Patents by Inventor Young Jae Song
Young Jae Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9631857Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.Type: GrantFiled: July 7, 2016Date of Patent: April 25, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seok Jun Yoon, Young Jae Song, Seung Yong Yang, Sung Sik Moon, Ho June Jeon, Kyung Han Jeong
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Patent number: 9568238Abstract: A refrigerator in which an opening having a size corresponding to the size of a refrigerator compartment is provided in a refrigerator compartment door and an outer door to open/close the opening is rotatably coupled to the refrigerator compartment door so that a plurality of door guards provided in a space corresponding to the size of the refrigerator compartment may be used by only opening/closing the outer door, and the refrigerator compartment door and the outer door may be rotated on one hinge shaft and the outer door has an auto closing structure so that the outer door may be automatically closed when a predetermined portion of the outer door is opened.Type: GrantFiled: November 8, 2013Date of Patent: February 14, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok Kim, Young Jae Song, Seung Yong Yang, Gang U Lee
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Patent number: 9515143Abstract: A method of manufacturing a heterogeneous layered structure includes growing a hexagonal boron nitride sheet directly on a metal substrate in a chamber, increasing a temperature of the chamber to about 300° C. to about 1500° C., and forming a graphene sheet on the hexagonal boron nitride sheet by supplying a carbon source into the chamber while thermally treating the hexagonal boron nitride sheet at the increased temperature.Type: GrantFiled: March 14, 2014Date of Patent: December 6, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung-joo Lee, Young-jae Song, Min Wang, Sung-kyu Jang, Jae-young Choi
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Publication number: 20160315239Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.Type: ApplicationFiled: July 5, 2016Publication date: October 27, 2016Inventors: Chang Wook Kim, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
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Publication number: 20160313050Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a pivoting bar which seals a gap between a first door and a second door and a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.Type: ApplicationFiled: July 7, 2016Publication date: October 27, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seok Jun YOON, Young Jae SONG, Seung Yong YANG, Sung Sik MOON, Ho June JEON, Kyung Han JEONG
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Patent number: 9368177Abstract: Provided are a magnetic resistance structure, a method of manufacturing the magnetic resistance structure, and an electronic device including the magnetic resistance structure. The method of manufacturing the magnetic resistance structure includes forming a hexagonal boron nitride layer, forming a graphene layer on the boron nitride layer, forming a first magnetic material layer between the boron nitride layer and the graphene layer according to an intercalation process; and forming a second magnetic material layer on the graphene layer.Type: GrantFiled: May 20, 2014Date of Patent: June 14, 2016Assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate ColaborationInventors: Hwansoo Suh, Insu Jeon, Min-woo Kim, Young-jae Song, Min Wang, Qinke Wu, Sung-joo Lee, Sung-kyu Jang, Seong-jun Jung
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Patent number: 9287116Abstract: According to example embodiments, a method of forming a multilayer graphene structure includes forming a sacrificial layer on the growth substrate, growing a first graphene layer on the sacrificial layer using a chemical vapor deposition (CVD) method, and growing at least one more graphene layer on the growth substrate. The growing at least one more graphene layer includes removing at least a part of the sacrificial layer.Type: GrantFiled: June 19, 2014Date of Patent: March 15, 2016Assignees: Samsung Electronics Co., Ltd., Research & Business Foundation Sungkyunkwan UniversityInventors: Hwansoo Suh, Insu Jeon, Young-jae Song, Qinke Wu, Seong-jun Jung
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Patent number: 9279609Abstract: A refrigerator provided with an inner panel molded through injection molding while an accommodation groove in which an installation member is accommodated is formed at the inner panel, and as a gasket is installed at an installation groove of the installation member, the use of a complex mold such as a slide core is minimized while making it easy to install the gasket at the inner panel.Type: GrantFiled: November 5, 2013Date of Patent: March 8, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok Kim, Du Sic Kong, Young Jae Song, Seung Yong Yang
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Publication number: 20150214048Abstract: According to example embodiments, a method of forming a multilayer graphene structure includes forming a sacrificial layer on the growth substrate, growing a first graphene layer on the sacrificial layer using a chemical vapor deposition (CVD) method, and growing at least one more graphene layer on the growth substrate. The growing at least one more graphene layer includes removing at least a part of the sacrificial layer.Type: ApplicationFiled: June 19, 2014Publication date: July 30, 2015Applicant: Research & Business Foundation Sungkyunkwan UniversityInventors: Hwansoo SUH, Insu JEON, Young Jae SONG, Qinke WU, Seong-jun JUNG
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Patent number: 9091476Abstract: A refrigerator including a storage compartment, an inner door having an opening in a size corresponding to the storage compartment, a plurality of door guards provided at the opening, and an outer door to open/close the opening, the refrigerator further including a plurality of reinforcing members to prevent the inner door having the opening from being distorted.Type: GrantFiled: November 5, 2013Date of Patent: July 28, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok Kim, hyo Sik Kang, Hyun Sang Yoo, Young Jae Song, Seung Yong Yang
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Publication number: 20150131371Abstract: Provided are a magnetic resistance structure, a method of manufacturing the magnetic resistance structure, and an electronic device including the magnetic resistance structure. The method of manufacturing the magnetic resistance structure includes forming a hexagonal boron nitride layer, forming a graphene layer on the boron nitride layer, forming a first magnetic material layer between the boron nitride layer and the graphene layer according to an intercalation process; and forming a second magnetic material layer on the graphene layer.Type: ApplicationFiled: May 20, 2014Publication date: May 14, 2015Applicants: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate CollaborationInventors: Hwansoo SUH, Insu JEON, Min-woo KIM, Young-jae SONG, Min WANG, Qinke WU, Sung-joo LEE, Sung-kyu JANG, Seong-jun JUNG
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Publication number: 20140264282Abstract: A method of manufacturing a heterogeneous layered structure includes growing a hexagonal boron nitride sheet directly on a metal substrate in a chamber, increasing a temperature of the chamber to about 300° C. to about 1500° C., and forming a graphene sheet on the hexagonal boron nitride sheet by supplying a carbon source into the chamber while thermally treating the hexagonal boron nitride sheet at the increased temperature.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung-joo LEE, Young-jae SONG, Min WANG, Sung-kyu JANG, Jae-young CHOI
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Publication number: 20140132146Abstract: A refrigerator including a storage compartment, an inner door having an opening in a size corresponding to the storage compartment, a plurality of door guards provided at the opening, and an outer door to open/close the opening, the refrigerator further including a plurality of reinforcing members to prevent the inner door having the opening from being distorted.Type: ApplicationFiled: November 5, 2013Publication date: May 15, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok Kim, hyo Sik Kang, Hyun Sang Yoo, Young Jae Song, Seung Yong Yang
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Publication number: 20140132144Abstract: A refrigerator in which an opening having a size corresponding to the size of a refrigerator compartment is provided in a refrigerator compartment door and an outer door to open/close the opening is rotatably coupled to the refrigerator compartment door so that a plurality of door guards provided in a space corresponding to the size of the refrigerator compartment may be used by only opening/closing the outer door, and the refrigerator compartment door and the outer door may be rotated on one hinge shaft and the outer door has an auto closing structure so that the outer door may be automatically closed when a predetermined portion of the outer door is opened.Type: ApplicationFiled: November 8, 2013Publication date: May 15, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok KIM, Young Jae SONG, Seung Yong YANG, Gang U LEE
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Publication number: 20140132143Abstract: A refrigerator includes a storage compartment, an inner door including an opening having a size corresponding to the size of the storage compartment, a plurality of door guards disposed in the opening, and an outer door that opens or closes the opening, wherein the inner door includes inner sidewalls that are disposed at both sides of the opening and are flat from an inlet of the opening to an outlet of the opening without any curve.Type: ApplicationFiled: November 6, 2013Publication date: May 15, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok KIM, Yong Man Seo, Young Jae Song, Jae Hyun Lee
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Publication number: 20140132142Abstract: A refrigerator provided with an inner panel molded through injection molding while an accommodation groove in which an installation member is accommodated is formed at the inner panel, and as a gasket is installed at an installation groove of the installation member, the use of a complex mold such as a slide core is minimized while making it easy to install the gasket at the inner panel.Type: ApplicationFiled: November 5, 2013Publication date: May 15, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Mok KIM, DU SIC KONG, YOUNG JAE SONG, SEUNG YONG YANG
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Patent number: 8202746Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.Type: GrantFiled: September 4, 2008Date of Patent: June 19, 2012Assignee: Samsung LED Co., Ltd.Inventors: Seon Goo Lee, Geun Chang Ryo, Dong Yeoul Lee, Yong Tae Kim, Young Jae Song
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Patent number: 7663199Abstract: The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.Type: GrantFiled: May 30, 2006Date of Patent: February 16, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon Goo Lee, Hun Joo Hahm, Dae Yeon Kim, Young Jae Song, Young Sam Park, Chang Ho Song
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Publication number: 20090283792Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.Type: ApplicationFiled: July 28, 2009Publication date: November 19, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Wook KIM, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
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Publication number: 20090087931Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.Type: ApplicationFiled: September 4, 2008Publication date: April 2, 2009Inventors: Seon Goo LEE, Geun Chang Ryo, Dong Yeoul Lee, Yong Tae Kim, Young Jae Song