Abstract: This invention is about a Ceramic Heater which comprises a built-in heating unit circuit and a built-in separate temperature sensor circuit, wherein precision circuit printing technology and layering technology are used, and which is manufactured by means of cofiring process. This invention is featured by a first circuit board, a heating circuit in certain patterns on the top side of the aforesaid first board, a sensor circuit positioned between the patterns of the heating circuit, and a second board which is layered over the aforesaid first board.

Abstract: The present invention relates to a package structure which is formed by coupling a sintered ceramic base substrate to a ceramic frame, and a sensor module using the package structure. The package structure comprises a frame made of ceramic or plastic material, a groove being formed at an end portion of the frame on the sintered ceramic substrate side; one or more sintered ceramic substrates provided with electrodes; and a bonding means made of glass material or organic bonding material, for bonding the sintered ceramic substrate and the frame.