Abstract: A computing system comprises a memory and a controller, and the controller is configured to store a first type of data and a second type of data in the memory, to divide the first type of data into a first part and a second part, to generate parity information on the first part and to store the parity information in the memory, and a refresh interval of a region of the memory where the first type of data is stored is larger than a refresh interval of a region of the memory where the second type of data is stored.

Abstract: A memory controller includes: a data separator configured to separate host write data into upper data and lower data; an address generator configured to generate a first address and a second address based on a host address; a command generator configured to generate one or more first commands for writing the upper data into a first storage region that is selected based on the first address in a memory, and one or more second commands for writing the lower data into a second storage region that is selected based on the second address in the memory; and a control block configured to control the address generator and the command generator to make a difference in power consumption between the first storage region and the second storage region.

Abstract: A molding method for a cover window includes: locally heating a peripheral portion of a glass substrate around a central portion of the glass substrate to a temperature of about 610° C. to about 670° C., forming a cover window by pressing the glass substrate, and annealing and cooling the cover window. Accordingly, a cover window in which each of edges has an outwardly convex curved surface through a glass substrate may be formed. In addition, the surface roughness of a cover window formed through a glass substrate may be improved.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.

Abstract: Methods and apparatuses for managing rule based on informal data are provided, one of methods comprises, receiving, by a rule management apparatus, informal data representing a rule, analyzing, by the rule management apparatus, the informal data, generating, by the rule management apparatus, formal data that can be processed by a rule engine of the rule management apparatus, using results of the analysis of the informal data, selecting, by the rule management apparatus, one or more items to be corrected for setting the rule from the formal data with reference to a target thesaurus relevant to the rule and processing, by the rule management apparatus, the formal data with the selected items corrected, using the rule engine.

Abstract: Disclosed are a battery pack having a dummy battery function, a portable electronic apparatus and a control method thereof. The portable electronic apparatus, includes a system body connectable to a plurality of components; a battery to supply power to the system body; a battery charging part to charge the battery with power externally supplied; a user selecting part selectable between a dummy mode and a normal mode related to the battery; and a controller to control the battery charging part to not charge the battery when the dummy mode is selected through the user selecting part and control the battery charging part to charge the battery when the normal mode is selected through the user selecting part. With this configuration, a dummy battery function is provided avoid the performance of a battery from deterioration and the durability of the battery from being reduced.

Abstract: A multi-layer plated lead frame is provided. The lead frame has a structure in which a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame shows improvement in all properties including wire bonding, anti-corrosion, and solderability.

Abstract: The lead frame includes outer leads plated with tin (Sn) alloy so as to withstand the high temperatures generated during a subsequent semiconductor packaging process. In addition to the outer leads, the lead frame includes a die pad and inner leads composed of a base metal, such as copper (Cu), a copper alloy, or a nickel alloy. The die pad and the inner leads are plated with silver for improved conductivity. In order to withstand relatively high temperatures as well as to resist corrosion and have good solder wettability, the outer leads are preferably plated with a tin antimony alloy, such as a tin-antimony alloy consisting of 90.+-.5 weight percent of tin and 10.+-.5 weight percent antimony. Alternatively, the outer leads can be plated with a tin-antimony-lead alloy, such as a tin-antimony-lead alloy consisting of 10.+-.5 weight percent of tin, 10.+-.5 weight percent of antimony and 80.+-.10 weight percent of lead. A method of plating a lead frame is also provided.

Abstract: A method for forming a plating layer of a lead frame having excellent anti-corrosion properties is provided. At least a portion of a lead frame is plated, then a first heating of the plated portion of the lead frame to a first temperature is performed, and finally a second heating of the first heated plated portion of the lead frame to a second temperature higher than the first temperature is performed. The lead frame manufactured by this method has excellent anti-corrosion properties, such that deterioration of the plating layer, by cracking and inferior solderability, is not observed.

Abstract: A method for manufacturing a lead frame includes degreasing and activating the surface of a metal sheet, providing the plating solution containing nickel(II) sulfamate tetrahydrate, (Ni(H.sub.2 NSO.sub.3).sub.2.4H.sub.2 O), manganese(II) sulfamate tetrahydrate (Mn(H.sub.2 NSO.sub.3).sub.2.4H.sub.2), nickel (II) chloride hexahydrate (NiCl.sub.2.6H.sub.2 O) and boric acid, plating the metal sheet in the plating solution to form a Ni--Mn alloy layer, and forming a Pd or Pd alloy layer on the Ni--Mn alloy layer.

Abstract: A lead frame has a metal substrate directly coated with a palladium alloy layer to prevent diffusion of metal molecules from the metal substrate. The lead frame does not contain a nickel intermediate layer, thereby preventing the diffusion of nickel molecules which makes soldering difficult, and enhancing production.

Abstract: A semiconductor lead frame having an improved structure formed of plated layers is provided. The semiconductor lead frame has the structure of multi-plated layers in which a Ni plated layer, a Pd strike plated layer, and a Pd--X alloy plated layer are deposited on a substrate in the described order. In such a multi-plated layer structure, the Pd strike plated layer covers the porous surface of the Ni plated layer and decreases the surface roughness. Since the thickness of the outer Pd--X alloy plated layer can be maintained uniform due to the Pd strike plated layer, corrosion durability and bonding characteristics are enhanced, thus minimizing the generation and progress of cracks.

Abstract: A method for making a lead frame comprising overflow plating the lead frame to form a plating layer thereon; and heating the plated lead frame at a predetermined temperature to rearrange the plating layer. Therefore, the rearrangement of the overflow-plated lead frame, by thermal treatment, effectively eliminates the number of pores formed in the plating layer of the lead frame, thereby greatly reducing the number of corrosive portions.