Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Abstract: A gamma voltage generator of a liquid crystal display (LCD) capable of removing residual images by compensating a gamma voltage. The gamma voltage generation apparatus adjusts the common voltage by the kickback voltage for the intermediate gray level, and tunes the gamma voltages other than the intermediate gray level gamma voltage. The adjustment of the gamma voltages other than the intermediate gray level gamma voltage is achieved in such a manner that the difference between the intermediate gray level kickback voltage and the kickback voltage at one of the gray levels other than the intermediate gray level is equal to half of the difference between the sum of the two inverted gamma voltages representing the intermediate gray level gamma voltages and the sum of the two inverted gamma voltages corresponding to the selected gray level.

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Abstract: A reference value setting unit of a specimen inspection apparatus comprises a calibration specimen, a calibration light source for emitting a predetermined light to the calibration specimen, at least one detector for receiving a first light-scattering signal reflected through the calibration specimen as well as a second light-scattering signal reflected from an inspection specimen, and a detector calibration unit for comparing a measured value measured from the calibration specimen with a reference value for the detector, and for calculating an offset value for calibration based on the comparison to calibrate the detector.

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Abstract: A gamma voltage generator of a liquid crystal display (LCD) capable of removing residual images by compensating a gamma voltage. The gamma voltage generation apparatus adjusts the common voltage by the kickback voltage for the intermediate gray level, and tunes the gamma voltages other than the intermediate gray level gamma voltage. The adjustment of the gamma voltages other than the intermediate gray level gamma voltage is achieved in such a manner that the difference between the intermediate gray level kickback voltage and the kickback voltage at one of the gray levels other than the intermediate gray level is equal to half of the difference between the sum of the two inverted gamma voltages representing the intermediate gray level gamma voltages and the sum of the two inverted gamma voltages corresponding to the selected gray level.

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Abstract: A liquid crystal display includes a plurality of gate lines and a plurality of data lines crossing over the gate lines while being electrically insulated from the gate lines. Pixels are placed at the cross regions of the gate and the data lines arranged in a matrix form. Each pixel has a switching circuit connected to the gate and the data lines. Data voltages are fed to the pixels such that the polarity of the pixels is inverted per a pixel group of two or more pixel rows. Gate voltages are applied to the neighboring first and second pixel groups such that the gate voltage applied to the pixel row of the first pixel group close to the second pixel group differs from the gate voltage applied to the pixel row of the first pixel group distant to the second pixel group.

Abstract: For removing a polarizer from a liquid crystal display automatically, a device for removing a polarizer of liquid crystal display includes a holder, a separator, a first moving member, a damper and a second moving member. The holder fixes liquid crystal display. The separator separating an edge of a polarizer from the panel by inserting between the polarizer and the panel. The first moving member moves the separator. The clamping member holds the edge of the polarizer separated from the panel. The second moving member moves the first moving member and the separator together to separate the polarizer from the panel. The fixing member may include a vacuum adsorber, and it has an adsorption plate provided on the surface of which liquid crystal display is laid. The separator has a sharp edge to be easily inserted between the panel and the polarizer. The first moving member and the second moving member include a hydraulic cylinder, a pneumatic cylinder, a servomotor and a ball screw system.

Abstract: Methods for annealing and pickling high manganese cold rolled steel sheets for use in automobiles and electronic panels in which a superior formability and high strengths are required are disclosed. That is, the invention provides a method for annealing a cold rolled high manganese steel sheet, in which, after cold-rolling a high manganese steel of Fe--Mn--Al--C series, the annealing atmospheric gas is adjusted during an annealing so as to minimize the thickness of a surface oxide layer, and an oxide layer removing agent such as aluminum nitride is spread into the oxide layer, so that the surface oxide layer can be easily removed. The invention further provides a method for pickling a cold rolled high manganese steel sheet, in which the surface oxide layer formed on the cold rolled high manganese steel sheet is uniformly removed with a mild aqueous solution of chloric acid, thereby improving the surface quality of the steel sheet, and saving the pickling facility cost.

Abstract: A high manganese steel having superior hot workability is disclosed, in which small amounts of the alloying elements are added into a high manganese steel of Fe-Mn-Al-C system, so that the rupture strength of the grain boundaries of columnar crystals can be improved, thereby realizing an improved hot workability. Further, a process for manufacturing a high manganese hot rolled steel sheet is disclosed, in which the above mentioned high manganese steel is subjected to be controlled the initial hot rolling conditions during a hot rolling, so that large cracks would not be generated on the edges and on the surface of the hot rolled steel sheet. The process for manufacturing a hot rolled high manganese steel without any cracks includes the following the steps. That is, the process includes the steps of: preparing the ingot or the continuous casting slabs of the conventional Fe-Mn-Al-C steel with one or more elements selected from a group consisting of 0.0005-0.04% of B, 0.0005-0.050% of Ti, 0.0005-0.

Abstract: This invention is concerned with the development of a Cu-base shape memory alloy and it's manufacturing process. The alloy is a Cu-Al-Ni-Zr-Si shape memory alloy exhibiting high strength(830Mpa, 85kg/mml) and good ductility(7.5 - 8%) due to grain size refinement by the addition of microalloying elements (Zr, Si). Also, the invented alloy has good thermal stability and is useful for temperatures of up to about 300.degree. C.

Abstract: A new Fe-Mn-Al-C-Nb-Si-Cu alloy for use in ultra-low temperature materials is provided. The alloy has the following composition: 25 to 35 percent by weight manganese, 2 to 10 percent by weight aluminum, 0.1 to 0.8 percent by weight carbon, 0.01 to 0.2 percent by weight niobium, 0.05 to 0.5 percent by weight silicon, 0.05 to 1.0 percent by weight copper and the balance of iron. The alloy is manufactured by controlled rolling the ingot containing the elemental constituents, and has a tensile strength of above 350 MPa, an elongation of 40%, and a toughness of above 100 joules at -196.degree. C.