Patents by Inventor Young-Ho Choo

Young-Ho Choo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137790
    Abstract: The present disclosure discloses systems and methods of calculating a near-maximum likelihood detection (MLD) performance capability signal to interference plus noise ratio (SINR) according to instructions stored in non-transitory computer readable memory that when executed by a processor of a multiple-input, multiple output orthogonal frequency-division multiplexing (MIMO-OFDM) wireless communications receiver device cause the processor to perform operations including the processor acquiring Hi and noise variance ?n2 for each subcarrier of a set of subcarriers between a MIMO-OFDM wireless communications transmitter device and the wireless communications receiver device, computing an average received bit mutual information rate (RBIR) over all subcarriers, converting the average RBIR to an effective SINR; and selecting a modulation coding scheme (MCS).
    Type: Application
    Filed: April 4, 2023
    Publication date: April 25, 2024
    Inventors: KYUNG HOON KWON, SEUNG HYEOK AHN, YOUNG HWAN KANG, SEUNG HO CHOO, JUNGCHUL SHIN, DAEHONG KIM
  • Patent number: 11949508
    Abstract: A method performed by a transmitter in a wireless local area network (WLAN) is provided. The method comprises: setting a second parameter in a second frame based on a first puncturing pattern indicated by a first parameter in a first frame for a basic service set (BSS) set up by an access point (AP); and transmitting, to a receiver, the second frame, wherein the first puncturing pattern is one of a plurality of puncturing patterns pre-determined for a third parameter in a third frame.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: April 2, 2024
    Assignee: Senscomm Semiconductor Co., Ltd.
    Inventors: Yujin Noh, Seung Hyeok Ahn, Seung Ho Choo, Young-Hwan Kang, Jungchul Shin, Tan Joong Park
  • Patent number: 11367634
    Abstract: The inventive concept relates to a substrate treating apparatus and method for removing various types of treating liquid or cleaning solution films on an edge region of a substrate without damage to a treated surface even though the substrate is rotated in an eccentric state.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 21, 2022
    Assignee: SEMES CO., LTD.
    Inventors: Ohyeol Kwon, Jihyun Lee, Young Ho Choo
  • Patent number: 11158079
    Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: October 26, 2021
    Assignee: Semes Co., Ltd.
    Inventors: Ohyeol Kwon, Soo Young Park, Jihyun Lee, Young Ho Choo
  • Patent number: 10991603
    Abstract: A method for treating a substrate includes a mixing step of preparing an ozone treatment fluid containing an ozone gas and a substrate treating step of treating a surface of the substrate using the ozone treatment fluid. In the substrate treating step, light is irradiated to the substrate by a lamp.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: April 27, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Oh Jin Kwon, Chong-Min Ryu, Young Ho Choo
  • Publication number: 20200167946
    Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 28, 2020
    Applicant: Semes Co., Ltd.
    Inventors: Ohyeol KWON, Soo Young Park, Jihyun Lee, Young Ho Choo
  • Publication number: 20200075362
    Abstract: The inventive concept relates to a substrate treating apparatus and method for removing various types of treating liquid or cleaning solution films on an edge region of a substrate without damage to a treated surface even though the substrate is rotated in an eccentric state.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Inventors: OHYEOL KWON, JIHYUN LEE, YOUNG HO CHOO
  • Publication number: 20200075355
    Abstract: A method for treating a substrate includes a mixing step of preparing an ozone treatment fluid containing an ozone gas and a substrate treating step of treating a surface of the substrate using the ozone treatment fluid. In the substrate treating step, light is irradiated to the substrate by a lamp.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Inventors: OH JIN KWON, CHONG-MIN RYU, YOUNG HO CHOO
  • Patent number: 10180132
    Abstract: A flow generator includes pumps operated by motors to generate an amount of a hydraulic fluid, a proportional hydraulic control valve to control output hydraulic pressure according to the amount of the hydraulic fluid, a pressure sensor to detect the output hydraulic pressure, and a hydraulic servo loop controller to which a required hydraulic pressure and a required amount of fluid are input by a user. Based on a feedback signal representing the output hydraulic pressure, the controller generates a pressure control signal for controlling the proportional hydraulic control valve based on the required hydraulic pressure and a change in the output hydraulic pressure. It also generates an RPM input signal for controlling a motor's RPM.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: January 15, 2019
    Assignee: KNR Systems, Inc.
    Inventors: Sung Moo Ryu, Seong Cheol Jang, Hyoung Kwon Kim, Young Ho Choo, Dae Gyeong Kim
  • Publication number: 20150017019
    Abstract: Disclosed are a mobile hydraulic generator having rapid response by scattering a small motor for generating a flow of fluid and a small pump, and a control method thereof. The mobile hydraulic generator includes: a flow generator including n pumps operated by n motors to generate an amount of a hydraulic fluid; a proportional hydraulic control valve to control output hydraulic pressure according to the amount of the hydraulic fluid; a pressure sensor to detect the output hydraulic pressure; and a hydraulic servo loop controller to which required hydraulic pressure and required amount of fluid are input by a user, to which feedback the output hydraulic pressure, to generate a pressure control signal for controlling the proportional hydraulic control valve based on the required hydraulic pressure and a change amount of the output hydraulic pressure and to generate an RPM input signal for controlling RPM of the n motors.
    Type: Application
    Filed: July 10, 2014
    Publication date: January 15, 2015
    Inventors: Sung Moo Ryu, Seong Cheol Jang, Hyoung Kwon Kim, Young Ho Choo, Dae Gyeong Kim
  • Publication number: 20130284367
    Abstract: Provided is a substrate processing apparatus. The apparatus includes a processing chamber containing a substrate and processing the substrate by using a processing solution and a supplying unit supplying the processing solution to the processing chamber. The supplying unit includes a supply line through which the processing solution is supplied, a preliminary heater installed on the supply line and preliminary heating the processing solution, a main heater installed on the supply line at a lower stream of the preliminary heater and secondarily heating the processing solution, a first detour line connected to the supply line to detour to the preliminary heater and comprising a first valve, a second detour line connected to the supply line to detour the preliminary heater and the main heater or the main heater and comprising a second valve, and a controller controlling the first valve and the second valve.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 31, 2013
    Inventors: Byung Chul Kang, Bong Joo Kim, Byung Man Kang, Young Ho Choo
  • Publication number: 20090095323
    Abstract: Provided is a valve with a sensor for process solution, a substrate treating apparatus employing the valve, and a substrate treating method. The valve includes a body, an inlet, an outlet, a shutter, and a sensor. The body is provided with a passage within, through which a process solution for a substrate flows. The inlet is connected to one end of the passage, through which the process solution flows into the body. The outlet is connected to another end of the passage, through which the process solution is discharged to an outside of the body. The shutter is for opening or closing the passage at a region where the inlet and the passage are connected. The sensor is coupled to the body to contact the process solution flowing through the passage and sense a composition of the process solution.
    Type: Application
    Filed: October 10, 2008
    Publication date: April 16, 2009
    Inventors: Hye-Son Jung, Young-Ho Choo
  • Publication number: 20080060681
    Abstract: A substrate treating apparatus includes a treating unit including a treating bath which a treating solution is supplied into and stored in and treating solution supply means for supplying the treating solution into the treating bath; and a drying unit including a drying bath into which fluid is supplied and injected and fluid supply means for supplying the fluid into the drying bath, wherein the fluid supply means includes a filter configured to filter the fluid before the fluid is supplied into the drying bath and a first heater configured to heat the filter. According to the substrate treating apparatus, the generation of particles caused by supplying solidified drying fluid into a drying bath is suppressed to treat a substrate without error. As a result, a production or yield increases.
    Type: Application
    Filed: August 31, 2007
    Publication date: March 13, 2008
    Inventors: Young-Ho Choo, Hye-Sun Jung