Patents by Inventor Young Jin Ha
Young Jin Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153831Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.Type: ApplicationFiled: October 19, 2023Publication date: May 9, 2024Inventors: Yong Jun SEO, Su Jin CHAE, Sang Hyun SON, Sang Min HA, Young Sik BANG, Jeong Mo HWANG, Dong Ok AHN
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Publication number: 20240128796Abstract: A power transfer system includes an electric vehicle supply equipment (EVSE) for providing electric power to an electric vehicle (EV) and an electric power reception device mounted in the EV; a first conductor plate electrically connected to a primary-side circuit of the EVSE; a compensation circuit for transferring a power input signal of the EVSE to the first conductor plate; a second conductor plate disposed in the EV and connected to the electric power reception device; and a secondary-side circuit for transferring a power signal received by the second conductor plate to a load, where the electric power is transferred from the EVSE to the EV by capacitive coupling between the first conductor plate and the second conductor plate.Type: ApplicationFiled: October 6, 2023Publication date: April 18, 2024Inventors: Eui Hoon Chung, Gyu Yeong Choe, Young Jin Kim, Sung Hyuk Choi, Jung Ik Ha
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Patent number: 11944958Abstract: Disclosed herein are a catalyst for hydrocracking reaction of high molecular weight components in bio-oil, a method for preparing the same and a method for bio-oil upgrading using the same. The catalyst includes a zeolite carrier; and at least one metal selected from the group consisting of nickel (Ni), ruthenium (Ru) and cerium (Ce) supported on the carrier. The catalyst promotes the hydrocracking of high molecular weight compounds contained in the bio-oil, but also inhibits the polymerization reaction of the decomposed product, thereby more effectively enhancing the hydrocracking reaction of the bio-oil.Type: GrantFiled: July 18, 2022Date of Patent: April 2, 2024Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Chunjae Yoo, Jeong-Myeong Ha, Dong Jin Suh, Jae Wook Choi, Young Hyun Yoon, Kyeongsu Kim, Chang Soo Kim, Kwang Ho Kim, Thi Lien Do
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Patent number: 10593465Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.Type: GrantFiled: September 19, 2017Date of Patent: March 17, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Jin Ha, Hyun Ju Jung, Jeong Hwan Im, So Young Jun, Sung Jin Park
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Publication number: 20190013121Abstract: A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided.Type: ApplicationFiled: November 28, 2017Publication date: January 10, 2019Inventors: Young Jin HA, Jeong Hwan IM, So Young JUN, Sung Jin PARK
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Publication number: 20180308617Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.Type: ApplicationFiled: September 19, 2017Publication date: October 25, 2018Inventors: Young Jin HA, Hyun Ju JUNG, Jeong Hwan IM, So Young JUN, Sung Jin PARK
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Publication number: 20160284467Abstract: A method of manufacturing a multilayer ferrite bead includes steps of: preparing ferrite sheets having internal electrodes formed on surfaces thereof; forming a ferrite laminate by stacking the ferrite sheets; forming a groove by pressurizing a central portion of the ferrite laminate; and forming external electrodes on the ferrite laminate.Type: ApplicationFiled: March 4, 2016Publication date: September 29, 2016Inventors: Jin Seong KIM, Young Jin HA, Sung Jin PARK, Hyun Ju JUNG
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Patent number: 9412509Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.Type: GrantFiled: October 1, 2014Date of Patent: August 9, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Hwan Im, So Young Jun, Hyun Ju Jung, Sung Jin Park, Young Jin Ha
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Publication number: 20160005526Abstract: A multilayer inductor may include a multilayer body in which a plurality of insulating layers are stacked and of which a thickness is greater than a width; and an internal coil part formed by electrically connecting a plurality of internal coil patterns disposed on the plurality of insulating layers to each other. Side surfaces of the multilayer body opposing each other in a width direction are concave.Type: ApplicationFiled: October 3, 2014Publication date: January 7, 2016Inventors: Jeong Hwan IM, Young Jin HA
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Publication number: 20150371754Abstract: A multilayer inductor may include: a multilayer body including a plurality of insulation layers stacked therein and having a thickness greater than a width thereof; and an internal coil part formed in the multilayer body by electrically connecting a plurality of internal coil patterns disposed on the plurality of insulation layers. The internal coil part may be disposed to be biased toward one portion of the multilayer body from a central portion of the multilayer body in a thickness direction.Type: ApplicationFiled: October 1, 2014Publication date: December 24, 2015Inventors: Jeong Hwan IM, Young Jin Ha
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Publication number: 20150371755Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.Type: ApplicationFiled: October 1, 2014Publication date: December 24, 2015Inventors: Jeong Hwan IM, So Young JUN, Hyun Ju JUNG, Sung Jin PARK, Young Jin HA
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Patent number: 8111123Abstract: A method of manufacturing a transformer that includes forming a disc-wound coil using a plurality of pre-formed cooling ducts. Each cooling duct may be supported by a support pipe secured between walls of the cooling duct, or by a removable insert. First and second conductor layers are formed, each of which include plurality of disc windings arranged in an axial direction of the disc-wound coil. A spacer layer is formed between the first and second conductor layers to form a plurality of axially-extending passages. The cooling ducts are slid into the axially-extending passages so as to be disposed between the first and second conductor layers.Type: GrantFiled: September 10, 2010Date of Patent: February 7, 2012Assignee: ABB Technology AGInventors: Jong-Yun Lim, Chang-Yeol Lim, Young-Jin Ha, Chang-Hyeon Lee, Charles W. Johnson, Hae-Sun Yang, Rafael Murillo, Robert C. Ballard
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Publication number: 20110063062Abstract: A method of manufacturing a transformer that includes forming a disc-wound coil using a plurality of pre-formed cooling ducts. Each cooling duct may be supported by a support pipe secured between walls of the cooling duct, or by a removable insert. First and second conductor layers are formed, each of which include plurality of disc windings arranged in an axial direction of the disc-wound coil. A spacer layer is formed between the first and second conductor layers to form a plurality of axially-extending passages. The cooling ducts are slid into the axially-extending passages so as to be disposed between the first and second conductor layers.Type: ApplicationFiled: September 10, 2010Publication date: March 17, 2011Applicant: ABB TECHNOLOGY AGInventors: Jong-Yun Lim, Chang-Yeol LIM, Young-Jin HA, Chang-Hyeon Lee, Charles W. Johnson, Hae-Sun Yang, Rafael Murillo, Robert C. Ballard
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Patent number: 5699852Abstract: A heat exchanger having corrosion resistant resin-coated plates and pipes. The heat exchanger is easily constructed using the corrosion resistant resin-coated plates and the pipes. The heat exchanger does not require heat treatments or large constructing sections. In the heat exchanger according to the present invention, a gas is supplied to the outside of pipes, and air and/or water are passed through the pipes. As a result, heat change is accomplished. A pipe plate and a side wall of the heat exchanger are coated with Teflon or a heat resistant resin. In the feed water pre-heater for heating water, pipes are formed as metal pipes coated with a resin for maintaining the strength of the pipes. Thereafter, the pipes are individually welded and fabricated. In the feed air pre-heater, the heat exchanger has side walls, a pipe plate and pipes. The side walls and the pipe plate have essentially the same structure. The pipes are made of resin. The pipe plate and pipes are united by a metal assembling member.Type: GrantFiled: August 22, 1996Date of Patent: December 23, 1997Assignee: Korea Institute of Energy ResearchInventors: Young Jae Park, San Il Park, Kyoung Bin Choi, Young Jin Ha, Ki Ho Park, Chang Bog Ko, Jeong Gun Kim