Patents by Inventor Youngchyel Lee

Youngchyel Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package test system and semiconductor package fabrication method using the same
    Patent number: 11592478
    Abstract: A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: February 28, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaehong Kim, Se-Hyun Seo, Hyungil Kim, Sangjae Rhee, Youngchyel Lee
  • SEMICONDUCTOR PACKAGE TEST SYSTEM AND SEMICONDUCTOR PACKAGE FABRICATION METHOD USING THE SAME
    Publication number: 20220026488
    Abstract: A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.
    Type: Application
    Filed: June 2, 2021
    Publication date: January 27, 2022
    Inventors: Jaehong Kim, Se-Hyun Seo, Hyungil Kim, Sangjae Rhee, Youngchyel Lee