Patents by Inventor Young-chai Heo

Young-chai Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FOLDING TYPE PACKAGE
    Publication number: 20130200092
    Abstract: A folding type package includes a body including first and second parts to face each other when the body is folded to enclose a product, at least one product housing part formed at the body, and a buffer part extending from the product housing part to secure a buffer space to buffer a shock applied to the product.
    Type: Application
    Filed: August 9, 2012
    Publication date: August 8, 2013
    Applicant: Samsung Eletronics Co., Ltd
    Inventors: Dong-jun KIM, In-hye Kim, Jung-hyeon Kim, Young-chai Heo