Abstract: A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

Abstract: A semiconductor package includes a package substrate including a substrate connection pad. At least one semiconductor chip includes at least one redistribution layer. The at least one redistribution layer covers at least a portion of a chip connection pad and extends along an upper surface of the at least one semiconductor chip in a first direction in which the chip connection pad faces toward an edge of the at least one semiconductor chip. At least one interconnection line disposed on a side of the at least one semiconductor chip electrically connects the substrate connection pad to the at least one redistribution layer. The at least one redistribution layer includes a protruding portion protruding from the edge of the at least one semiconductor chip to contact the at least one interconnection line.