Patents by Inventor Youn-Sung Ko
Youn-Sung Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240089124Abstract: Disclosed herein are an apparatus and method for mutual authentication of quantum entities based on Measurement-Device-Independent Quantum Key Distribution (MDI-QKD). The method may include configuring a quantum input form based on an authentication key shared in advance with a counterpart entity, applying polarization modulation to the configured quantum input form, transmitting the quantum input form to which polarization modulation is applied to a quantum measurement device, and authenticating the counterpart entity by checking whether the counterpart entity configures a quantum input form according to the shared authentication key using a measurement result and information about polarization modulation.Type: ApplicationFiled: March 24, 2023Publication date: March 14, 2024Inventors: Chang-Ho HONG, Se-Wan JI, O-Sung KWON, Youn-Chang JEONG, Eun-Ji KIM, Seok KIM, Haeng-Seok KO, Dae-Sung KWON, Jin-Gak JANG
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Publication number: 20240009747Abstract: According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.Type: ApplicationFiled: July 4, 2023Publication date: January 11, 2024Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI, GEUNSIK AHN
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Patent number: 11810890Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.Type: GrantFiled: April 22, 2021Date of Patent: November 7, 2023Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Geunsik Ahn
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Publication number: 20230093905Abstract: Provided is a conductive ball mounting method using an electrostatic chuck. According to the conductive ball mounting method using an electrostatic chuck, when the process of mounting conductive balls onto a substrate through mounting grooves formed in the mask is performed, the occurrence of process defects can be prevented and conductive balls having very small sizes can be effectively mounted on the substrate. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting conductive balls can be performed with high quality by preventing deformation of the mask without missing of some of the conductive balls. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting small sizes of conductive balls on the substrate can be effectively performed.Type: ApplicationFiled: December 1, 2022Publication date: March 30, 2023Applicant: PROTEC CO., LTD.Inventors: Youn Sung KO, Yoshiaki YUKIMORI
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Publication number: 20220052019Abstract: A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.Type: ApplicationFiled: November 1, 2021Publication date: February 17, 2022Applicant: PROTEC CO., LTD.Inventors: YOUN SUNG KO, GEUNSIK AHN
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Publication number: 20210335748Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.Type: ApplicationFiled: April 22, 2021Publication date: October 28, 2021Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, GEUNSIK AHN
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Patent number: 10804239Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.Type: GrantFiled: March 22, 2019Date of Patent: October 13, 2020Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Yoshiaki Yukimori
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Patent number: 10804240Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.Type: GrantFiled: March 27, 2019Date of Patent: October 13, 2020Assignee: PROTEC CO., LTD.Inventors: Youn Sung Ko, Yoshiaki Yukimori
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Publication number: 20200144219Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.Type: ApplicationFiled: March 22, 2019Publication date: May 7, 2020Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI
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Publication number: 20200144220Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.Type: ApplicationFiled: March 27, 2019Publication date: May 7, 2020Applicant: PROTEC CO., LTD.Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI
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Publication number: 20150279716Abstract: Provided are an apparatus and method for detaching a chip, in which a semiconductor chip attached to a tape is detached so as to supply and mount the semiconductor chip on a package or a circuit board. Accordingly, a semiconductor chip may be effectively detached from a tape while minimizing an impact transferred to the semiconductor chip.Type: ApplicationFiled: March 27, 2015Publication date: October 1, 2015Inventor: YOUN SUNG KO
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Publication number: 20100037445Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.Type: ApplicationFiled: October 22, 2009Publication date: February 18, 2010Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youn-sung Ko, Hak-kyoon Byun, Jung-hwan Woo, Hyun-jung Song
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Patent number: 7650687Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.Type: GrantFiled: June 16, 2005Date of Patent: January 26, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
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Patent number: 7624498Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.Type: GrantFiled: May 30, 2007Date of Patent: December 1, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Youn-sung Ko, Hak-kyoon Byun, Jung-hwan Woo, Hyun-jung Song
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Patent number: 7481351Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.Type: GrantFiled: August 30, 2004Date of Patent: January 27, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim
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Publication number: 20080090311Abstract: A dipping detecting device used in the fabrication of semiconductor devices. The dipping detecting device includes a gripper used as a conductive first electrode and configured to pick up a semiconductor device in order to dip the semiconductor device into a dipping solution. A conductor used as a second electrode and formed at a side of the gripper. The conductor electrically insulated from the gripper. A power source unit applying a power to the gripper and the conductor and detecting a current flow, wherein a dipping state of the semiconductor device is detected depending on the flow of current.Type: ApplicationFiled: September 20, 2007Publication date: April 17, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-joo ROH, Yong-kyun SUN, Youn-sung KO
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Publication number: 20070293022Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.Type: ApplicationFiled: May 30, 2007Publication date: December 20, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youn-sung KO, Hak-kyoon BYUN, Jung-hwan WOO, Hyun-jung SONG
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Publication number: 20070277128Abstract: In one embodiment of a system for sensing the shape of a chip, a support plate is provided that preferably includes at least one chip mounted thereon. A lower lighting unit is preferably disposed below the support plate to emit light through the support plate and around or between the chip(s) toward an optical sensing unit, with a portion of the light emitted being blocked by the opaque chip(s). The optical sensing unit preferably senses the light that passes through the support plate and around or between the chip(s), but not the light that is blocked by the chip(s). In this manner, the shape of the chip can be more accurately determined, even when it is deformed within an acceptable range. A method for using a system constructed according to the principles of the present invention is also provided.Type: ApplicationFiled: May 22, 2007Publication date: November 29, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-Chul HAN, Jung-Hwan WOO, Youn-Sung KO
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Publication number: 20060266792Abstract: A multi-chip die bonder may include a first substrate conveyor conveying a substrate in a first direction and a second substrate conveyor conveying a substrate in a second direction. A plurality of dies may be stacked onto the substrate while the substrate is circulating the first substrate conveyor and the second substrate conveyor. A first heater may be provided in a die bonding unit and a second heater may be provided in the first substrate conveyor. An adhesive curing process may be performed together with a die attaching process.Type: ApplicationFiled: October 24, 2005Publication date: November 30, 2006Inventors: Youn-Sung Ko, Choo-Ho Kim, Hyun-Ho Kim, Yong-Kyun Sun, Byung-Joon Lee, Il-Sup Choi, Jung-Hwan Woo
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Publication number: 20060048381Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.Type: ApplicationFiled: June 16, 2005Publication date: March 9, 2006Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko