues, and preparation methods thereof, and a pharmaceutical composition comprising the same.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: May 29, 2007
    Assignee: Kolon Ind. Inc.
    Inventors: Yong-Jun Chung, Kyeong-Ho Lee, Youn-Chul Kim, Ho-Jin Park
  • Publication number: 20040142047
    Abstract: The present invention relates to a Korean Acanthopanax Senticosus extract, a protein extract and crude protein polysaccharide derived therefrom, and an immuno-regulating composition comprising the same as an ative ingredient and the use thereof, and more particularly to a Korean Acanthopanax Senticosus extract and a protein extract and crude protein polysaccharide derived therefrom, which are have effective in increasing immunity and have superior anti-allergy effects and thus can be used as an active ingredient for functional foods, cosmetics, and pharmaceutical compositions, and as an immuno-regulating compositoin comprising the same as an active ingredient and the use thereof.
    Type: Application
    Filed: November 17, 2003
    Publication date: July 22, 2004
    Inventors: Taek-Joon Yoon, Kyeong-Ho Lee, Woo-Moon Park, Youn-Chul Kim, Ho-Jin Park
  • Publication number: 20040138206
    Abstract: The present invention relates to a novel sulfonamide derivatives and novel intermediates thereof, preparation thereof, and a pharmaceutical composition comprising the same, and more particularly, to novel sulfonamide derivatives and intermediates thereof that are used as angiogenesis controlling material and that can inhibit overexpression of matrix metalloproteinase that decomposes protein constituents in extracellular and basement membranes of connective tissues, and preparation methods thereof, and a pharmaceutical composition comprising the same.
    Type: Application
    Filed: December 11, 2003
    Publication date: July 15, 2004
    Inventors: Yong-Jun Chung, Kyeong-Ho Lee, Youn-Chul Kim, Ho-Jin Park
  • Patent number: 6638153
    Abstract: The invention relates to a diamond saw blade which is made by attaching improved undercut preventing tips, produced by diffusing and joining cobalt-based powder onto ultra hard tips at a high temperature, to respective shank slot walls formed on the circumference of a diamond saw blade by means of laser welding in order to remove drawbacks of high cost or insecurity with the conventional art.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: October 28, 2003
    Assignee: Ehwa Diamond Ind. Co. Ltd.
    Inventors: Chang Hyun Lee, Youn Chul Kim
  • Publication number: 20030166606
    Abstract: Disclosed is a new fluorocystosine and derivatives thereof. The fluorocystosine and derivatives thereof provide a pharmaceutical composition exhibiting better anti-cancer characteristics than the conventional composition.
    Type: Application
    Filed: January 26, 2003
    Publication date: September 4, 2003
    Inventors: Kwan-Hee Kim, Youn-Chul Kim, Ji-Young Kim, Kyeong-Ho Lee, Moon-Jong Noh, Young-Seok Park, Sung-Min Cho, Ho-Jin Park
  • Patent number: 6478021
    Abstract: The present invention relates to a saw blade for preventing undercut wherein out of the sludge discharging slots arranged together with undercutting segments and ordinary cutting segments on the circumference of a steel wheel, those slots located behind the undercutting segments are dimensioned larger or wider than the slots behind the ordinary cutting segments in order to prevent the breakage and falling-off of the undercut preventing segments and ordinary cutting segments.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: November 12, 2002
    Inventors: Youn Chul Kim, So Young Yoon
  • Publication number: 20020115399
    Abstract: The invention relates to a diamond saw blade which is made by attaching improved undercut preventing tips, produced by diffusing and joining cobalt-based powder onto ultra hard tips at a high temperature, to respective shank slot walls formed on the circumference of a diamond saw blade by means of laser welding in order to remove drawbacks of high cost or insecurity with the conventional art.
    Type: Application
    Filed: June 22, 2001
    Publication date: August 22, 2002
    Inventors: Chang Hyun Lee, Youn Chul Kim
  • Patent number: D458619
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: June 11, 2002
    Assignee: EHWA Diamond Ind. Co., Ltd.
    Inventors: Chang Hyun Lee, Youn Chul Kim