Patents by Inventor Young-Il Lee

Young-Il Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140191837
    Abstract: The present invention relates to a coil element including a ceramic body and an internal electrode coil pattern formed on the ceramic body, wherein the ceramic body includes NiZnMn ferrite and the internal electrode coil pattern uses copper, and a method for manufacturing the same. The NiZnMn ferrite in accordance with the present invention can greatly increase a sintering process window and implement characteristics of a material through a single sintering process by suppressing conductivity due to generation of deposits inside the NiZn ferrite material in a thin oxygen atmosphere through addition of Mn to the conventional NiZn ferrite composition to increase a resistivity of the material.
    Type: Application
    Filed: January 2, 2014
    Publication date: July 10, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byeong Cheol MOON, Soo Hwan SON, So Yeon SONG, Young IL LEE, Sung Eun KIM
  • Publication number: 20140156112
    Abstract: A hands-free power tailgate system includes an antenna, a sensor, a first unit, a second unit, and a third unit. The antenna is configured to transfer a signal for authentication for a user to a smart key and receive an authentication code from the smart key. The sensor senses a movement in rear of the vehicle. The first unit receives the authentication code from the antenna to authenticate the user and outputs a sensor activation signal and authentication information when the authentication for the user is completed. The second unit activates the sensor according to the sensor activation signal, senses a movement of the user, and outputs movement information of the user. The third unit opens a tailgate using the authentication information from the first unit and the movement information from the second unit when the user moves according to a preset moving pattern.
    Type: Application
    Filed: March 28, 2013
    Publication date: June 5, 2014
    Applicant: HYUNDAI MOTOR COMPANY
    Inventor: Young Il LEE
  • Publication number: 20140139308
    Abstract: Disclosed herein is a multilayer coil component, in which a copper-nickel mixture is used for an internal electrode, to form a nickel and ferrite mixed region at an interface between the internal electrode layer and a ceramic layer, thereby interrupting contact between the ceramic layer and the internal electrode, so that insulation resistance, which may be generated between the two materials can be increased and thus the deterioration in the characteristics of the multilayer coil component can be prevented.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan SON, Byeong Cheol MOON, So Yeon SONG, Young Il LEE
  • Publication number: 20130321118
    Abstract: There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component manufactured by using the same, and a manufacturing method thereof. The non-magnetic composition for a ceramic electronic component includes a compound represented by ZnCuTiO4 such that the inductance decreasing rate at the high current and the capacitance rate of change of the magnetic body after the application of current according to the temperature change are insensitive, whereby the stable operational characteristics of the ceramic electronic component may be secured.
    Type: Application
    Filed: August 14, 2012
    Publication date: December 5, 2013
    Inventors: Sung Yong AN, Min Kyoung Cheon, Ho Yoon Kim, Young Il Lee, Myeong Gi Kim
  • Publication number: 20130249645
    Abstract: There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component using the same, and a method of manufacturing the same. The non-magnetic composition includes a compound represented by Chemical Formula Zn1-xCuxMn2O4. Therefore, DC bias characteristics of the ceramic electronic component may be improved by employing the non-magnetic composition having no magnetic characteristics.
    Type: Application
    Filed: June 29, 2012
    Publication date: September 26, 2013
    Inventors: Ho Yoon KIM, Min Kyoung Cheon, Sung Yong An, Young Il Lee, Myeong Gi Kim
  • Publication number: 20130222174
    Abstract: An apparatus for providing obstacle information in an autonomous mobile vehicle and a method thereof, in which a target object is determined to be what obstacle by combining pieces of information received from a laser distance sensor and radars, thereby enabling the autonomous driving of a vehicle. The apparatus and method for providing obstacle information in an autonomous mobile vehicle, which is capable of providing robust obstacle information not only in environments normal times, but also dust environments by combining a laser distance sensor and radar data radars. A problem that an obstacle through which a mobile unit can pass, such as dust, is mistaken for an obstacle through which the mobile unit cannot pass can be solved.
    Type: Application
    Filed: September 14, 2011
    Publication date: August 29, 2013
    Inventors: Tok Son Choe, Yoon Woon Park, Young Il Lee
  • Publication number: 20130069014
    Abstract: Disclosed is a conductive paste composition for low temperature firing, including conductive copper powder composed of flake powder, spherical powder and nano powder, a melamine-based binder, and an organic solvent, thus enabling the formation of a conductive wire having a high aspect ratio with high printability, and inexpensive formation of a metal wire, and exhibiting superior electrical properties and adhesive force even when conducting low temperature firing at 200° C. or less, so that the conductive paste composition can be usefully applied as a conductive material for forming electrodes of a variety of products such as solar cells, touch panels, printed circuit boards (PCBs), radio-frequency identification (RFID), plasma display panels (PDPs) and so on.
    Type: Application
    Filed: December 21, 2011
    Publication date: March 21, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Dong Hoon Kim, Jun Young Kim, Ji Han Kwon, Sung Eun Kim
  • Patent number: 8389601
    Abstract: The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: March 5, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-Hoon Kim, Dong-Hoon Kim, Byung-Ho Jun, Joon-Rak Choi, Young-Kwan Seo, Young-Il Lee
  • Patent number: 8388725
    Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: March 5, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Il Lee, Jae-Woo Joung, Byung-Ho Jun, Joon-Rak Choi, Kwi-Jong Lee
  • Patent number: 8343254
    Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: January 1, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Il Lee, Jae Woo Jung, In Keun Shim
  • Patent number: 8187504
    Abstract: Provided is a metal nanoparticle dispersion capable of suppressing spreadability at a room temperature and drying phenomenon at heating temperature. The metal nanoparticle dispersion includes metal particles; and an organic solvent having a viscosity of 10 mPa·s or more at a room temperature and a flash point of 100° C. or above.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: May 29, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Il Lee, Dong Hoon Kim, Kwi Jong Lee
  • Publication number: 20120049131
    Abstract: Disclosed herein are an electroconductive paste and a method for fabricating the same. The electroconductive paste includes: metal nano powders having an aspect ratio of 1 to 2; and metal nano bars having an aspect ratio 3 to 300.
    Type: Application
    Filed: February 14, 2011
    Publication date: March 1, 2012
    Inventors: Young Il LEE, Seong Jin Kim, Dong Hoon Kim, Sung Eun Kim
  • Patent number: 7935169
    Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: May 3, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Il Lee, Jae-Woo Joung, Byung-Ho Jun, Joon-Rak Choi, Kwi-Jong Lee
  • Publication number: 20110040014
    Abstract: The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
    Type: Application
    Filed: December 11, 2009
    Publication date: February 17, 2011
    Inventors: Tae-Hoon Kim, Dong-Hoon Kim, Byung-Ho Jun, Joon-Rak Choi, Young-Kwan Seo, Young-Il Lee
  • Publication number: 20110030999
    Abstract: The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property.
    Type: Application
    Filed: December 9, 2009
    Publication date: February 10, 2011
    Inventors: Young-Il LEE, Sung-Eun Kim, Tae-Hoon Kim, Young-Kwan Seo
  • Publication number: 20100319489
    Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
    Type: Application
    Filed: August 4, 2010
    Publication date: December 23, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young-Il LEE, Jae-Woo Joung, Byung-Ho Jun, Joon-Rak Choi, Kwi-Jong Lee
  • Patent number: 7795055
    Abstract: There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: September 14, 2010
    Assignee: Samsung LED Co., Ltd.
    Inventors: Young Il Lee, Jae Woo Joung, Joon Rak Choi
  • Publication number: 20100101370
    Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.
    Type: Application
    Filed: October 21, 2009
    Publication date: April 29, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Jae Woo Jung, In Keun Shim
  • Publication number: 20100078604
    Abstract: Nickel nanoparticles including an aqueous solution including a nickel precursor, a surfactant, a hydrophobic solvent, and distilled water, the hydrophobic solvent being one or more compounds selected from the group consisting of hexane, cyclohexane, heptane, octane, isooctane, decane, tetradecane, hexadecane, toluene, xylene, 1-octadecene, and 1-hexadecene; a compound including hydrazine which is added to the aqueous solution to form a nickel-hydrazine complex; and a reducing agent added to the compound including the nickel-hydrazine complex.
    Type: Application
    Filed: December 2, 2009
    Publication date: April 1, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Il Lee, Jae-Woo Joung, Kwi-Jong Lee
  • Publication number: 20100051329
    Abstract: Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method.
    Type: Application
    Filed: April 23, 2009
    Publication date: March 4, 2010
    Inventors: Tae-Hoon KIM, Dong-Hoon Kim, Young-Il Lee, Sang-Gyun Lee, Byung-Ho Jun, Da-Mi Shim