Abstract: The present invention relates to a substrate liquid processing apparatus which etches and cleans a substrate for a semiconductor. The substrate liquid processing apparatus comprises: a substrate supporting unit for supporting a substrate to be spaced apart from an upper portion of a table so that a surface to be processed faces a lower side; a rotational driving unit for driving a rotation axis which rotates the table; and a processing liquid supplying unit for supplying, in a processing space between the table and the substrate, processing liquid that is in a mist state in which a gas is mixed or processing liquid that is in a steam state. According to the substrate liquid processing apparatus, it is possible to uniformize an atmosphere of the processing space between the substrate and the table, and to uniformly spray the processing liquid on the surface to be processed.