Patents by Inventor Young-Chun Chu

Young-Chun Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136316
    Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
  • Publication number: 20110305230
    Abstract: A Worldwide Interoperability for Microwave Access (WiMAX) integrated network server is disclosed. The WiMAX integrated network server is integrally includes an Access Service Network Gateway (ASN-GW), an Authentication Authorization Accounting (AAA) connected to the ASN-GW, and a Home Agent (HA). The ASN-GW follows the WiMAX standard, manages a mobile station connected to a base station, and provides connection paths connected to a network. The AAA authenticates the mobile station to be connected to the network. The HA provides a Mobile IP service to guarantee the mobility of the mobile station. The WiMAX integrated network server includes a separate data processing unit, which makes it possible to rapidly process data. The WiMAX integrated network server can independently manage communication among the mobile stations connected thereto, separately from an external network. The WiMAX integrated network server does not require additional equipment, which reduces the installation space and costs.
    Type: Application
    Filed: March 15, 2011
    Publication date: December 15, 2011
    Applicants: LANBIRD TECHNOLOGY CO., LTD, SK TELESYS., CO. LTD
    Inventors: Young-Ki Yoon, Jung-Goo Lee, Kyo-Sang Oh, Young-Chun Chu, Young-Beom Kwon, Yong Soon Kang