Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.

Abstract: The present disclosure relates to a novel anti-HER2 antibody or an antigen-binding fragment thereof used in the prevention or treatment of cancer, a chimeric antigen receptor including the same, and uses thereof. The antibody of the present disclosure is an antibody that specifically binds to HER2 which is highly expressed in cancer cells (particularly, breast cancer or gastric cancer cells), and binds to an epitope that is different from an epitope to which trastuzumab binds.

Abstract: Provided are display panel manufacturing method and apparatus. The display panel manufacturing method includes detecting a machining target area of a bottom layer, removing an area, overlapping the machining target area, of a top layer, emitting a laser beam to the machining target area of the bottom layer to provide a bottom pattern from the machining target area, and providing a compensation pattern in the removed area of the top layer.

Abstract: A method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.

Abstract: Provided is a semiconductor package. The semiconductor package includes a redistribution line structure comprising a plurality of redistribution line patterns; a first semiconductor chip and a second semiconductor chip on the redistribution line structure and spaced apart from each other; a bridge structure between the first semiconductor chip, the second semiconductor chip, and the redistribution line structure and comprising a plurality of connection wiring patterns configured to electrically connect the first semiconductor chip to the second semiconductor chip; and a molding layer surrounding a sidewall of the bridge structure and filled between the first semiconductor chip, the second semiconductor chip, and the redistribution line structure and between the first semiconductor chip and the second semiconductor chip, wherein lowermost surfaces of the plurality of connection wiring patterns are above uppermost surfaces of the plurality of redistribution line patterns.

Abstract: The present disclosure relates to a display device, and the display device according to an embodiment includes: a substrate including a display area and a peripheral area; a plurality of light-emitting elements positioned in a display area; a plurality of pixel circuits connected to a plurality of light-emitting elements, respectively; a sensor positioned on the peripheral area of the substrate; a leakage current detecting circuit connected to the sensor; and a light emitting wiring connected to the leakage current detecting circuit and connected to at least one of the plurality of light-emitting elements, wherein the sensor includes a first sensor and the first sensor includes a first sensing transistor, and a first conductive pattern spaced apart from the channel of the first sensing transistor, and the first conductive pattern is positioned in the same layer as at least one of a plurality of layers configuring the transistor.

Abstract: A three-dimensional semiconductor device includes: a source structure including a cell region and an extension region; a gate stacking structure disposed on the source structure, the gate stacking structure including insulating patterns and conductive patterns, which are alternately stacked on each other; an insulating structure disposed on the gate stacking structure, the insulating structure including a plurality of insulating layers; a memory channel structure penetrating the gate stacking structure and electrically connected to the cell region; a separation structure penetrating the gate stacking structure and extending from the cell region to the extension region; and a penetration plug penetrating the gate stacking structure and the extension region, wherein the penetration plug includes: a first plug portion penetrating the gate stacking structure; and a second plug portion on the first plug portion, wherein the separation structure includes: a first separation portion penetrating the gate stacking str

Abstract: A fuel cell system includes a first converter to convert power, which is output from a fuel cell stack or a battery, into power in a specific level, a second converter to convert power which is input to or output from the battery, a power relay assembly to control power flow between a super capacitor and the first converter, and a controller to control outputs of the first converter and the second converter, depending on a starting state or an operating state of the fuel cell system, and to control an operation of the power relay assembly.

Abstract: A fuel cell system includes a first converter to convert power, which is output from a fuel cell stack or a battery, into power in a specific level, a second converter to convert power which is input to or output from the battery, a power relay assembly to control power flow between a super capacitor and the first converter, and a controller to control outputs of the first converter and the second converter, depending on a starting state or an operating state of the fuel cell system, and to control an operation of the power relay assembly.