Abstract: A semiconductor package may include vertically-stacked semiconductor chips and first, second, and third connection terminals connecting the semiconductor chips to each other. Each of the semiconductor chips may include a semiconductor substrate, an interconnection layer on the semiconductor substrate, penetration electrodes connected to the interconnection layer through the semiconductor substrate, and first, second, and third groups on the interconnection layer. The interconnection layer may include an insulating layer and first and second metal layers in the insulating layer. The first and second groups may be in contact with the second metal layer, and the third group may be spaced apart from the second metal layer. Each of the first and third groups may include pads connected to a corresponding one of the first and third connection terminals in a many-to-one manner. The second group may include pads connected to the second connection terminal in a one-to-one manner.

Abstract: Provided are a novel polypeptide having endolysin activity, a fusion protein comprising the polypeptide and an antibiotic active protein, and an antibiotic use against a gram-negative pathogen of the polypeptide and/or fusion protein and/or a use for prevention and/or treatment of gram-negative pathogen infection and/or disease or symptoms related to gram negative pathogen infection.

Abstract: This application relates to an adsorption desalination system using a multi-effect evaporator apparatus. In one aspect, the system includes a multi-effect evaporator apparatus producing high-temperature vapor and low-temperature vapor, a plurality of reaction units including an adsorbent adsorbing or desorbing moisture from the high-temperature vapor and low-temperature vapor and a heat exchange tube transferring heat to the adsorbent. The system may also include a condenser condensing vapor containing moisture desorbed from the adsorbents, and cold-hot water lines selectively supplying chilled water and hot water to the heat exchange tubes.

Abstract: A heat radiation device includes a semiconductor substrate. A first electrode is disposed on the semiconductor substrate. A second electrode is disposed on the semiconductor substrate and is spaced apart from the first electrode. A first through electrode is disposed in the semiconductor substrate. The first through electrode is electrically connected to the first electrode.

Abstract: An electronic device includes a substrate, a first electronic product arranged on the substrate, a second electronic product arranged on the substrate to be spaced apart from the first electronic product, and a heat dissipating assembly covering the first and second electronic products, the heat dissipating assembly comprising a heat dissipating chamber including a hermetically sealed space having a first portion having one or more gaps in which a flowable heat dissipation fluid is disposed and having a second portion in which a solid thermal conductive member is disposed to prevent the flow of the heat dissipation fluid across the second portion with respect to a plan view, wherein the first portion of the heat dissipating chamber has a first thermal conductivity and overlaps with the first electronic product in the plan view, wherein the solid thermal conductive member has a second thermal conductivity less than the first thermal conductivity, wherein the solid thermal conductive member overlaps with the se

Abstract: A heat radiation device includes a semiconductor substrate. A first electrode is disposed on the semiconductor substrate. A second electrode is disposed on the semiconductor substrate and is spaced apart from the first electrode. A first through electrode is disposed in the semiconductor substrate. The first through electrode is electrically connected to the first electrode.

Abstract: An electronic device includes a substrate, a first electronic product arranged on the substrate, a second electronic product arranged on the substrate to be spaced apart from the first electronic product, and a heat dissipating assembly covering the first and second electronic products, the heat dissipating assembly comprising a heat dissipating chamber including a hermetically sealed space having a first portion having one or more gaps in which a flowable heat dissipation fluid is disposed and having a second portion in which a solid thermal conductive member is disposed to prevent the flow of the heat dissipation fluid across the second portion with respect to a plan view, wherein the first portion of the heat dissipating chamber has a first thermal conductivity and overlaps with the first electronic product in the plan view, wherein the solid thermal conductive member has a second thermal conductivity less than the first thermal conductivity, wherein the solid thermal conductive member overlaps with the se

Abstract: A semiconductor device includes a semiconductor package and a mark. The semiconductor package includes a semiconductor chip including a hot spot from which heat is generated, and a mold layer encapsulating the semiconductor chip. The mark is disposed on the semiconductor package. The mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot.

Abstract: A package substrate may include an insulating substrate, internal circuits and a warpage-suppressing member. The insulating substrate may have a plurality of mount regions in which semiconductor chips may be mounted, and a peripheral region. The internal circuits may be arranged in the mount regions. The warpage-suppressing member is different from the semiconductor chips and may be arranged in at least one of the mount regions to suppress a warpage of the insulating substrate. Thus, warpage of the package substrate may be suppressed during a reflow process.

Abstract: A semiconductor device includes a semiconductor package and a mark. The semiconductor package includes a semiconductor chip including a hot spot from which heat is generated, and a mold layer encapsulating the semiconductor chip. The mark is disposed on the semiconductor package. The mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot.

Abstract: A package substrate may include an insulating substrate, internal circuits and a warpage-suppressing member. The insulating substrate may have a plurality of mount regions in which semiconductor chips may be mounted, and a peripheral region. The internal circuits may be arranged in the mount regions. The warpage-suppressing member is different from the semiconductor chips and may be arranged in at least one of the mount regions to suppress a warpage of the insulating substrate. Thus, warpage of the package substrate may be suppressed during a reflow process.

Abstract: Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

Abstract: A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.

Abstract: A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation.

Abstract: A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.

Abstract: A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation.

Abstract: A semiconductor chip and a first heat dissipation pattern are mounted on a substrate. The first heat dissipation pattern has an opening therein and exposes the semiconductor chip therethrough. A second heat dissipation pattern including a thermal interface material (TIM) is interposed between a side surface of the semiconductor chip and the first heat dissipation pattern.

Abstract: A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.

Abstract: A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.

Abstract: Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.