Abstract: An apparatus for embedding a sentence feature vector according to an embodiment includes a sentence acquisitor configured to acquire a first sentence and a second sentence, each including one or more words; a vector extractor configured to extract a first feature vector corresponding to the first sentence and a second feature vector corresponding to the second sentence by independently inputting each of the first sentence and the second sentence into a feature extraction network; and a vector compressor configured to compress the first feature vector and the second feature vector into a first compressed vector and a second compressed vector, respectively, by independently inputting each of the first feature vector and the second feature vector into a convolutional neural network (CNN)-based vector compression network.

Abstract: A lithium secondary battery includes a cathode including a cathode current collector and a cathode active material layer formed on the cathode current collector, and an anode including an anode current collector and an anode active material layer formed on the anode current collector. The anode active material layer has an area larger than that of the cathode active material layer. The cathode active material layer includes a central portion and an outer portion surrounding the central portion, and the outer portion has a specific capacity less than that of the central portion.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.

Abstract: The present disclosure relates to an organic electroluminescent compound represented by formula 1 and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound of the present disclosure, it is possible to provide an organic electroluminescent device having lower operating voltage, higher luminous efficiency and/or longer lifespan properties as compared with a conventional organic electroluminescent device.

Abstract: An all solid state battery includes a battery body including first and second surfaces opposing each other in a first direction of the battery body, third and fourth surfaces opposing each other in a second direction of the battery body, and fifth and sixth surfaces opposing each other in a third direction of the battery body, a solid electrolyte layer, and a cathode layer and an anode layer stacked in the third direction with the solid electrolyte layer therebetween, a cathode penetration electrode, and an anode penetration electrode opposing the cathode penetration electrode in the second direction; a cathode terminal; and an anode terminal. An average margin of the cathode layer from an edge of the cathode layer to the third surface in the second direction is within a range of 15% or more and 30% or less of an average width of the battery body in the second direction.

Abstract: An all-solid-state battery includes an electrode assembly including a solid electrolyte layer and first and second internal electrodes stacked with the solid electrolyte layer interposed therebetween, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The first internal electrode and the second internal electrode include the same active material, and the active material includes a compound having an olivine-type crystal structure.

Abstract: An all-solid-state battery includes a battery body having opposing first and second surfaces and opposing third and fourth surfaces, and including a positive electrode layer having at least a portion led out to the first surface, and a negative electrode layer having at least a portion led out to the second surface, a solid electrolyte interposed between the positive and negative electrode layers; a positive electrode terminal connected to the positive electrode layer and disposed on the first surface; and a negative electrode terminal connected to the negative electrode layer and disposed on the second surface. The positive and negative electrode layers each include an electrode lead led out to the third and the fourth surfaces. The positive electrode terminal has at least a portion extending on the third and fourth surfaces, and the negative electrode terminal has at least a portion extending on the third and fourth surfaces.

Abstract: A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

Abstract: A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

Abstract: Provided is a current lead wire using a superconducting tape. The current lead wire may comprise a first superconducting tape that electrically connects the first terminal and the second terminal; a second superconducting tape that is arranged in parallel with the first superconducting tape to electrically connect the first terminal with the second terminal; and a third superconducting tape that electrically connects the first superconducting tapes with the second superconducting tape.

Abstract: A superconducting synchronous motor having a simple and stable structure is provided. The superconducting synchronous motor according to one embodiment of the present invention comprises: a rotary shaft; a rotation core mounted at the rotary shaft so as to be rotated by connecting with the rotary shaft; and hooked magnetic poles extending from one end of the rotation core in a longitudinal direction. Each of the hooked magnetic poles is composed of first and second inductors of a magnetic material alternately engaged with each other and a superconducting wire to be wound, and comprises a first superconducting field winding and a second superconducting field winding fixed closely at the other end of a first inductor rotation core and the other end of a second inductor rotation core, respectively. Each of the first superconducting field winding and the second superconducting field winding excites the first inductor and the second inductor to different poles.

Abstract: Provided is a current lead wire using a superconducting tape. The current lead wire may comprise a first superconducting tape that electrically connects the first terminal and the second terminal; a second superconducting tape that is arranged in parallel with the first superconducting tape to electrically connect the first terminal with the second terminal; and a third superconducting tape that electrically connects the first superconducting tapes with the second superconducting tape.

Abstract: Provided is a reverse magnetization structure of a DC reactor and a reverse magnetization method using a superconducting bulk thereof. The reverse magnetization structure of a DC reactor may comprise an iron-core; a DC reactor coil located on a primary side of the iron-core; and a superconducting bulk located on a secondary side of the iron-core.

Abstract: A superconducting synchronous motor having a simple and stable structure is provided. The superconducting synchronous motor according to one embodiment of the present invention comprises: a rotary shaft; a rotation core mounted at the rotary shaft so as to be rotated by connecting with the rotary shaft; and hooked magnetic poles extending from one end of the rotation core in a longitudinal direction. Each of the hooked magnetic poles is composed of first and second inductors of a magnetic material alternately engaged with each other and a superconducting wire to be wound, and comprises a first superconducting field winding and a second superconducting field winding fixed closely at the other end of a first inductor rotation core and the to other end of a second inductor rotation core, respectively. Each of the first superconducting field winding and the second superconducting field winding excites the first inductor and the second inductor to different poles.

Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.

Abstract: The method of winding superconducting wire comprises a winding method comprising: winding the superconducting wire from the source reel onto the first lane of the first bobbin a first number of times in a first direction; fixing the first bobbin and the second bobbin to each other; winding the superconducting wire from the source reel onto the third lane of the second bobbin a second number of times in the first direction; separating the first bobbin and the second bobbin from each other; and winding the superconducting wire from the first lane of the first bobbin onto the fourth lane of the second bobbin a third number of times in a second direction which is different from the first direction while winding the superconducting wire from the third lane of the second bobbin onto the source reel the third number of times in the second direction.

Abstract: A bobbin for layer winding of superconducting wire and a layer winding method using the same are provided. The bobbin for layer winding of superconducting wire includes a cylindrical bobbin body on which the superconducting wire is wound, and a plurality of spacers having a fan-shaped periphery to guide the superconducting wire, wherein a plurality of layers are formed on the cylindrical bobbin body by the spacers.

Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.

Abstract: Disclosed is a laundry machine in which a tub is isolated from vibration of a drum, ensuring an increased size of the tub and an increased volume of the tub. This results in an increased capacity of the laundry machine. The increased size of the tub provides a sufficient space between the tub and a cabinet for installation of relevant constituent elements, thus accomplishing a compact interior structure of the laundry machine.