Patents by Inventor Younes Attaiyan

Younes Attaiyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6563405
    Abstract: A micro-resonator ferrite microstrip coupling filter that has reduced susceptibility to variations in the manufacturing process, as well as from changes due to mechanical or environmental stress, and allows for an assembly process that can be easily automated. The filter comprises bottom and top substrates with conductive ground planes on one side of the substrates and microstrip conductors on the other side of the substrates, with the conductors of both substrates being orthogonal to each other. A circuit block is disposed between the bottom and top substrates such that the circuit block contacts the sides of the substrates containing microstrip conductors. Multiple YIG spheres are inserted into round orifices on the circuit block and positioned between the bottom and top substrates. A magnetic field is applied orthogonally to the conductors.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: May 13, 2003
    Assignee: Microsource, Inc.
    Inventors: Brian Scott, John R. Dunseth, Younes Attaiyan
  • Publication number: 20020196105
    Abstract: A micro-resonator ferrite microstrip coupling filter that has reduced susceptibility to variations in the manufacturing process, as well as from changes due to mechanical or environmental stress, and allows for an assembly process that can be easily automated. The filter comprises bottom and top substrates with conductive ground planes on one side of the substrates and microstrip conductors on the other side of the substrates, with the conductors of both substrates being orthogonal to each other. A circuit block is disposed between the bottom and top substrates such that the circuit block contacts the sides of the substrates containing microstrip conductors. Multiple YIG spheres are inserted into round orifices on the circuit block and positioned between the bottom and top substrates. A magnetic field is applied orthogonally to the conductors.
    Type: Application
    Filed: June 21, 2001
    Publication date: December 26, 2002
    Inventors: Brian Scott, John R. Dunseth, Younes Attaiyan