Patents by Inventor Youn-Yong LEE

Youn-Yong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9194035
    Abstract: A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 24, 2015
    Assignees: SAMSUNG DISPLAY CO., LTD., YMC CO., LTD.
    Inventors: Kyung Il Park, Keun-Ik Jeon, Sang-Su Kim, Youn-Yong Lee
  • Publication number: 20130001077
    Abstract: A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicants: YMC, CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Kyung Il PARK, Keun-Ik JEON, Sang-Su KIM, Youn-Yong LEE