Patents by Inventor Young Ji Kim

Young Ji Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120244662
    Abstract: A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.
    Type: Application
    Filed: June 7, 2012
    Publication date: September 27, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd
    Inventors: Ji-Eun KIM, Nam-Keun Oh, Jung-Hyun Park, Young-Ji Kim, Jong-Gyu Choi, Sang-Duck Kim, Young-Hwan Shin, Kyung-Ro Yoon
  • Publication number: 20120100647
    Abstract: A method of manufacturing a flexible display device is provided. The method includes: preparing a first flexible substrate on which a display unit is formed; forming an encapsulation unit including a base substrate, a second flexible substrate formed on the base substrate, and a barrier layer formed on the second flexible substrate; combining the encapsulation unit with the display unit; and separating the base substrate from the second flexible substrate by using a difference between a coefficient of thermal expansion of the base substrate and a coefficient of thermal expansion of the second flexible substrate, by applying a heated solution between the base substrate and the second flexible substrate. The flexible display device is easily manufactured since the base substrate and the second flexible substrate, which have different coefficients of thermal expansion and are coupled to each other, are separable from each other by applying the heated solution.
    Type: Application
    Filed: September 23, 2011
    Publication date: April 26, 2012
    Applicant: Samsung Mobile Display Co., Ltd.
    Inventors: Seung-Hun Kim, Hoon-Kee Min, Dong-Un Jin, Sang-Joon Seo, Sung-Guk An, Young-Gu Kim, Hyung-Sik Kim, Young-Ji Kim
  • Publication number: 20110186342
    Abstract: A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.
    Type: Application
    Filed: February 1, 2011
    Publication date: August 4, 2011
    Inventors: Young-Ji KIM, Kyung-Ro Yoon, Sang-Duck Kim, Jung-Hyun Park, Nam-Keun Oh, Jong-Gyu Choi, Ji-Eun Kim
  • Publication number: 20110110058
    Abstract: A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.
    Type: Application
    Filed: March 26, 2010
    Publication date: May 12, 2011
    Inventors: Ji-Eun KIM, Nam-Keun Oh, Jung-Hyun Park, Young-Ji Kim, Jong-Gyu Choi, Sang-Duck Kim, Young-Hwan Shin, Kyung-Ro Yoon
  • Publication number: 20110100952
    Abstract: A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.
    Type: Application
    Filed: September 28, 2010
    Publication date: May 5, 2011
    Inventors: Ji-Eun KIM, Nam-Keun Oh, Jung-Hyun Park, Young-Ji Kim, Jong-Gyu Choi, Sang-Duck Kim
  • Publication number: 20110095425
    Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.
    Type: Application
    Filed: August 30, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Hyun Park, Nam Keun Oh, Sang Duck Kim, Jong Gyu Choi, Young Ji Kim, Ji Eun Kim, Myung Sam Kang