Abstract: A bit-line sense amplifier may include a pull-up driving circuit, a pull-down driving circuit and a latch-type sense amplifier. The pull-up driving circuit including a plurality of PMOS transistors connected between a power supply voltage line and a first driving power supply line, and may be configured to provide a first driving current on the first driving power supply line in response to an up control signal. The pull-down driving circuit may be configured to provide a second driving current on a second driving power supply line in response to a down control signal. The latch-type sense amplifier may be connected between the first driving power supply line and the second driving power supply line, and may be configured to sense and amplify a voltage difference between a bit line and a complementary bit line.

Abstract: Provided are a system and method for manufacturing a semiconductor package. The system includes: a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip; and a laser saw configured to irradiate a second laser beam on the strip to cut the strip into individual semiconductor packages.

Abstract: A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.

Abstract: The present invention provides an LED bulb using heat dissipating LED driver capable of reducing heat influence by disposing an electrolytic capacitor in an output part at a low temperature region through disposing a section receiving an external power close to a light generating module and disposing a section controlling a light emitting diode dose to a power source base.

Abstract: An electronic display panel comprising a plastic substrate; a bottom shield metal (BSM) on the plastic substrate; a thin-film transistor (TFT) on the BSM, the TFT and the BSM at least partially overlapping each other; and an active buffer layer between the TFT and the BSM, wherein the BSM is connected to one of a gate electrode, a source electrode, and a drain electrode of the TFT. A bottom shield metal (BSM) on the plastic substrate, the BSM located to minimize formation of a back channel in a pixel circuit by trapped charges of the plastic substrate, the pixel circuit in a pixel area defined by a gate line and a data line on the plastic substrate, the pixel circuit on the active buffer layer including a plurality of TFTs and a plurality of component interconnecting nodes.

Abstract: A synchronous direct current (DC)-DC buck converter and a method of controlling the waveforms of switching signals disclosed herein. The synchronous DC-DC buck converter generates a stepped-down output voltage using a first switch configured to apply an input voltage to an inductor and a second switch configured to switch in response to a second switching signal. The synchronous DC-DC buck converter includes a sawtooth generation unit, a driver oscillating signal generation unit, a switching signal generation unit, and a phase tracking unit. The sawtooth generation unit generates a sawtooth wave. The driver oscillating signal generation unit generates an error voltage between the output voltage and a reference voltage, and compares the sawtooth wave with the error voltage, so as to generate a driver oscillating signal. The switching signal generation unit generates each of the first and second switching signals. The phase tracking unit generates the frequency setting signal.

Abstract: Disclosed herein is an apparatus for inspecting a touch panel and a method thereof, the apparatus includes a capacitance measuring unit measuring capacitance value of a number of regions set on a touch panel, and a defect determining unit determining whether or not a specific region is defective, by comparing the capacitance value of the specific region with the capacitance value of an adjacent region. According to the present embodiments, a touch panel having an improved defect detection ability and a method thereof, by comparing with capacitance of regions adjacent to each other, are provided.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: Disclosed is a pharmaceutical composition, comprising: a) at least one sorbitan unsaturated fatty acid ester having a polar head with at least two or more —OH (hydroxyl) groups; b) at least one phospholipid; c) at least one liquid crystal hardener which is free of an ionizable group and has a triacyl group with 15 to 40 carbon atoms or a carbon ring structure in a hydrophobic moiety; and d) at least one GnRH (gonadotropin-releasing hormone) analogue as a pharmacologically active substance, wherein said lipid pre-concentrate exists as a liquid phase in absence of aqueous fluid and forms into a liquid crystal in presence of aqueous fluid. The pharmaceutical composition is configured to enhance the sustained release of the pharmacologically active substance GnRH analogue.

Abstract: Disclosed is a sustained-release lipid pre-concentrate, comprising: a) at least one liquid crystal former; b) at least one neutral phospholipid; c) at least one liquid crystal hardener; and d) at least one anionic anchoring agent, wherein the sustained-release pre-concentrate exists as a lipid liquid phase in the absence of aqueous fluid and forms into a liquid crystal upon exposure to aqueous fluid. The sustained-release lipid pre-concentrate is configured to enhance the sustained release of cationic pharmacologically active substance through ionic interaction between the anionic anchoring agent and the cationic pharmacologically active substance.

Abstract: A synchronous direct current (DC)-DC buck converter and a method of controlling the waveforms of switching signals disclosed herein. The synchronous DC-DC buck converter generates a stepped-down output voltage using a first switch configured to apply an input voltage to an inductor and a second switch configured to switch in response to a second switching signal. The synchronous DC-DC buck converter includes a sawtooth generation unit, a driver oscillating signal generation unit, a switching signal generation unit, and a phase tracking unit. The sawtooth generation unit generates a sawtooth wave. The driver oscillating signal generation unit generates an error voltage between the output voltage and a reference voltage, and compares the sawtooth wave with the error voltage, so as to generate a driver oscillating signal. The switching signal generation unit generates each of the first and second switching signals. The phase tracking unit generates the frequency setting signal.

Abstract: The present invention provides small peptide fragments derived from the NF-?B p65 subunit and a pharmaceutical or cosmetic composition comprising the same. The peptides have a NF-?B inhibitory activity, through controlling the transcription-activation of NF-?B. The peptides inhibit the expressions of pro-inflammatory mediators, which are induced by NF-?B, and also inhibit the transmigration of leukocytes, thereby exhibiting an anti-inflammatory activity. Especially, the peptides have excellent inhibitory activities against dermatitis and skin aging. And also, the peptides inhibit base membrane invasion of cancer cells, thereby exhibiting an inhibitory activity against the growth and/or metastasis of cancer cells.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: A mammography apparatus minimizes the displeasure experienced by a human during x-ray operations, the displeasure being generated by a low temperature of a portion of the mammography apparatus making contact with the human body. The displeasure is minimized by increasing and maintaining the temperature of the portion of the mammography apparatus. The mammography apparatus includes an x-ray generating unit to generate x-rays, and an x-ray detecting unit having a detector to obtain x-ray data by detecting the x-ray passing through a subject. The x-ray detecting unit includes a housing forming an outer appearance of the x-ray detecting unit, a thermoelectric element provided at an inside the housing, and is disposed such that a cooling unit faces a lower surface of the detector, and a heat pipe extends to an inner side surface of the housing from a heat generating unit of the thermoelectric element.

Abstract: A flexible display device including a touch sensor is disclosed. In one aspect, the display device includes a flexible substrate, a light emission layer formed over the flexible substrate, and an encapsulation layer formed over the light emission layer and comprising a plurality of encapsulating thin films and a touch detecting layer configured to detect a touch input. The encapsulating thin films include at least one inorganic film and at least one organic film and the touch detecting layer is interposed between a selected one of the at least one inorganic film and a selected one of the at least one organic film that are adjacent to each other.

Abstract: Disclosed is a radiation diagnostic apparatus that includes an examination table that has a length in a first direction, a fixing frame that is fixedly disposed on a floor to be separated from the examination table in the first direction and includes a guide member provided in the first direction, a transfer frame that contacts the guide member and moves along the first direction with respect to the fixing frame, a first rotary arm that is rotatably connected to the transfer frame, and a second rotary arm that is rotatably connected to the first rotary arm and is provided for a radiation source and a radiation detector to face each other.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of fabricating a semiconductor device comprises loading a circuit board including a semiconductor chip into underfill equipment, positioning the circuit board on a depositing chuck of the underfill equipment, filling an underfill material in a space between the semiconductor chip and the circuit board placed on the depositing chuck; transferring the circuit board including the underfill material so that it is positioned on a post-treatment chuck of the underfill equipment; heating the underfill material of the circuit board placed on the post-treatment chuck in a vacuum state, and unloading the circuit board, of which the underfill material has been heated in the vacuum state, from the underfill equipment.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A semiconductor memory device having an open bitline memory structure from which an edge dummy memory block is removed, the semiconductor memory device includes a memory block, an edge sense amplification block including a first sense amplifier having a first bitline, a first complementary bitline, and a first amplification circuit comprising a first transistor having a first size, a central sense amplification block including a second sense amplifier having a second bitline, a second complementary bitline, and a second amplification circuit comprising a second transistor having a second size different from the first size, a capacitor block electrically connected to the edge sense amplification block.