Patents by Inventor Young-Heup Kim

Young-Heup Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050043492
    Abstract: Disclosed is a polyxymethylene composite resin composition, including 40-99 parts by weight of a polyoxymethylene resin, and 1-60 parts by weight of a thermoplastic polyurethane resin containing 0.05-1 part by weight of an active isocyanate, with selective addition of 0.01-5 parts by weight of a compound containing maleic anhydride, which is advantageous in terms of generation of no carbides upon preparation thereof, excellent strength and elongation in a weld line, and superior formability. An article prepared from the polyxymethylene composite resin composition is also provided.
    Type: Application
    Filed: November 21, 2002
    Publication date: February 24, 2005
    Inventors: Chong-Won Chin, Young-Heup Kim, Kyyung-Seob Byun, Tae-Woong Lee, Dong-Sik Kim, Oh-Eui Kwon, Hwa-Yong Lee, Jun-Eun Shin
  • Patent number: 6576740
    Abstract: A polyoxymethylene having enhanced thermal stability and resistance to depolymerization is obtained by using an alkylated melamine compound of formula (1) as a polymerization terminating agent in a polymerization of formaldehyde or a cyclic oligomer thereof and an optional comonomer in the presence of an acid catalyst: wherein, R1 to R6 are each independently H, C1-4 alkyl or CH2OR7; R7 is H, C1-4 alkyl or R8COOR9; R8 is —(CH2)n—, n being an integer of 1 to 4; and R9 is C1-4 alkyl.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: June 10, 2003
    Assignee: Korea Engineering Plastics Co., Ltd.
    Inventors: Chong-Won Chin, Young-Heup Kim, Kyung-Seob Byun