Patents by Inventor Youngcheol Kim
Youngcheol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240021566Abstract: A semiconductor device has a semiconductor die with a sensitive area. A dam wall is formed over the semiconductor die proximate to the sensitive area. In one embodiment, the dam wall has a vertical segment and side wings. The dam wall can have a plurality of rounded segments integrated with a plurality of vertical segments as a unitary body. Alternatively, the dam wall has a plurality of separate vertical segments arranged in two or more overlapping rows. A plurality of conductive posts is formed over the semiconductor die. An electrical component is disposed over the semiconductor die. The semiconductor die and electrical component are disposed over a substrate. An insulating layer is formed over the substrate outside the dam wall. An underfill material is deposited between the semiconductor die and substrate. The dam wall and insulating layer inhibit the underfill material from contacting any portion of the sensitive area.Type: ApplicationFiled: July 15, 2022Publication date: January 18, 2024Applicant: STATS ChipPAC Pte. Ltd.Inventors: WooSoon Kim, JoonYoung Choi, YoungCheol Kim, KyungOe Kim
-
Publication number: 20230420382Abstract: A semiconductor device has a substrate. A first electrical component and second electrical component are disposed over the substrate. A conductive pillar is formed over the substrate between the first electrical component and second electrical component. A first shielding layer is formed over the first electrical component and conductive pillar by jet printing conductive material. A second shielding layer is formed over the first electrical component and second electrical component by sputtering, spraying, or plating conductive material. An insulating layer is optionally formed between the first shielding layer and second shielding layer by jet printing insulating material over the first shielding layer.Type: ApplicationFiled: June 24, 2022Publication date: December 28, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: ChangOh Kim, JinHee Jung, YoungCheol Kim
-
Publication number: 20230352359Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.Type: ApplicationFiled: June 29, 2023Publication date: November 2, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: TaeKeun Lee, Youngcheol Kim, Youngmin Kim, Yongmin Kim
-
Publication number: 20230343720Abstract: A semiconductor device has a substrate and a first electrical component disposed over a first surface of the substrate. An RF antenna interposer is disposed over the substrate with the first electrical component connected to a first antenna disposed on a surface of the antenna interposer. An area of the antenna interposer is substantially the same as an area of the substrate. The first antenna disposed on the surface of the antenna interposer has a plurality of islands of conductive material. Alternatively, the first antenna disposed on the surface of the antenna interposer has a spiral shape of conductive material. A second antenna can be disposed on the surface of the antenna interposer connected to a second electrical component disposed over the substrate. A second electrical component can be disposed over a second surface of the substrate opposite the first surface of the substrate.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: NamJu Cho, YoungCheol Kim, HaengCheol Choi
-
Patent number: 11770046Abstract: An electric motor including a tension member is proposed. The electric motor includes the tension member installed therein and composed of step parts stacked in multiple steps, so that structural strength and structural robustness are improved.Type: GrantFiled: December 21, 2021Date of Patent: September 26, 2023Assignee: KEYANG ELECTRIC MACHINERY CO., LTD.Inventors: Hoecheon Kim, Youngcheol Kim, Gun Ho Lee
-
Patent number: 11735489Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.Type: GrantFiled: June 16, 2021Date of Patent: August 22, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: TaeKeun Lee, Youngcheol Kim, Youngmin Kim, Yongmin Kim
-
Patent number: 11735530Abstract: A semiconductor device has a substrate and a first electrical component disposed over a first surface of the substrate. An RF antenna interposer is disposed over the substrate with the first electrical component connected to a first antenna disposed on a surface of the antenna interposer. An area of the antenna interposer is substantially the same as an area of the substrate. The first antenna disposed on the surface of the antenna interposer has a plurality of islands of conductive material. Alternatively, the first antenna disposed on the surface of the antenna interposer has a spiral shape of conductive material. A second antenna can be disposed on the surface of the antenna interposer connected to a second electrical component disposed over the substrate. A second electrical component can be disposed over a second surface of the substrate opposite the first surface of the substrate.Type: GrantFiled: August 25, 2021Date of Patent: August 22, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: NamJu Cho, YoungCheol Kim, HaengCheol Choi
-
Publication number: 20230179068Abstract: Proposed is a motor having a flux ring in which the flux ring is fastened to a flux ring fastening part formed along the circumferential surface of a yoke.Type: ApplicationFiled: February 16, 2022Publication date: June 8, 2023Inventors: Hoecheon KIM, Youngcheol KIM
-
Publication number: 20230125546Abstract: A semiconductor device has an interposer. A first semiconductor die with a photonic portion is disposed over the interposer. The photonic portion extends outside a footprint of the interposer. The interposer and first semiconductor die are disposed over a substrate. An encapsulant is deposited between the interposer and substrate. The photonic portion remains exposed from the encapsulant.Type: ApplicationFiled: October 27, 2021Publication date: April 27, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: KyungOe Kim, YoungCheol Kim, HeeSoo Lee
-
Publication number: 20230067475Abstract: A semiconductor device has a substrate and a first electrical component disposed over a first surface of the substrate. An RF antenna interposer is disposed over the substrate with the first electrical component connected to a first antenna disposed on a surface of the antenna interposer. An area of the antenna interposer is substantially the same as an area of the substrate. The first antenna disposed on the surface of the antenna interposer has a plurality of islands of conductive material. Alternatively, the first antenna disposed on the surface of the antenna interposer has a spiral shape of conductive material. A second antenna can be disposed on the surface of the antenna interposer connected to a second electrical component disposed over the substrate. A second electrical component can be disposed over a second surface of the substrate opposite the first surface of the substrate.Type: ApplicationFiled: August 25, 2021Publication date: March 2, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: NamJu Cho, YoungCheol Kim, HaengCheol Choi
-
Publication number: 20220406675Abstract: A semiconductor device has an electrical component and a first TIM with a first compliant property is disposed over a surface of the electrical component. A second TIM having a second compliant property greater than the first compliant property is disposed over the surface of the electrical component within the first TIM. A third TIM can be disposed over the surface of the electrical component along the first TIM. A heat sink is disposed over the first TIM and second TIM. The second TIM has a shape of a star pattern, grid of dots, parallel lines, serpentine, or concentric geometric shapes. The first TIM provides adhesion for joint reliability and the second TIM provides stress relief. Alternatively, a heat spreader is disposed over the first TIM and second TIM and a heat sink is disposed over a third TIM and fourth TIM on the heat spreader.Type: ApplicationFiled: June 16, 2021Publication date: December 22, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: TaeKeun Lee, Youngcheol Kim, Youngmin Kim, Yongmin Kim
-
Publication number: 20220384361Abstract: A semiconductor device has a substrate and a plurality of bond wires is disposed in a pattern across on the substrate. The pattern of bond wires can be a plurality of rows of bond wires. A plurality of electrical components is disposed over the substrate as an SIP module. An encapsulant is deposited over the substrate, electrical components, and bond wire. An opening is formed in the encapsulant extending to the bond wire. The opening can be a trench extending across the bond wires disposed on the substrate, or a plurality of openings individually exposing each of a plurality of bond wires. A conductive material is disposed in the opening. A shielding layer is formed over the encapsulant and in contact with the conductive material. The shielding layer, conductive material, and bond wires reduce the effects of EMI, RFI, and other inter-device interference.Type: ApplicationFiled: August 11, 2022Publication date: December 1, 2022Applicant: STATS ChipPAC Pte. Ltd.Inventors: YoungCheol Kim, ChoonHeung Lee, WonGyou Kim
-
Patent number: 11450618Abstract: A semiconductor device has a substrate and a plurality of bond wires is disposed in a pattern across on the substrate. The pattern of bond wires can be a plurality of rows of bond wires. A plurality of electrical components is disposed over the substrate as an SIP module. An encapsulant is deposited over the substrate, electrical components, and bond wire. An opening is formed in the encapsulant extending to the bond wire. The opening can be a trench extending across the bond wires disposed on the substrate, or a plurality of openings individually exposing each of a plurality of bond wires. A conductive material is disposed in the opening. A shielding layer is formed over the encapsulant and in contact with the conductive material. The shielding layer, conductive material, and bond wires reduce the effects of EMI, RFI, and other inter-device interference.Type: GrantFiled: September 25, 2020Date of Patent: September 20, 2022Assignee: STATS ChipPAC Pte. Ltd.Inventors: YoungCheol Kim, ChoonHeung Lee, WonGyou Kim
-
Publication number: 20220209622Abstract: An electric motor including a tension member is proposed. The electric motor includes the tension member installed therein and composed of step parts stacked in multiple steps, so that structural strength and structural robustness are improved.Type: ApplicationFiled: December 21, 2021Publication date: June 30, 2022Inventors: Hoecheon Kim, Youngcheol Kim, GUN HO LEE
-
Publication number: 20210225778Abstract: A semiconductor device has a substrate and a plurality of bond wires is disposed in a pattern across on the substrate. The pattern of bond wires can be a plurality of rows of bond wires. A plurality of electrical components is disposed over the substrate as an SIP module. An encapsulant is deposited over the substrate, electrical components, and bond wire. An opening is formed in the encapsulant extending to the bond wire. The opening can be a trench extending across the bond wires disposed on the substrate, or a plurality of openings individually exposing each of a plurality of bond wires. A conductive material is disposed in the opening. A shielding layer is formed over the encapsulant and in contact with the conductive material. The shielding layer, conductive material, and bond wires reduce the effects of EMI, RFI, and other inter-device interference.Type: ApplicationFiled: September 25, 2020Publication date: July 22, 2021Applicant: STATS ChipPAC Pte. Ltd.Inventors: YoungCheol Kim, ChoonHeung Lee, WonGyou Kim
-
Publication number: 20170361768Abstract: Disclosed herein is a portable emergency sign device for a vehicle. The portable emergency sign device includes a box-shaped case body, a main laser oscillator, and a reflector. The box-shaped case body provides an installation space therein. The main laser oscillator is installed within the case body, and radiates laser light adapted to display the location region of a vehicle in trouble. The reflector is installed to be selectively projected out of and accommodated within the case body, and reflects the laser light, radiated by the main laser oscillator, onto a road surface.Type: ApplicationFiled: July 8, 2016Publication date: December 21, 2017Inventor: Youngcheol KIM
-
Patent number: 9125332Abstract: A semiconductor package includes a semiconductor die with a plurality of solder bumps formed on bump pads. A substrate has a plurality of contact pads each with an exposed sidewall. A solder resist is disposed opening over at least a portion of each contact pad. The solder bumps are reflowed to metallurgically and electrically connect to the contact pads. Each contact pad is sized according to a design rule defined by SRO+2*SRR?2X, where SRO is the solder resist opening, SRR is a solder registration for the manufacturing process, and X is a function of a thickness of the exposed sidewall of the contact pad. The value of X ranges from 5 to 20 microns. The solder bump wets the exposed sidewall of the contact pad and substantially fills an area adjacent to the exposed sidewall. The contact pad can be made circular, rectangular, or donut-shaped.Type: GrantFiled: June 10, 2010Date of Patent: September 1, 2015Assignee: STATS ChipPAC, Ltd.Inventors: Rajendra D. Pendse, Youngcheol Kim, TaeKeun Lee, GuiChea Na, GwangJin Kim
-
Patent number: 8841782Abstract: An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.Type: GrantFiled: August 14, 2008Date of Patent: September 23, 2014Assignee: STATS ChipPAC Ltd.Inventors: DaeWook Yang, Youngcheol Kim, Tae Keun Lee
-
Patent number: 8604602Abstract: A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling stacking interconnects on the component side; and forming an integrated circuit receptacle, for receiving an integrated circuit device, by molding a reinforced encapsulant on the component side and exposing a portion of the stacking interconnects.Type: GrantFiled: May 11, 2010Date of Patent: December 10, 2013Assignee: Stats Chippac Ltd.Inventors: Seng Guan Chow, Il Kwon Shim, Heap Hoe Kuan, Youngcheol Kim
-
Patent number: 8481371Abstract: A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.Type: GrantFiled: May 20, 2011Date of Patent: July 9, 2013Assignee: STATS Chippac Ltd.Inventors: Youngcheol Kim, Myung Kil Lee, Gwang Kim, Koo Hong Lee