Abstract: A method for biometrics spoofing detection according to an embodiment of the present disclosure includes receiving a biometric authentication request from an application, acquiring biometrics at a sensor, and applying a machine learning-based anti-spoofing scheme to the biometrics based on an authentication purpose of the biometrics. The anti-spoofing scheme for biometrics of the present disclosure may include a deep neural network generated by machine learning, and may be used in an Internet of Things environment using a 5G network.

Abstract: A drive-through order processing method and apparatus are disclosed. The drive-through order processing method includes receiving customer information detected through vision recognition, providing product information based on the customer information, and processing a product order of a customer. According to the present disclosure, it is possible to rapidly process an order using customer information based on customer recognition using an artificial intelligence (AI) model of machine learning through a 5G network.

Abstract: A method for biometrics spoofing detection according to an embodiment of the present disclosure includes receiving a biometric authentication request from an application, acquiring biometrics at a sensor, and applying a machine learning-based anti-spoofing scheme to the biometrics based on an authentication purpose of the biometrics. The anti-spoofing scheme for biometrics of the present disclosure may include a deep neural network generated by machine learning, and may be used in an Internet of Things environment using a 5G network.

Abstract: Disclosed are an image noise processing method and apparatus. The image noise processing method includes inputting a target image including a low light level noise, estimating a noise level, and a selective processing of the target image by a denoising sub-network corresponding to the noise level. According to the present disclosure, it is possible to selectively apply a denoising neural network through a 5G network on the basis of an estimation of a noise level.

Abstract: A drive-through order processing method and apparatus are disclosed. The drive-through order processing method includes receiving customer information detected through vision recognition, providing product information based on the customer information, and processing a product order of a customer. According to the present disclosure, it is possible to rapidly process an order using customer information based on customer recognition using an artificial intelligence (AI) model of machine learning through a 5G network.

Abstract: Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end.

Abstract: Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.

Abstract: Disclosed herein is a superimposed module package, including: a printed circuit board; a first module electrically connected on the printed circuit board; and a second module superimposed between the printed circuit board and the first module to electrically connect the first module to the printed circuit board. According to the preferred embodiments of the present invention, the superimposed module package can secure the diversity of the product line-up by applying various combinations of the power module, the control module, the light emitting module, the storage module, and the like, to each module.

Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.

Abstract: Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.

Abstract: There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.

Abstract: There is provided a semiconductor module capable of being easily manufactured. The semiconductor module includes: a control part including at least one control device; and a power part including at least one power device, wherein any one of the control part and the power part includes contact pins having elasticity, and the control part and the power part are electrically connected to each other by the contact pins.

Abstract: Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end.

Abstract: There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity.

Abstract: There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.

Abstract: Disclosed herein is a multi-stage heat sink cooling system, including: at least one step surface in a direction of a surface to which cooling air is injected, wherein the step surface is any one of a step surface having a stair shape that is provided with a plurality of heat radiating plates each having a curve, a step surface provided with a plurality of heat radiating plates having a streamlined smooth curve, and a step surface provided with a plurality of heat radiating fins having a height difference. According to the preferred embodiments of the present invention, the cooling system with the multi-stage heat sink can cool heat generated from a heat radiating element using the multi-stage heat sink and the air injection part to improve a heat release rate.