Patents by Inventor Youn-Sung Ko

Youn-Sung Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220052019
    Abstract: A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.
    Type: Application
    Filed: November 1, 2021
    Publication date: February 17, 2022
    Applicant: PROTEC CO., LTD.
    Inventors: YOUN SUNG KO, GEUNSIK AHN
  • Publication number: 20210335748
    Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.
    Type: Application
    Filed: April 22, 2021
    Publication date: October 28, 2021
    Applicant: PROTEC CO., LTD.
    Inventors: Youn Sung Ko, GEUNSIK AHN
  • Patent number: 10804239
    Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: October 13, 2020
    Assignee: PROTEC CO., LTD.
    Inventors: Youn Sung Ko, Yoshiaki Yukimori
  • Patent number: 10804240
    Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: October 13, 2020
    Assignee: PROTEC CO., LTD.
    Inventors: Youn Sung Ko, Yoshiaki Yukimori
  • Publication number: 20200144219
    Abstract: Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.
    Type: Application
    Filed: March 22, 2019
    Publication date: May 7, 2020
    Applicant: PROTEC CO., LTD.
    Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI
  • Publication number: 20200144220
    Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.
    Type: Application
    Filed: March 27, 2019
    Publication date: May 7, 2020
    Applicant: PROTEC CO., LTD.
    Inventors: Youn Sung Ko, YOSHIAKI YUKIMORI
  • Publication number: 20150279716
    Abstract: Provided are an apparatus and method for detaching a chip, in which a semiconductor chip attached to a tape is detached so as to supply and mount the semiconductor chip on a package or a circuit board. Accordingly, a semiconductor chip may be effectively detached from a tape while minimizing an impact transferred to the semiconductor chip.
    Type: Application
    Filed: March 27, 2015
    Publication date: October 1, 2015
    Inventor: YOUN SUNG KO
  • Publication number: 20100037445
    Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
    Type: Application
    Filed: October 22, 2009
    Publication date: February 18, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youn-sung Ko, Hak-kyoon Byun, Jung-hwan Woo, Hyun-jung Song
  • Patent number: 7650687
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: January 26, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Patent number: 7624498
    Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: December 1, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn-sung Ko, Hak-kyoon Byun, Jung-hwan Woo, Hyun-jung Song
  • Patent number: 7481351
    Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: January 27, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim
  • Publication number: 20080090311
    Abstract: A dipping detecting device used in the fabrication of semiconductor devices. The dipping detecting device includes a gripper used as a conductive first electrode and configured to pick up a semiconductor device in order to dip the semiconductor device into a dipping solution. A conductor used as a second electrode and formed at a side of the gripper. The conductor electrically insulated from the gripper. A power source unit applying a power to the gripper and the conductor and detecting a current flow, wherein a dipping state of the semiconductor device is detected depending on the flow of current.
    Type: Application
    Filed: September 20, 2007
    Publication date: April 17, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-joo ROH, Yong-kyun SUN, Youn-sung KO
  • Publication number: 20070293022
    Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
    Type: Application
    Filed: May 30, 2007
    Publication date: December 20, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youn-sung KO, Hak-kyoon BYUN, Jung-hwan WOO, Hyun-jung SONG
  • Publication number: 20070277128
    Abstract: In one embodiment of a system for sensing the shape of a chip, a support plate is provided that preferably includes at least one chip mounted thereon. A lower lighting unit is preferably disposed below the support plate to emit light through the support plate and around or between the chip(s) toward an optical sensing unit, with a portion of the light emitted being blocked by the opaque chip(s). The optical sensing unit preferably senses the light that passes through the support plate and around or between the chip(s), but not the light that is blocked by the chip(s). In this manner, the shape of the chip can be more accurately determined, even when it is deformed within an acceptable range. A method for using a system constructed according to the principles of the present invention is also provided.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 29, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Chul HAN, Jung-Hwan WOO, Youn-Sung KO
  • Publication number: 20060266792
    Abstract: A multi-chip die bonder may include a first substrate conveyor conveying a substrate in a first direction and a second substrate conveyor conveying a substrate in a second direction. A plurality of dies may be stacked onto the substrate while the substrate is circulating the first substrate conveyor and the second substrate conveyor. A first heater may be provided in a die bonding unit and a second heater may be provided in the first substrate conveyor. An adhesive curing process may be performed together with a die attaching process.
    Type: Application
    Filed: October 24, 2005
    Publication date: November 30, 2006
    Inventors: Youn-Sung Ko, Choo-Ho Kim, Hyun-Ho Kim, Yong-Kyun Sun, Byung-Joon Lee, Il-Sup Choi, Jung-Hwan Woo
  • Publication number: 20060048381
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Application
    Filed: June 16, 2005
    Publication date: March 9, 2006
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Publication number: 20050133563
    Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.
    Type: Application
    Filed: August 30, 2004
    Publication date: June 23, 2005
    Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim