Patents by Inventor Young Ghyu Ahn

Young Ghyu Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11094467
    Abstract: A multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked therein, and first and second internal electrodes alternately disposed with at least one among the plurality of dielectric layers interposed therebetween. The first internal electrodes include first and second lead portions exposed to a mounting surface of the ceramic body, and disposed to be spaced apart from each other in a length direction of the ceramic body. The second internal electrodes include a third lead portion exposed to the mounting surface of the ceramic body, and disposed between the first and second lead portions in the length direction of the ceramic body.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Kwang Lee, Jin Kim, Young Ghyu Ahn, Chang Su Kim
  • Patent number: 11087923
    Abstract: A multi-layered ceramic capacitor capable of realizing an improved process yield and miniaturization while having an overvoltage protection function may be provided. The multi-layered ceramic capacitor may include a ceramic body including a first internal electrode, a second internal electrode, a dielectric layer, and an overvoltage protection layer; and an external electrode disposed at both ends of the ceramic body, wherein the overvoltage protection layer may be disposed between the first internal electrode and the second internal electrode.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: August 10, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan Son, Young Ghyu Ahn, Jea Yeol Choi
  • Patent number: 11087919
    Abstract: A coil component includes a body including first, second, third and fourth coils and including a first end surface and a second end surface opposed in a first direction, a first side surface and a second side surface opposing each other in a second direction, and an upper surface and a lower surface opposing each other in a third direction and a plurality of external electrodes disposed on the body and connected to the first to fourth coils. A first group including the first and second coils is arranged in point symmetry with respect to a second group including the third and fourth coils about a center between the first and second groups.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: August 10, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Lee, Young Ghyu Ahn, Chan Yoon, Dong Hwan Lee, Won Chul Sim
  • Patent number: 11075030
    Abstract: An inductor according to an aspect of the present disclosure is an inductor array comprising a plurality of wire-wound type coils. The inductor array comprises a body comprising a first wire-wound type coil, a second wire-wound type coil, a fixation member, and a sealing material sealing the first wire-wound type coil, the second wire-wound type coil, and the fixation member, and comprising magnetic materials; and external electrodes arranged on an external surface of the body. The fixation member comprises a support portion and a core portion passing through the support portion. The first and second wire-wound type coils are arranged to be spaced apart from each other by the fixation member. The fixation member comprises magnetic materials.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn, Won Chul Sim
  • Publication number: 20210090809
    Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
    Type: Application
    Filed: August 11, 2020
    Publication date: March 25, 2021
    Inventors: Gu Won JI, Heung Kil PARK, Sang Soo PARK, Young Ghyu AHN
  • Publication number: 20210092847
    Abstract: An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.
    Type: Application
    Filed: August 11, 2020
    Publication date: March 25, 2021
    Inventors: Gu Won Ji, Man Su Byun, Soo Hwan Son, Young Ghyu Ahn
  • Patent number: 10957477
    Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn, Won Chul Sim
  • Publication number: 20210074480
    Abstract: A multilayer capacitor includes a capacitor body having first and second surfaces, third and fourth surfaces connected to the first and second surfaces, and a fifth surface and a sixth surface connected to the first and second surfaces and the third and fourth surfaces, the capacitor body including a dielectric layer and internal electrodes having one ends exposed through the third and fourth sides, respectively, and first and second external electrodes including first and second connection portions disposed on the third and fourth surfacesrespectively, and first and second band portions extending from the first and second connection portions to portions of the fifth and sixth surfaces respectively. A first distance, along one of the fifth and sixth surfaces, between the first and second external electrodes, is less than a second distance, along one of the first and second surfaces, between the first and second external electrodes.
    Type: Application
    Filed: May 20, 2020
    Publication date: March 11, 2021
    Inventors: Won Chul Sim, Young Ghyu Ahn
  • Patent number: 10923262
    Abstract: An inductor includes: a body having a stack of a plurality of insulating layers, each of which has a coil pattern disposed thereon; and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected to each other by a coil connection portion and form a coil having both end portions connected to the first and second external electrodes through a coil lead portion, and the plurality of coil patterns are composed of coil patterns disposed in outermost positions and coil patterns disposed inwardly of the coil patterns disposed in the outermost positions of the body, a thickness of at least one of the coil patterns disposed inwardly being thicker than that of the coil patterns disposed in the outermost positions.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Soo Park, Young Ghyu Ahn, Hwi Dae Kim
  • Publication number: 20210043386
    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as 1/2 of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as 1/2 of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.
    Type: Application
    Filed: October 23, 2020
    Publication date: February 11, 2021
    Inventors: Young Ghyu AHN, Sang Soo PARK, Min Cheol PARK, Byoung Hwa LEE
  • Publication number: 20210020359
    Abstract: A coil component includes a body, a support substrate buried in the body, a coil portion disposed on at least one surface of the support substrate and having both ends exposed to a surface of the body, a noise removing portion disposed on the at least one surface of the support substrate, spaced apart from the coil portion, and forming an open loop such that one end of the noise removing portion is exposed to a surface of the body, an insulating layer disposed between the coil portion and the noise removing portion, first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively, and a third external electrode disposed on a surface of the body and connected to the one end of the noise removing portion.
    Type: Application
    Filed: February 6, 2020
    Publication date: January 21, 2021
    Inventors: Dong Hwan Lee, Chan Yoon, Dong Jin Lee, Young Ghyu Ahn
  • Patent number: 10847320
    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Sang Soo Park, Min Cheol Park, Byoung Hwa Lee
  • Patent number: 10840022
    Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Gu Won Ji, Heung Kil Park, Young Ghyu Ahn, Se Hun Park
  • Patent number: 10818424
    Abstract: A coil component includes: a body in which a support member is disposed; and first and second coil conductors formed on first and second surfaces of the support member, respectively, the second surface of the support member opposing the first surface thereof, and including first and second lead portions extended to be exposed to the outside of the body, respectively. The first and second lead portions are formed in corner regions of the body.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Young Ghyu Ahn, Dong Hwan Lee, Jin Ho Ku
  • Patent number: 10777356
    Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji, Young Ghyu Ahn
  • Publication number: 20200286677
    Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.
    Type: Application
    Filed: August 6, 2019
    Publication date: September 10, 2020
    Inventors: Dong Jin LEE, Dong Hwan LEE, Young Ghyu AHN, Chan YOON, Won Chul SIM
  • Publication number: 20200286673
    Abstract: A coil component includes a body; a first coil portion disposed inside of the body and having a first core portion; a first external electrode and a second external electrode disposed outside of the body and connected to both ends of the first coil portion, respectively; a second coil portion disposed on the first coil portion in the body and having a second core portion; and a third external electrode and a fourth external electrode disposed outside of the body and connected to both ends of the second coil portion, respectively, wherein the first core portion comprises a first shared core portion overlapping the second core portion and a first non-shared core portion not overlapping the second core portion, and the second core portion comprises a second shared core portion overlapping the first core portion and a second non-shared core portion not overlapping the first core portion.
    Type: Application
    Filed: August 13, 2019
    Publication date: September 10, 2020
    Inventors: Chan YOON, Young Ghyu AHN, Dong Hwan LEE, Dong Jin LEE
  • Patent number: 10770235
    Abstract: A multilayer capacitor in which acoustic noise is reduced has an area of overlap between internal electrodes in an active region of a lower portion of a capacitor body that is smaller than an area of overlap between internal electrodes in an active region of an upper portion of the capacitor body. The multilayer capacitor can be bonded to a board by relatively small solders such that the lower portion is adjacent the board. Deviations between areas of overlap of adjacent internal electrodes in the upper and lower portions of the active region are minimized to reduce piezoelectric deformation of the capacitor body.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Young Ghyu Ahn, Heung Kil Park, Soo Hwan Son
  • Patent number: 10770237
    Abstract: A multilayer electronic component includes: a laminate having a plurality of multilayer capacitors are disposed to be adjacent to each other, each of the multilayer capacitors including a body including dielectric layers and first and second internal electrodes alternately exposed through two end surfaces of the body facing each other in a length direction with each of the dielectric layers interposed therebetween, and first and second external electrodes disposed on the two end surfaces of the body in the length direction, respectively; and first and second terminals disposed on the laminate to cover a plurality of first and second external electrodes, respectively.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan Son, Jae Yeol Choi, Young Ghyu Ahn
  • Patent number: 10707021
    Abstract: A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Soo Park, Young Ghyu Ahn, Hwi Dae Kim