Abstract: An apparatus includes a lighting unit configured to irradiate a light emitting device package including a light transmitting resin containing a light conversion material with light having a certain color; a camera configured to capture an image of the light emitting device package; and a controller configured to determine color coordinates of the light emitting device package using the image, captured by the camera, to determine whether the light emitting device package is defective.

Abstract: A resin dispensing apparatus is provided. The resin dispensing apparatus includes an external body portion including a discharge nozzle configured to discharge a phosphor-containing resin, and an internal body portion including at least one flow passage, the internal body portion being mounted within the external body portion. An axial length of the internal body portion is shorter than an axial length of the external body portion.

Abstract: An apparatus includes a lighting unit configured to irradiate a light emitting device package including a light transmitting resin containing a light conversion material with light having a certain color; a camera configured to capture an image of the light emitting device package; and a controller configured to determine color coordinates of the light emitting device package using the image, captured by the camera, to determine whether the light emitting device package is defective.

Abstract: Disclosed is a semiconductor device and its manufacturing method. By way of example, the semiconductor device includes a semiconductor die for sensing an external physical quantity, an insulating gel covering the semiconductor die, and an encapsulant which covers the insulating gel while the insulating gel is partially exposed to the exterior. Also, another semiconductor device further includes a dummy plate which has a hole and is seated on the insulating gel. In the manufacturing method of a semiconductor device, a mold having a through hole is provided and the through hole include a structure consisting of a movable pin and a spring for absorbing the expansion of the insulating gel during an encapsulation process. Also, another manufacturing method of a semiconductor device includes performing the encapsulation while the dummy plate is seated on the insulating gel.