Abstract: An electronic component includes: a body including a stack structure formed of a plurality of dielectric layers and internal electrodes alternately stacked with the dielectric layers interposed therebetween; and an external electrode disposed outside the body, connected to the internal electrode, and including conductive metal and glass, in which the external electrode includes a first electrode layer connected to the internal electrode and a second electrode layer disposed on the first electrode layer, an area proportion of the glass of the first electrode layer is greater than that of the glass of the second electrode layer, and a thickness of the second electrode layer is 6 ?m or more.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes disposed to oppose each other with the dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and including a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles, wherein the first conductive particles are plate-shaped conductive particles having a coating layer formed on a surface thereof, and wherein the coating layer includes Si, and an Si content is 0.3 at % or more and 2.0 at % or less, as compared to the plate-shaped conductive particles.

Abstract: An electronic component includes: a body including a stack structure formed of a plurality of dielectric layers and internal electrodes alternately stacked with the dielectric layers interposed therebetween; and an external electrode disposed outside the body, connected to the internal electrode, and including conductive metal and glass, in which the external electrode includes a first electrode layer connected to the internal electrode and a second electrode layer disposed on the first electrode layer, an area proportion of the glass of the first electrode layer is greater than that of the glass of the second electrode layer, and a thickness of the second electrode layer is 6 ?m or more.

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a longitudinal direction, and including a capacitance formation portion having a dielectric layer and first and second internal electrodes disposed to be stacked in the thickness direction with the dielectric layer interposed therebetween; first and second conductive layers disposed on the fifth and sixth surfaces of the ceramic body, respectively, and each including a first conductive metal; and first and second external electrodes each including a second conductive metal and covering the first and second conductive layers, respectively. The first and second conductive layers each have a network structure.

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a longitudinal direction, and including a capacitance formation portion having a dielectric layer and first and second internal electrodes disposed to be stacked in the thickness direction with the dielectric layer interposed therebetween; first and second conductive layers disposed on the fifth and sixth surfaces of the ceramic body, respectively, and each including a first conductive metal; and first and second external electrodes each including a second conductive metal and covering the first and second conductive layers, respectively. The first and second conductive layers each have a network structure.

Abstract: Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: There are provided a method of fabricating a thin metal film electrode and a thin metal film electrode fabricated by the same. The method of fabricating a thin metal film electrode according to an embodiment of the present invention includes applying a metal paste including a metal powder and a dispersant to a substrate to form a thin metal film; and subjecting the thin metal film to reduction firing in an atmosphere containing an organic acid and an aqueous solution in a ratio ranging from 10:90 to 90:10.

Abstract: The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.

Abstract: There are provided a solar cell and a method of manufacturing the same. The solar cell includes: a solar cell unit absorbing sunlight to generate electricity; a surface treatment layer formed on at least one of upper and lower surfaces of the solar cell unit by a condensation reaction of a compound having a functional group —Y having a lone pair and an alkoxy group —OR; and a metal electrode layer bonded to the functional group —Y having the lone pair of the surface treatment layer. The solar cell has excellent energy conversion efficiency.

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: It relates to a method for treating the surface of a printed circuit board resin and a printed circuit board resin treated thereby. The method may allows forming fine circuit patterns and improving the adhesive strength between metal patterns and the printed circuit board resin as well.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention can include: forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing, heating and sintering the circuit pattern, and transferring the circuit pattern on an insulation layer by stacking the carrier on the insulation layer such that the circuit pattern is buried in the insulation layer. In accordance with an embodiment of the present invention, a minute, precise circuit pattern can be formed through inkjet printing, and adhesion between the circuit pattern and the insulation layer can be improved.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes providing a base substrate in which a thermoplastic resin layer is formed; forming a circuit pattern on the thermoplastic resin layer by discharging a conductive ink by an inkjet method; curing the circuit pattern through the heating at a temperature that is lower than a melting point of the thermoplastic resin layer; sintering the circuit pattern through the heating; and burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer, can provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern can be formed by an inkjet method and the adhesive force between the circuit pattern and the base substrate can be improved.

Abstract: The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.

Abstract: Disclosed are methods of forming a printed circuit pattern and forming a guide, and a guide-forming ink. The method of forming a printed circuit pattern in accordance with the present invention includes forming a guide by using guide-forming ink having a slip property, curing the formed guide by in-situ UV, and forming a printed circuit pattern on the inside of the cured guide by using metal ink.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method, which includes forming a base pattern over one side of a negative photoresist, exposing the one side, attaching an insulation layer on the one side, developing the negative photoresist such that the base pattern is uncovered, and forming a circuit pattern over the base pattern, can increase the thickness of the circuit pattern and strengthen the adhesion between the circuit pattern and the insulation layer.