Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: Disclosed is a method of manufacturing a backlight unit, including: forming a plurality of LED recesses and a plurality of electrode recesses on a top surface of a flat panel-shaped lower glass; forming electrode patterns on the electrode recesses to supply current to LEDs; applying adhesives on the LED recesses; fixing the LEDs on the adhesives applied on the LED recesses; and stacking a flat panel-shaped upper glass on the top surface of the lower glass.