Patents by Inventor Youn-kwon Jung

Youn-kwon Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing printed circuit board
    Patent number: 9173300
    Abstract: A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: October 27, 2015
    Assignee: HAESUNG DS CO., LTD
    Inventors: Jeong-Hoon Seol, Youn-Kwon Jung, Sang-Kun Kim
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20130313009
    Abstract: A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.
    Type: Application
    Filed: September 5, 2012
    Publication date: November 28, 2013
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventors: Jeong-Hoon Seol, Youn-Kwon Jung, Sang-Kun Kim
  • METHOD AND APPARATUS FOR MANUFACTURING MULTI-LAYER SUBSTRATE
    Publication number: 20100000675
    Abstract: Provided are a method and apparatus for manufacturing a multi-layer substrate. The method includes: rolling out a base substrate that is rolled up into a substrate supply roll and delivering the base substrate to a compression roller system; compressing and laminating a laminating material on the base substrate in a vacuum state using the compression roller system; and cooling the base substrate on which the laminating material is laminated.
    Type: Application
    Filed: May 14, 2009
    Publication date: January 7, 2010
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Deok-heung Kim, Dong-kwan Won, Sang-min Lee, Min-woo Lee, Youn-kwon Jung