Patents by Inventor Young Il Kang
Young Il Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240158822Abstract: Disclosed herein are a microorganism with excellent deacetoxycephalosporin C (DAOC) productivity and a use thereof. A mutant microorganism with improved DAOC productivity and a use thereof for producing 7-aminodeacetoxycephalosporanic acid (7-ADCA) are provided.Type: ApplicationFiled: October 17, 2023Publication date: May 16, 2024Inventors: Zhe PIAO, Young sung YUN, Hyeon Seo LEE, Yeon Hee CHOI, Mi Suk KANG, Xue Mei PIAO, You Mi KIM, Ji Su LEE, Hong Xian LI, Dong Il SEO, Dong Won JEONG, Seung Ki KIM
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Patent number: 11976975Abstract: Provided is an optical system which may acquire a hyperspectral image by acquiring a spectral image of an object to be measured, which includes, to collect spectral data and train the neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, a slit moving to scan the incident image and passing and outputting a part of the formed image, and a first optical part obtaining spectral data by splitting light of the image received through the slit by wavelength. Also, the system includes, to decompose overlapped spectral data and to infer hyperspectral image data through the trained neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, and a first optical part obtaining spectral data by splitting light of the received image by wavelength.Type: GrantFiled: January 7, 2022Date of Patent: May 7, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Keo Sik Kim, Kye Eun Kim, Jeong Eun Kim, Hyun Seo Kang, Hyun Jin Kim, Gi Hyeon Min, Si Woong Park, Hyoung Jun Park, Chan Il Yeo, Young Soon Heo
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Patent number: 11952490Abstract: The present disclosure relates to a polycarbonate resin composition, and more particularly, to a polycarbonate resin composition containing 90 wt % to 99 wt % of a polycarbonate resin, 0.3 wt % to 0.7 wt % of an anthraquinone-based black dye, and 0.2 wt % to 1.0 wt % of an acrylic polymeric chain extender, and a molded article containing the same.Type: GrantFiled: July 27, 2021Date of Patent: April 9, 2024Assignees: HYUNDAI MOBIS CO., LTD., LG CHEM, LTD.Inventors: Hyoung Taek Kang, Keun Hyung Lee, Young Min Kim, Moo Seok Lee, Myeung Il Kim, Jae Chan Park
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Publication number: 20240112002Abstract: Disclosed is an interface system including a first neuron cluster that outputs a first neuron signal including a first neuron request and first neuron data by performing a first arithmetic operation, and a first interface circuit that stores the first neuron data and outputs a first response, in response to the first neuron request. The first neuron cluster outputs a second neuron signal including a second neuron request and second neuron data by performing a second arithmetic operation, in response to the first response. Before the first data is transmitted to a second neuron cluster different from the first neuron cluster, the first interface circuit outputs the first response in response to a fact that the first neuron data is stored.Type: ApplicationFiled: June 29, 2023Publication date: April 4, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Young Hwan BAE, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In San JEON
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Patent number: 11927890Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.Type: GrantFiled: August 22, 2022Date of Patent: March 12, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seok Heo, Cha Won Koh, Sang Joon Hong, Hyun Woo Kim, Kyung-Won Kang, Dong-Wook Kim, Kyung Won Seo, Young Il Jang, Yong Suk Choi
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Patent number: 11459989Abstract: The present disclosure relates to a clip for an injector, in particular, the clip for the injector including a base portion and an elastic piece of the clip that elastically support the upper surface of a connector housing and the lower surface of an injector cup, thus attenuating fuel injection load. In addition, an engaging piece of the clip is inserted into an engaging portion of the injector cup, thus preventing the rotation of the injector.Type: GrantFiled: June 21, 2018Date of Patent: October 4, 2022Assignee: Hyundai Kefico CorporationInventors: Seung Hyuk Oh, Young Il Kang, Kwang Won Koo, Yeon Jee Oh
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Patent number: 10612507Abstract: Disclosed herein is a mounting structure of a fuel rail, including a mounting boss part having a through-hole formed in a longitudinal direction and a first mating surface formed at an outer surface, an injector cup part provided separately from the mounting boss part and having a second mating surface formed at an outer surface and a flow path hole formed at one side of the second mating surface to be connected to the main pipe for transferring fuel to an injector, and a bridge part connecting the mounting boss part and the injector cup part and having a third mating surface. The mounting structure of the fuel rail can effectively distribute stress concentration by increasing contact area with the main pipe, thereby improving fatigue strength.Type: GrantFiled: April 13, 2018Date of Patent: April 7, 2020Assignee: HYUNDAI KEFICO CORPORATIONInventors: Seung Hyuk Oh, Young Il Kang, Kwang Won Koo, Myeong Hun Kweon, Yeon Jee Oh
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Patent number: 10094351Abstract: An injector clip includes a lower plate formed to support a fuel injection portion of an injector, a base plate is formed to engage with and support a connection portion of the injector and an engagement support portion elastically supports the lower plate and the base plate to return the fuel injection portion to an original position after being displaced. A spring arm is formed by extending from the base plate to support a fuel inlet portion of the injector. Accordingly the load resulting from fuel injection of a fuel injector is attenuated and p a fuel injection device is prevented from rotating.Type: GrantFiled: June 13, 2017Date of Patent: October 9, 2018Assignee: HYUNDAI KEFICO CORPORATIONInventors: Seung Hyuk Oh, Young Il Kang, Kwang Won Koo, Myeong Hun Kweon, Yeon Jee Oh
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Publication number: 20170356413Abstract: An injector clip includes a lower plate formed to support a fuel injection portion of an injector, a base plate is formed to engage with and support a connection portion of the injector and an engagement support portion elastically supports the lower plate and the base plate to return the fuel injection portion to an original position after being displaced. A spring arm is formed by extending from the base plate to support a fuel inlet portion of the injector. Accordingly the load resulting from fuel injection of a fuel injector is attenuated and p a fuel injection device is prevented from rotating.Type: ApplicationFiled: June 13, 2017Publication date: December 14, 2017Inventors: Seung Hyuk Oh, Young Il Kang, Kwang Won Koo, Myeong Hun Kweon, Yeon Jee Oh
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Patent number: 9620927Abstract: A high-order harmonic wave generation apparatus using a diode-pumped solid state laser includes a pump head for generating a fundamental wave, Porro prisms disposed on the left and right sides of the pump head, nonlinear crystals for sequentially generating a second-order harmonic wave, a fourth-order harmonic wave, and a fifth-order harmonic wave from the fundamental wave, and a final emission unit for reflecting and transmitting any one of the second-order harmonic wave, the fourth-order harmonic wave, and the fifth-order harmonic wave and for emitting the harmonic wave without changing the optical path. Accordingly, the apparatus is insensitive to changes in the external environment through a resonator having a structure comprising Porro prisms, and enables the final emission unit to selectively output the fourth-order harmonic wave or the fifth-order harmonic wave.Type: GrantFiled: March 8, 2016Date of Patent: April 11, 2017Assignee: AGENCY FOR DEFENSE DEVELOPMENTInventors: Yeon-Chul Ha, Jae-Hwan Lee, Young-Il Kang, Ki-Ho Cho, Jae-Ihn Kim, Joon-Young Cho
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Publication number: 20170047704Abstract: A high-order harmonic wave generation apparatus using a diode-pumped solid state laser includes a pump head for generating a fundamental wave, Porro prisms disposed on the left and right sides of the pump head, nonlinear crystals for sequentially generating a second-order harmonic wave, a fourth-order harmonic wave, and a fifth-order harmonic wave from the fundamental wave, and a final emission unit for reflecting and transmitting any one of the second-order harmonic wave, the fourth-order harmonic wave, and the fifth-order harmonic wave and for emitting the harmonic wave without changing the optical path. Accordingly, the apparatus is insensitive to changes in the external environment through a resonator having a structure comprising Porro prisms, and enables the final emission unit to selectively output the fourth-order harmonic wave or the fifth-order harmonic wave.Type: ApplicationFiled: March 8, 2016Publication date: February 16, 2017Inventors: Yeon-Chul HA, Jae-Hwan LEE, Young-Il KANG, Ki-Ho CHO, Jae-Ihn KIM, Joon-Young CHO
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Patent number: 7494909Abstract: Provided are a chip, a chip stack, and a method of manufacturing the same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a predetermined thickness from the bottom of the wafer and is formed in a via hole exposing the bottom of the pad are stacked such that the pad and the metal layer of adjacent chips are bonded. This leads to a simplified manufacturing process, high chip performance and a small footprint for a chip stack.Type: GrantFiled: August 3, 2006Date of Patent: February 24, 2009Assignee: Electronics and Telecommunications Research InstituteInventors: Chull Won Ju, Byoung Gue Min, Seong Il Kim, Jong Min Lee, Kyung Ho Lee, Young Il Kang