Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.

Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

Abstract: The present invention relates to an apparatus of generating momentum which drives an object. The present invention provides a momentum generating apparatus in which a pair of high temperature superconducting coils which are wound in different directions and have different superconducting properties are arranged in parallel and the same current flows in the pair of coils to be in a stable state where magnetic fields generated in the coils are cancelled and an asymmetric current is suddenly applied to the pair of coils through a switching operation to generate a magnetic field and an eddy current is induced in a plate due to the generated magnetic field and the plate is floated using a repulsive force between the magnetic field generated in the plate due to the eddy current and the magnetic field generated in the pair of coils, to instantaneously generate force using a small amount of superconducting coils.

Abstract: The present invention relates to an apparatus of generating momentum which drives an object. The present invention provides a momentum generating apparatus in which a pair of high temperature superconducting coils which are wound in different directions and have different superconducting properties are arranged in parallel and the same current flows in the pair of coils to be in a stable state where magnetic fields generated in the coils are cancelled and an asymmetric current is suddenly applied to the pair of coils through a switching operation to generate a magnetic field and an eddy current is induced in a plate due to the generated magnetic field and the plate is floated using a repulsive force between the magnetic field generated in the plate due to the eddy current and the magnetic field generated in the pair of coils, to instantaneously generate force using a small amount of superconducting coils.

Abstract: A probe for making electric contact with a contact target includes a first part (10) including a first base portion (15) and a socket portion (17) formed on the first base portion; and a second part including (20) a second base portion (25) and a plug portion (21) formed on the second base portion. And the plug portion is removably coupled to the socket portion.