Patents by Inventor Young-duck Kwon

Young-duck Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ETCHANT COMPOSITION FOR PRODUCING GRAPHENE WITH LOW SHEET RESISTANCE
    Publication number: 20230203373
    Abstract: An etchant composition for preparing graphene having low sheet resistance includes sulfuric acid, hydrogen peroxide, an N-heterocyclic aromatic compound, aromatic boric acid, and purified water. The etchant composition exhibits an effect of remarkably reducing the sheet resistance of graphene produced through chemical vapor deposition (CVD).
    Type: Application
    Filed: February 23, 2022
    Publication date: June 29, 2023
    Inventors: Jong Taik MOON, Young Duck KWON, Byong Wook YOO, Sang Min LEE, Seung Il MOON, Ki Soo KIM, Gyu Hyun LEE, Da Som HYUN, Su Jin SHIM
  • Circuit board and method of manufacturing the same
    Patent number: 8431029
    Abstract: Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: April 30, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Young-duck Kwon, Deok-heung Kim
  • CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20100000776
    Abstract: Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.
    Type: Application
    Filed: June 26, 2009
    Publication date: January 7, 2010
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Deok-heung Kim, Young-duck Kwon