Patents by Inventor Young Jae Song

Young Jae Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9631857
    Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: April 25, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Jun Yoon, Young Jae Song, Seung Yong Yang, Sung Sik Moon, Ho June Jeon, Kyung Han Jeong
  • Patent number: 9568238
    Abstract: A refrigerator in which an opening having a size corresponding to the size of a refrigerator compartment is provided in a refrigerator compartment door and an outer door to open/close the opening is rotatably coupled to the refrigerator compartment door so that a plurality of door guards provided in a space corresponding to the size of the refrigerator compartment may be used by only opening/closing the outer door, and the refrigerator compartment door and the outer door may be rotated on one hinge shaft and the outer door has an auto closing structure so that the outer door may be automatically closed when a predetermined portion of the outer door is opened.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: February 14, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok Kim, Young Jae Song, Seung Yong Yang, Gang U Lee
  • Patent number: 9515143
    Abstract: A method of manufacturing a heterogeneous layered structure includes growing a hexagonal boron nitride sheet directly on a metal substrate in a chamber, increasing a temperature of the chamber to about 300° C. to about 1500° C., and forming a graphene sheet on the hexagonal boron nitride sheet by supplying a carbon source into the chamber while thermally treating the hexagonal boron nitride sheet at the increased temperature.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: December 6, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-joo Lee, Young-jae Song, Min Wang, Sung-kyu Jang, Jae-young Choi
  • Publication number: 20160315239
    Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
    Type: Application
    Filed: July 5, 2016
    Publication date: October 27, 2016
    Inventors: Chang Wook Kim, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
  • Publication number: 20160313050
    Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a pivoting bar which seals a gap between a first door and a second door and a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.
    Type: Application
    Filed: July 7, 2016
    Publication date: October 27, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Jun YOON, Young Jae SONG, Seung Yong YANG, Sung Sik MOON, Ho June JEON, Kyung Han JEONG
  • Patent number: 9368177
    Abstract: Provided are a magnetic resistance structure, a method of manufacturing the magnetic resistance structure, and an electronic device including the magnetic resistance structure. The method of manufacturing the magnetic resistance structure includes forming a hexagonal boron nitride layer, forming a graphene layer on the boron nitride layer, forming a first magnetic material layer between the boron nitride layer and the graphene layer according to an intercalation process; and forming a second magnetic material layer on the graphene layer.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: June 14, 2016
    Assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate Colaboration
    Inventors: Hwansoo Suh, Insu Jeon, Min-woo Kim, Young-jae Song, Min Wang, Qinke Wu, Sung-joo Lee, Sung-kyu Jang, Seong-jun Jung
  • Patent number: 9287116
    Abstract: According to example embodiments, a method of forming a multilayer graphene structure includes forming a sacrificial layer on the growth substrate, growing a first graphene layer on the sacrificial layer using a chemical vapor deposition (CVD) method, and growing at least one more graphene layer on the growth substrate. The growing at least one more graphene layer includes removing at least a part of the sacrificial layer.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: March 15, 2016
    Assignees: Samsung Electronics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Hwansoo Suh, Insu Jeon, Young-jae Song, Qinke Wu, Seong-jun Jung
  • Patent number: 9279609
    Abstract: A refrigerator provided with an inner panel molded through injection molding while an accommodation groove in which an installation member is accommodated is formed at the inner panel, and as a gasket is installed at an installation groove of the installation member, the use of a complex mold such as a slide core is minimized while making it easy to install the gasket at the inner panel.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: March 8, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok Kim, Du Sic Kong, Young Jae Song, Seung Yong Yang
  • Publication number: 20150214048
    Abstract: According to example embodiments, a method of forming a multilayer graphene structure includes forming a sacrificial layer on the growth substrate, growing a first graphene layer on the sacrificial layer using a chemical vapor deposition (CVD) method, and growing at least one more graphene layer on the growth substrate. The growing at least one more graphene layer includes removing at least a part of the sacrificial layer.
    Type: Application
    Filed: June 19, 2014
    Publication date: July 30, 2015
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Hwansoo SUH, Insu JEON, Young Jae SONG, Qinke WU, Seong-jun JUNG
  • Patent number: 9091476
    Abstract: A refrigerator including a storage compartment, an inner door having an opening in a size corresponding to the storage compartment, a plurality of door guards provided at the opening, and an outer door to open/close the opening, the refrigerator further including a plurality of reinforcing members to prevent the inner door having the opening from being distorted.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: July 28, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok Kim, hyo Sik Kang, Hyun Sang Yoo, Young Jae Song, Seung Yong Yang
  • Publication number: 20150131371
    Abstract: Provided are a magnetic resistance structure, a method of manufacturing the magnetic resistance structure, and an electronic device including the magnetic resistance structure. The method of manufacturing the magnetic resistance structure includes forming a hexagonal boron nitride layer, forming a graphene layer on the boron nitride layer, forming a first magnetic material layer between the boron nitride layer and the graphene layer according to an intercalation process; and forming a second magnetic material layer on the graphene layer.
    Type: Application
    Filed: May 20, 2014
    Publication date: May 14, 2015
    Applicants: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Hwansoo SUH, Insu JEON, Min-woo KIM, Young-jae SONG, Min WANG, Qinke WU, Sung-joo LEE, Sung-kyu JANG, Seong-jun JUNG
  • Publication number: 20140264282
    Abstract: A method of manufacturing a heterogeneous layered structure includes growing a hexagonal boron nitride sheet directly on a metal substrate in a chamber, increasing a temperature of the chamber to about 300° C. to about 1500° C., and forming a graphene sheet on the hexagonal boron nitride sheet by supplying a carbon source into the chamber while thermally treating the hexagonal boron nitride sheet at the increased temperature.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-joo LEE, Young-jae SONG, Min WANG, Sung-kyu JANG, Jae-young CHOI
  • Publication number: 20140132146
    Abstract: A refrigerator including a storage compartment, an inner door having an opening in a size corresponding to the storage compartment, a plurality of door guards provided at the opening, and an outer door to open/close the opening, the refrigerator further including a plurality of reinforcing members to prevent the inner door having the opening from being distorted.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok Kim, hyo Sik Kang, Hyun Sang Yoo, Young Jae Song, Seung Yong Yang
  • Publication number: 20140132144
    Abstract: A refrigerator in which an opening having a size corresponding to the size of a refrigerator compartment is provided in a refrigerator compartment door and an outer door to open/close the opening is rotatably coupled to the refrigerator compartment door so that a plurality of door guards provided in a space corresponding to the size of the refrigerator compartment may be used by only opening/closing the outer door, and the refrigerator compartment door and the outer door may be rotated on one hinge shaft and the outer door has an auto closing structure so that the outer door may be automatically closed when a predetermined portion of the outer door is opened.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok KIM, Young Jae SONG, Seung Yong YANG, Gang U LEE
  • Publication number: 20140132143
    Abstract: A refrigerator includes a storage compartment, an inner door including an opening having a size corresponding to the size of the storage compartment, a plurality of door guards disposed in the opening, and an outer door that opens or closes the opening, wherein the inner door includes inner sidewalls that are disposed at both sides of the opening and are flat from an inlet of the opening to an outlet of the opening without any curve.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok KIM, Yong Man Seo, Young Jae Song, Jae Hyun Lee
  • Publication number: 20140132142
    Abstract: A refrigerator provided with an inner panel molded through injection molding while an accommodation groove in which an installation member is accommodated is formed at the inner panel, and as a gasket is installed at an installation groove of the installation member, the use of a complex mold such as a slide core is minimized while making it easy to install the gasket at the inner panel.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Mok KIM, DU SIC KONG, YOUNG JAE SONG, SEUNG YONG YANG
  • Patent number: 8202746
    Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: June 19, 2012
    Assignee: Samsung LED Co., Ltd.
    Inventors: Seon Goo Lee, Geun Chang Ryo, Dong Yeoul Lee, Yong Tae Kim, Young Jae Song
  • Patent number: 7663199
    Abstract: The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: February 16, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon Goo Lee, Hun Joo Hahm, Dae Yeon Kim, Young Jae Song, Young Sam Park, Chang Ho Song
  • Publication number: 20090283792
    Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
    Type: Application
    Filed: July 28, 2009
    Publication date: November 19, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Wook KIM, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
  • Publication number: 20090087931
    Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.
    Type: Application
    Filed: September 4, 2008
    Publication date: April 2, 2009
    Inventors: Seon Goo LEE, Geun Chang Ryo, Dong Yeoul Lee, Yong Tae Kim, Young Jae Song