Abstract: A swing device has a support frame, a seat having a swing axis and swing back and forth about the swing axis while a bar thereof being hung on the support frame, and a repulsive circuit for repelling a permanent magnet installed on the swing axis.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: A method for quantifying plant resource using a GIS is disclosed, in which it is possible to more efficiently quantify plant resources with less manpower, time and cost using a GIS when quantifying plant resources in a certain region. In the method, a sample group is extracted from mother groups having a plurality of distribution maps having a plurality of environment factors including IMI as attribute data, the IMI being obtained through a GIS preprocess. A relative model formula is obtained between a plant resource real measurement value of the sample group and an environment factor real measurement value and is related with the distribution map of the mother group, and the distribution maps are overlapped for thereby forming a plant resource estimation distribution map of the mother group.

Abstract: A swing device has a support frame, a seat having a swing axis and swing back and forth about the swing axis while a bar thereof being hung on the support frame, and a repulsive circuit for repelling a permanent magnet installed on the swing axis.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: Provided are a variety of snap cure apparatus configuration and corresponding methods for operating each such apparatus in order to snap cure an adhesive composition. Each of the configurations includes at least one vertical stack of heater blocks whereby the horizontal area required for conducting the snap cure processing may be reduced. Depending on the configuration utilized, two or more transfer devices may be required to remove the substrate(s) from a conveyor, index the substrate(s) through the heater blocks to apply the predetermined thermal cycle and return the cured substrate to the conveyor. Similarly, depending on the particular adhesive utilized, the number, relative temperatures, and duration of the substrate(s) on each of the heater blocks may be adjusted to provide the desired degree of curing.