Patents by Inventor Youn Kyu Choi
Youn Kyu Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12272767Abstract: An embodiment discloses an ultraviolet light emitting element including: a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and an etched region in which the first conductive semiconductor layer is exposed; a first insulating layer disposed on the light emitting structure and including a first hole which exposes a portion of the etched region; a first electrode electrically connected to the first conductive semiconductor layer; and a second electrode electrically connected to the second conductive semiconductor layer, wherein the light emitting structure includes an intermediate layer regrown on the first conductive semiconductor layer exposed in the first hole, the first electrode is disposed on the intermediate layer, the etched region includes a first etched region disposed at an inner side and a second etched region dispType: GrantFiled: May 11, 2023Date of Patent: April 8, 2025Assignee: Photon Wave Co., Ltd.Inventors: Youn Joon Sung, Seung Kyu Oh, Jae Bong So, Gil Jun Lee, Won Ho Kim, Tae Wan Kwon, Eric Oh, Il Gyun Choi, Jin Young Jung
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Patent number: 11037721Abstract: A power inductor includes a substrate having a through hole in a central portion thereof; a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole; a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof; a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode.Type: GrantFiled: May 2, 2018Date of Patent: June 15, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Youn Kyu Choi, Hea Ah Kim, Jae Yeol Choi
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Publication number: 20180247755Abstract: A power inductor includes a substrate having a through hole in a central portion thereof; a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole; a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof; a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode.Type: ApplicationFiled: May 2, 2018Publication date: August 30, 2018Inventors: Youn Kyu CHOI, Hea Ah KIM, Jae Yeol CHOI
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Publication number: 20180182538Abstract: A coil component includes a winding type coil having at least one lead terminal and a body covering the coil and including a magnetic material and a conductive resin applied to an end portion of the lead terminal. An electrode is on the body and connected to the lead terminal and to the conductive resin.Type: ApplicationFiled: September 27, 2017Publication date: June 28, 2018Inventor: Youn Kyu CHOI
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Patent number: 9984812Abstract: A power inductor includes a substrate having a through hole in a central portion thereof; a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole; a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof; a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode.Type: GrantFiled: December 29, 2015Date of Patent: May 29, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Youn Kyu Choi, Hea Ah Kim, Jae Yeol Choi
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Patent number: 9875839Abstract: A magnetic composition includes: coarse powder containing a non-crystalline iron-based material; medium powder containing a crystalline iron-based material; and fine powder containing nickel. A ratio of the coarse powder and the medium powder is in a range of 65:35 to 80:20, and the amount of the fine powder is in a range of 3 wt % to 7 wt % on the basis of a total weight of the coarse powder and the medium powder.Type: GrantFiled: January 19, 2016Date of Patent: January 23, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Youn Kyu Choi, Mi Jung Kang, Hea Ah Kim, Yun Young Yang, Jae Yeol Choi
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Patent number: 9704640Abstract: There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.Type: GrantFiled: May 6, 2015Date of Patent: July 11, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Youn Kyu Choi, Hye Ah Kim, Yun Young Yang, Mi Jung Kang, Jae Yeol Choi
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Patent number: 9659704Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.Type: GrantFiled: October 16, 2015Date of Patent: May 23, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yun Young Yang, Youn Kyu Choi, Hye Ah Kim, Do Won Kang, Mi Jung Kang
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Publication number: 20160217902Abstract: A magnetic composition includes: coarse powder containing a non-crystalline iron-based material; medium powder containing a crystalline iron-based material; and fine powder containing nickel. A ratio of the coarse powder and the medium powder is in a range of 65:35 to 80:20, and the amount of the fine powder is in a range of 3 wt % to 7 wt % on the basis of a total weight of the coarse powder and the medium powder.Type: ApplicationFiled: January 19, 2016Publication date: July 28, 2016Inventors: Youn Kyu CHOI, Mi Jung KANG, Hea Ah KIM, Yun Young YANG, Jae Yeol CHOI
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Publication number: 20160217920Abstract: A power inductor includes a substrate having a through hole in a central portion thereof; a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole; a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof; a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode.Type: ApplicationFiled: December 29, 2015Publication date: July 28, 2016Inventors: Youn Kyu CHOI, Hea Ah KIM, Jae Yeol CHOI
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Patent number: 9370743Abstract: A carbon dioxide adsorbent may include a complex oxide including barium and titanium, wherein the complex oxide has a perovskite crystalline structure and is represented by the general formula BaxTiyOz, and an atomic ratio of Ba/Ti ranges from about 0.95 to about 1.7. The carbon dioxide adsorbent may be included in a carbon dioxide capture module. The carbon dioxide adsorbent may also be used in a method of separating carbon dioxide.Type: GrantFiled: September 13, 2013Date of Patent: June 21, 2016Assignees: Samsung Electronics Co., Ltd, Samsung Electro-Mechanics Co., Ltd.Inventors: Soon Chul Kwon, Ji Ho Park, Hyuk Jae Kwon, Yun Jung Park, Hyun Chul Lee, Youn-Kyu Choi
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Publication number: 20160126004Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.Type: ApplicationFiled: October 16, 2015Publication date: May 5, 2016Inventors: Yun Young YANG, Youn Kyu CHOI, Hye Ah KIM, Do Won KANG, Mi Jung KANG
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Publication number: 20160086716Abstract: There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.Type: ApplicationFiled: May 6, 2015Publication date: March 24, 2016Inventors: Youn Kyu CHOI, Hye Ah KIM, Yun Young YANG, Mi Jung KANG, Jae Yeol CHOI
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Publication number: 20140174292Abstract: A carbon dioxide adsorbent may include a complex oxide including barium and titanium, wherein the complex oxide has a perovskite crystalline structure and is represented by the general formula BaxTiyOz, and an atomic ratio of Ba/Ti ranges from about 0.95 to about 1.7. The carbon dioxide adsorbent may be included in a carbon dioxide capture module. The carbon dioxide adsorbent may also be used in a method of separating carbon dioxide.Type: ApplicationFiled: September 13, 2013Publication date: June 26, 2014Applicants: SAMSUNG FINE CHEMICALS CO., LTD., SAMSUNG ELECTRONICS CO., LTD.Inventors: Soon Chul KWON, Ji Ho PARK, Hyuk Jae KWON, Yun Jung PARK, Hyun Chul LEE, Youn-Kyu CHOI
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Patent number: 7229035Abstract: Disclosed herein is a method of deagglomerating ceramic powder to inhibit agglomeration and provide a uniform particle size, a deagglomeration mill used for the above method, and a method of preparing uniformly mixed ceramic slurry using the deagglomerated ceramic powder. The deagglomeration method of the ceramic powder includes loading a mixture of ceramic powder and solvent into the deagglomeration mill which includes a hollow cylindrical mill cover having a diameter larger than a length and having a plurality of beads therein; rotating an impeller of a main shaft disposed longitudinally at an internal center portion of the mill cover at a peripheral velocity of 6–10 m/s, using a driving means; deagglomerating the ceramic powder by the action of beads which are moved by a rotational force of the impeller; and discharging the mixture of ceramic powder and solvent from the deagglomeration mill.Type: GrantFiled: December 29, 2004Date of Patent: June 12, 2007Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eun Sang Na, Hyeon Pyo Jeon, Dong Hwan Seo, Youn Kyu Choi, Sung Hyung Kang