Patents by Inventor Young-Hyuk JOO

Young-Hyuk JOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11028266
    Abstract: A curable organopolysiloxane composition, a Light Emitting Diode (LED) encapsulant and a semiconductor device, employ a curable organopolysiloxane composition containing a branched organopolysiloxane bearing alkenyl groups and aryl groups, a linear organopolysiloxnae bearing terminal Si—H functionality, and a low molecular weight component having at least one alkenyl group. As an encapsulant, the composition displays improved stability.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: June 8, 2021
    Assignee: WACKER CHEMIE AG
    Inventors: Hyun-Kwan Yang, Young-Hyuk Joo, Young-Jin Kim, Arvid Kuhn
  • Patent number: 10696846
    Abstract: Unique compositions containing organopolysiloxanes having both silicon-bonded hydrogen and aliphatically unsaturated groups exhibit robust processing characteristics and provide coatings or encapsulations of high transparency which can withstand numerous temperature cycles without failure.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: June 30, 2020
    Assignee: WACKER CHEMIE AG
    Inventors: Frank Sandmeyer, Arvid Kuhn, Young-Hyuk Joo, Hyun-Kwan Yang
  • Patent number: 10655014
    Abstract: Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 19, 2020
    Assignee: WACKER CHEMIE AG
    Inventors: Arvid Kuhn, Young-Hyuk Joo, Frank Sandmeyer, Hyun-Kwan Yang
  • Publication number: 20190194458
    Abstract: A curable organopolysiloxane composition, a Light Emitting Diode (LED) encapsulant and a semiconductor device, employ a curable organopolysiloxane composition containing a branched organopolysiloxane bearing alkenyl groups and aryl groups, a linear organopolysiloxnae bearing terminal Si—H functionality, and a low molecular weight component having at least one alkenyl group. As an encapsulant, the composition displays improved stability.
    Type: Application
    Filed: August 12, 2016
    Publication date: June 27, 2019
    Applicant: Wacker Chemie AG
    Inventors: Hyun-Kwan YANG, Young-Hyuk JOO, Young-Jin KIM, Arvid KUHN
  • Publication number: 20180371246
    Abstract: Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.
    Type: Application
    Filed: December 7, 2016
    Publication date: December 27, 2018
    Applicant: Wacker Chemie AG
    Inventors: Arvid KUHN, Young-Hyuk JOO, Frank SANDMEYER, Hyun-Kwan YANG
  • Publication number: 20180371173
    Abstract: Unique compositions containing organopolysiloxanes having both silicon-bonded hydrogen and aliphatically unsaturated groups exhibit robust processing characteristics and provide coatings or encapsulations of high transparency which can withstand numerous temperature cycles without failure.
    Type: Application
    Filed: December 7, 2016
    Publication date: December 27, 2018
    Applicant: Wacker Chemie AG
    Inventors: Frank SANDMEYER, Arvid KUHN, Young-Hyuk JOO, Hyun-Kwan YANG