Patents by Inventor Young Chung KIM

Young Chung KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079336
    Abstract: Provided is a semiconductor package. The semiconductor package includes a redistribution line structure comprising a plurality of redistribution line patterns; a first semiconductor chip and a second semiconductor chip on the redistribution line structure and spaced apart from each other; a bridge structure between the first semiconductor chip, the second semiconductor chip, and the redistribution line structure and comprising a plurality of connection wiring patterns configured to electrically connect the first semiconductor chip to the second semiconductor chip; and a molding layer surrounding a sidewall of the bridge structure and filled between the first semiconductor chip, the second semiconductor chip, and the redistribution line structure and between the first semiconductor chip and the second semiconductor chip, wherein lowermost surfaces of the plurality of connection wiring patterns are above uppermost surfaces of the plurality of redistribution line patterns.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyun CHUNG, Young Lyong Kim, In Hyo Hwang
  • Patent number: 10194784
    Abstract: A linear member delivery device for the endoscope includes: a nozzle including an inlet, an outlet, and an insertion path; a fitting portion fitted to an endoscope; a holding portion configured to hold a linear member; and a switching portion configured to connect the fitting portion and the nozzle such that a crossing angle of an opening of the endoscope and a center axis of the nozzle can be switched to a plurality of angles in a state that the fitting portion is fitted to the endoscope.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: February 5, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Hideto Onishi, Tomokazu Iwasaki, Young Chung Kim
  • Patent number: 9827067
    Abstract: A linear member transfer apparatus includes: a linear member housing portion having a bottomed cylindrical shape and including: a bottom portion; an opening; a side wall; a restriction portion that is a diaphragm disposed on a position at a predetermined distance from the bottom portion and that has an inner diameter smaller than an inner diameter of the bottom portion; a first chamber configured to house a linear member in a wound state; and a second chamber configured to house the linear member in an extended state; a transfer portion configured to transfer the linear member; and a guide.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: November 28, 2017
    Assignee: OLYMPUS CORPORATION
    Inventors: Tomokazu Iwasaki, Hideto Onishi, Akihisa Ogawa, Masahiko Tomita, Young Chung Kim
  • Publication number: 20170273544
    Abstract: A linear member delivery device for the endoscope includes: a nozzle including an inlet, an outlet, and an insertion path; a fitting portion fitted to an endoscope; a holding portion configured to hold a linear member; and a switching portion configured to connect the fitting portion and the nozzle such that a crossing angle of an opening of the endoscope and a center axis of the nozzle can be switched to a plurality of angles in a state that the fitting portion is fitted to the endoscope.
    Type: Application
    Filed: June 12, 2017
    Publication date: September 28, 2017
    Applicant: OLYMPUS CORPORATION
    Inventors: Hideto ONISHI, Tomokazu IWASAKI, Young Chung KIM
  • Publication number: 20170239016
    Abstract: A linear member transfer apparatus includes: a linear member housing portion having a bottomed cylindrical shape and including: a bottom portion; an opening; a side wall; a restriction portion that is a diaphragm disposed on a position at a predetermined distance from the bottom portion and that has an inner diameter smaller than an inner diameter of the bottom portion; a first chamber configured to house a linear member in a wound state; and a second chamber configured to house the linear member in an extended state; a transfer portion configured to transfer the linear member; and a guide.
    Type: Application
    Filed: May 11, 2017
    Publication date: August 24, 2017
    Applicant: OLYMPUS CORPORATION
    Inventors: Tomokazu IWASAKI, Hideto ONISHI, Akihisa OGAWA, Masahiko TOMITA, Young Chung KIM