Patents by Inventor Young-Hwa No

Young-Hwa No has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7601469
    Abstract: A plasma etching chamber of a plasma etching apparatus used in an etching process for manufacturing a photomask and a method for manufacturing a photomask using the same. The plasma etching chamber includes an electrode having a supporting surface for supporting a photomask substrate and a top surface surrounding the supporting surface, a heat transfer element installed along a peripheral edge of the supporting surface, and a heater for supplying heat to the heat transfer element. In the method for manufacturing a photomask, a shading layer is formed on a transparent substrate. A photoresist layer pattern is formed on the shading layer to partially expose the shading layer. The shading layer is etched to form a shading layer pattern, using plasma with the photoresist layer pattern as an etching mask, under a state in which the temperature of at least one portion of the peripheral edge of the transparent substrate is maintained higher than a temperature at a center of the transparent substrate.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: October 13, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong-Yun Lee, Jin-Min Kim, Hae-Young Jeong, Young-Hwa No, Sang-Joon Yoon, Sung-Yong Cho
  • Publication number: 20070231716
    Abstract: A plasma etching chamber of a plasma etching apparatus used in an etching process for manufacturing a photomask and a method for manufacturing a photomask using the same. The plasma etching chamber includes an electrode having a supporting surface for supporting a photomask substrate and a top surface surrounding the supporting surface, a heat transfer element installed along a peripheral edge of the supporting surface, and a heater for supplying heat to the heat transfer element. In the method for manufacturing a photomask, a shading layer is formed on a transparent substrate. A photoresist layer pattern is formed on the shading layer to partially expose the shading layer. The shading layer is etched to form a shading layer pattern, using plasma with the photoresist layer pattern as an etching mask, under a state in which the temperature of at least one portion of the peripheral edge of the transparent substrate is maintained higher than a temperature at a center of the transparent substrate.
    Type: Application
    Filed: June 5, 2007
    Publication date: October 4, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Jeong-Yun LEE, Jin-Min KIM, Hae-Young JEONG, Young-Hwa NO, Sang-Joon YOON, Sung-Yong CHO
  • Publication number: 20060093961
    Abstract: A method of verifying electron beam data used to produce a photomask comprises dividing design data for the photomask into a plurality of repetitive regions, sequentially converting the sequential regions into electron beam data, and determining whether electron beam data corresponding to a current repetitive region is substantially identical to electron beam data corresponding to a previous repetitive region.
    Type: Application
    Filed: November 1, 2005
    Publication date: May 4, 2006
    Inventors: Sung-Hoon Jang, Byoung-Sup Ahn, Young-Hwa No
  • Publication number: 20020153104
    Abstract: A plasma etching chamber of a plasma etching apparatus used in an etching process for manufacturing a photomask and a method for manufacturing a photomask using the same. The plasma etching chamber includes an electrode having a supporting surface for supporting a photomask substrate and a top surface surrounding the supporting surface, a heat transfer element installed along a peripheral edge of the supporting surface, and a heater for supplying heat to the heat transfer element. In the method for manufacturing a photomask, a shading layer is formed on a transparent substrate. A photoresist layer pattern is formed on the shading layer to partially expose the shading layer. The shading layer is etched to form a shading layer pattern, using plasma with the photoresist layer pattern as an etching mask, under a state in which the temperature of at least one portion of the peripheral edge of the transparent substrate is maintained higher than a temperature at a center of the transparent substrate.
    Type: Application
    Filed: April 18, 2002
    Publication date: October 24, 2002
    Inventors: Jeong-Yun Lee, Jin-Min Kim, Hae-Young Jeong, Young-Hwa No, Sang-Joon Yoon, Sung-Yong Cho