Patents by Inventor Young Chal PARK

Young Chal PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9313918
    Abstract: A cooling device for an electronic machine includes an airflow channel through which external air passes, an air inlet duct through which external air is introduced and which is disposed at an upper front surface of the airflow channel and extends perpendicularly to the airflow channel, a blower fan disposed in the air inlet duct to draw in external air through the air inlet duct, an air outlet duct disposed at a lower portion of the airflow channel to discharge air from the airflow channel, and a heat-radiating unit disposed to the rear of a circuit board mounted with electronic components on a front surface thereof to absorb heat from the circuit board. The heat-radiating unit is located, apart from the blower fan, in the airflow channel. Through the improved cooling airflow structure, cooling efficiency is increased, noise is reduced and continuous cooling operation is achieved.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: April 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wook Jin Lee, Sung Tae Kim, Yong Ho Lee, Young Chal Park, Se Hoon Shin
  • Publication number: 20140118940
    Abstract: A cooling device for an electronic machine includes an airflow channel through which external air passes, an air inlet duct through which external air is introduced and which is disposed at an upper front surface of the airflow channel and extends perpendicularly to the airflow channel, a blower fan disposed in the air inlet duct to draw in external air through the air inlet duct, an air outlet duct disposed at a lower portion of the airflow channel to discharge air from the airflow channel, and a heat-radiating unit disposed to the rear of a circuit board mounted with electronic components on a front surface thereof to absorb heat from the circuit board. The heat-radiating unit is located, apart from the blower fan, in the airflow channel. Through the improved cooling airflow structure, cooling efficiency is increased, noise is reduced and continuous cooling operation is achieved.
    Type: Application
    Filed: October 25, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wook Jin Lee, Sung Tae Kim, Yong Ho Lee, Young Chal Park, Se Hoon Shin
  • Publication number: 20120312043
    Abstract: A heat pump that uses solar heat as an evaporation heat source of a refrigerant. The heat pump includes a solar heat collector, a compressor to compress a refrigerant, a first heat exchanger to condense the refrigerant compressed by the compressor and to perform heat exchange between the condensed refrigerant and water, a second heat exchanger to perform heat exchange between the refrigerant having passed through the first heat exchanger and heat collected by the solar heat collector, a third heat exchanger to perform heat exchange between the refrigerant having passed through the first heat exchanger and external air, and a first flow channel switching valve to allow the refrigerant having passed through the first heat exchanger to selectively flow to the second heat exchanger or the third heat exchanger therethrough.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 13, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Rock Hee KIM, Tae Hun LIM, Chang Soo LIM, Young Chal PARK