Patents by Inventor Young Hoon Kwak
Young Hoon Kwak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150156914Abstract: Disclosed herein is a heat radiation system including: a frame; a partition plate disposed across the frame and including an inlet for supplying a cooling medium, a plurality of louvers extended radially from a circumference of the inlet, and a slot formed at a circumference of an edge thereof; a diffusion chamber defined by the frame and the partition plate; a lower plate disposed at a lower portion of the frame so as to be spaced apart from the partition plate by a predetermined interval and including an outlet for discharging the cooling medium; and a recovery chamber defined by the frame, the partition plate, and the lower plate and being in fluid communication with the diffusion chamber.Type: ApplicationFiled: July 9, 2014Publication date: June 4, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Hoon KWAK, Chang Seob Hong, Young Ki Lee
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Publication number: 20150091146Abstract: Disclosed herein is a power semiconductor package. The power semiconductor package according to a preferred embodiment of the present invention includes: a semiconductor device; a circuit pattern formed on the semiconductor device; a molding member burying the semiconductor device and the circuit pattern and formed so as to expose one surface of the circuit pattern; and a heat radiating member adhered to the circuit pattern exposed by the molding member and formed of a non-conductive material.Type: ApplicationFiled: May 27, 2014Publication date: April 2, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyu Hwan Oh, Si Joong Yang, Do Jae Yoo, Young Hoon Kwak
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Patent number: 8897011Abstract: Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.Type: GrantFiled: August 17, 2012Date of Patent: November 25, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Hoon Kwak, Jong Man Kim, Young Ho Sohn
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Patent number: 8866288Abstract: Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate; an insulating layer formed above the heat radiating lead; at least one power device formed above the insulating layer; and at least one control device formed above the insulating layer.Type: GrantFiled: January 7, 2013Date of Patent: October 21, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong Man Kim, Young Hoon Kwak, Chang Seob Hong, Soon Gyu Yim
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Publication number: 20140285972Abstract: There are provided a housing capable of evenly distributing stress generated at the time of assembly thereof and a power module having the same. The housing for a power module according to an embodiment of the invention includes: a body part having a space formed therein, the space receiving a module substrate having electronic devices mounted thereon; a plurality of fastening parts protruded from sides of the body part; and a fastening member having a leaf spring form and having both ends coupled to two of the fastening parts, respectively, wherein the fastening member includes: a coupling portion coupled to a fixing member; and elastic portions extending from both edges of the coupling portion to be coupled to the fastening parts and elastically deformed when the coupling portion is fastened to a heat radiating substrate to provide elastic force to the fastening parts.Type: ApplicationFiled: May 29, 2013Publication date: September 25, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Seob Hong, Young Hoon Kwak, Kwang Soo Kim, Bum Seok Suh
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Publication number: 20140285973Abstract: There are provided housing, capable of preventing a fastening part from being damaged by stress generated at the time of assembly thereof, and a power module having the same. The housing for the power module includes a body part having a space formed therein, the space accommodating a module substrate on which electronic elements are mounted, a plurality fastening parts formed to be protruded from side surfaces of the body part, and an elastic member coupled to the fastening parts in a plate spring manner and elastically supporting lower portions of the fastening parts.Type: ApplicationFiled: May 30, 2013Publication date: September 25, 2014Inventors: Chang Seob HONG, Young Hoon Kwak, Kwang Soo Kim
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Patent number: 8816515Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.Type: GrantFiled: February 27, 2013Date of Patent: August 26, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Ki Lee, Kwang Soo Kim, Young Hoon Kwak, Sun Woo Yun
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Patent number: 8810014Abstract: There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.Type: GrantFiled: February 7, 2013Date of Patent: August 19, 2014Assignee: Samsung Electro-Mechanics, Co., Ltd.Inventors: Jae Hyun Lim, Chang Seob Hong, Young Hoon Kwak, Young Ho Sohn
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Patent number: 8796730Abstract: Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.Type: GrantFiled: December 7, 2011Date of Patent: August 5, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Ki Lee, Dong Soo Seo, Kwang Soo Kim, Young Hoon Kwak
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Publication number: 20140175631Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.Type: ApplicationFiled: February 27, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Ki LEE, Kwang Soo KIM, Young Hoon KWAK, Sun Woo YUN
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Patent number: 8736077Abstract: Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.Type: GrantFiled: November 30, 2011Date of Patent: May 27, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong Man Kim, Young Hoon Kwak, Kyu Hwan Oh, Seog Moon Choi, Tae Hoon Kim
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Patent number: 8729692Abstract: Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.Type: GrantFiled: January 18, 2012Date of Patent: May 20, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kwang Soo Kim, Young Hoon Kwak, Young Ki Lee
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Publication number: 20140124182Abstract: Disclosed herein is a cooling system of a power semiconductor device. The cooling system of a power semiconductor device, which improves a cooling structure according to the related art to deprive heat generated from power devices while moving a working fluid introduced through an inlet to one direction and discharge the working fluid to an outlet, forms a branch inlet in a direction crossing a main inlet and additionally introduce the low-temperature working fluid through the branch inlet so as to be supplied to a channel to mix the working fluid supplied through the main inlet via the channel with the working fluid additionally introduced through the branch inlet around power devices, thereby improving a cooling effect.Type: ApplicationFiled: March 14, 2013Publication date: May 8, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Hoon KWAK, Jae Hyun Lim, Young Ki Lee, Chang Seob Hong
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Publication number: 20140117522Abstract: There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.Type: ApplicationFiled: February 7, 2013Publication date: May 1, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hyun LIM, Chang Seob HONG, Young Hoon KWAK, Young Ho SOHN
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Publication number: 20140118961Abstract: Disclosed herein is a power module package including: a base substrate; a post having one end and the other end, the one end being formed on the base substrate; and a case formed on the base substrate such that it covers a lateral surface and an upper surface of the base substrate, and spaced apart from the upper surface of the base substrate.Type: ApplicationFiled: February 1, 2013Publication date: May 1, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Seob Hong, Young Hoon Kwak, Kwang Soo Kim, Bum Seok Suh
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Publication number: 20140117525Abstract: Disclosed herein is a power module package including: a base substrate; a metal layer including a circuit pattern and a connection pad formed on the base substrate; a semiconductor device including a plurality of electrodes mounted on the circuit pattern of the metal layer; and a plurality of lead frames formed on the connection pad of the metal layer and respectively connected to the plurality of electrodes of the semiconductor device.Type: ApplicationFiled: October 28, 2013Publication date: May 1, 2014Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Ki Lee, Kwang Soo Kim, Young Hoon Kwak, Sun Woo Yun
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Publication number: 20140116670Abstract: Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.Type: ApplicationFiled: January 7, 2013Publication date: May 1, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Hoon Kwak, Eun Jung Jo, Kwang Soo Kim
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Patent number: D717253Type: GrantFiled: March 18, 2013Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eun Jung Jo, Jin Suk Son, Job Ha, Jae Hoon Park, Chang Seob Hong, Joon Hyung Cho, In Wha Jeong, Young Hoon Kwak, Chang Jae Heo
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Patent number: D719113Type: GrantFiled: March 18, 2013Date of Patent: December 9, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Ho Sohn, Si Joong Yang, Young Ki Lee, Jin Su Kim, Dong Hwan Kim, Jong Man Kim, Kee Ju Um, Hyo Jin Lee, Young Hoon Kwak
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Patent number: D719926Type: GrantFiled: March 18, 2013Date of Patent: December 23, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Ho Sohn, Si Joong Yang, Young Ki Lee, Jin Su Kim, Dong Hwan Kim, Jong Man Kim, Kee Ju Um, Hyo Jin Lee, Young Hoon Kwak