Abstract: An antenna device which is built into an electronic appliance having a metal cover provided with a radio wave passer is provided. The electronic apparatus includes an antenna portion arranged adjacent to the radio wave passer so as to be capable of transmitting and receiving radio waves through the radio wave passer. A reflecting portion which reflects the radio waves radiated from the antenna portion is located on an opposite side of the antenna portion, so that the antenna portion is between the reflecting portion and the radio wave passer.

Abstract: A rotary cam apparatus including an operation member including a contact portion is provided. The rotary cam includes a cam profile contacting the contact portion to move the operation member, and an elastic member applying an elastic force to the operation member in a direction in which the contact portion contacts the cam profile. The cam profile includes a first cam line separated by a first distance from a rotating center of the rotary cam, a second cam line separated by a shorter second distance from the rotating center, a first conversion line connected to the first cam line from the second cam line, and a second conversion line connected to the second cam line from the first cam line including one or more straight connection lines separated by a distance greater than the second distance and less than the first distance from the rotating center.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.

Abstract: Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe.

Abstract: A mold for hot stamping is disclosed. The mold for hot stamping according to an exemplary embodiment of the present invention may include an upper mold and a lower mold so as to stamp a heated blank having a welding portion. A recess may be formed at an upper forming surface in the upper mold corresponding to the welding portion of the blank and may define a cooling space between the recess and the blank such that a cooling fluid directly cools the welding portion of the blank after the blank is stamped.

Abstract: There is disclosed a method for preparing a reverse osmosis membrane, the method including: forming a first coating layer by coating an aqueous amine solution on a surface of a microporous support to have a thickness of 20 ?m to 30 ?m; removing an excess of the aqueous amine solution from the microporous support; and forming a second coating layer by coating an aliphatic hydrocarbon-based organic solution including acyl halide on the first coating layer to have a thickness of 10 ?m to 30 ?m.

Abstract: Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.

Abstract: A reverse osmosis separation membrane includes a porous support, a separation active layer formed on the supporting layer, and a ultra hydrophilic layer formed on the separation active layer. The ultra-hydrophilic layer includes a complex metal oxide including at least one metal element selected from the group consisting of Ti(IV), Zr(IV), Sn(IV) and Al(III), and Si, and an organic compound containing a hydrophilic group making a physical or chemical bond with Ti(IV), Zr(IV), Sn(IV) or Al(III) among the complex metal oxide. A method of manufacturing the reverse osmosis separation membrane also is provided. A reverse osmosis membrane including a single coating layer and having an improved durability, chlorine-resistance and antifouling properties may be provided.

Abstract: A reverse osmosis separation membrane includes a minute, porous support, and a polyamide active layer formed on the minute, porous support and including at least one compound containing grapheme is disclosed. A method of manufacturing the reverse osmosis separation membrane is also disclosed.

Abstract: Disclosed herein is a nano-patterning system including a nano-patterning apparatus. The nano-patterning apparatus includes: a holder unit including a transfer unit and an insulating unit; a tip unit inserted into the holder unit, downwardly protruded, and having a flow channel; a flow path having one end connected to the flow channel through one side of the transfer unit or the insulating unit and extending to the outside to serve as a movement path allowing a nano-patterning material to move therealong; a pressing unit pressing the nano-patterning material at one side of the flow path; and a storage unit connected to the other end of the flow path and storing the nano-patterning material.

Abstract: Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.

Abstract: A cup holder apparatus for a vehicle may include an accommodating tray provided inside a vehicle compartment and having an accommodation space for accommodating a cup therein, a cup support member rotatably provided around a rotating shaft (Z axis) against the accommodating tray and including a bottom portion for safe-placing the cup in the accommodation space and a support portion formed in a stand from the bottom portion to support an outer periphery of the cup, and a release prevention member prepared separately from the cup support member and connected to the bottom portion of the cup support member, while being rotatably coupled to the accommodating tray, to prevent release of the cup support member from the accommodating tray, wherein the release of the release prevention member from the accommodating tray is hindered by an upper stopper formed on the accommodating tray while the cup support member is rotatably coupled to the upper stopper and is rotated around the rotating shaft.

Abstract: An antenna structure includes: a substrate; a ground layer disposed on a first surface of the substrate; a patch antenna unit which is disposed on a second surface of the substrate opposite to the first surface of the substrate, and is configured to receive a signal to be radiated; and a three-dimensional (3D) antenna unit which comprises a shorting leg that is shorted with the patch antenna unit, and is configured to radiate the signal received by the patch antenna unit.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.

Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract: A cup holder apparatus for a vehicle may include an accommodating tray provided inside a vehicle compartment and having an accommodation space for accommodating a cup therein, a cup support member rotatably provided around a rotating shaft (Z axis) against the accommodating tray and including a bottom portion for safe-placing the cup in the accommodation space and a support portion formed in a stand from the bottom portion to support an outer periphery of the cup, and a release prevention member prepared separately from the cup support member and connected to the bottom portion of the cup support member, while being rotatably coupled to the accommodating tray, to prevent release of the cup support member from the accommodating tray, wherein the release of the release prevention member from the accommodating tray is hindered by an upper stopper formed on the accommodating tray while the cup support member is rotatably coupled to the upper stopper and is rotated around the rotating shaft.

Abstract: A semiconductor device having vertically aligned transistors made from pillar structures that have flat side surfaces is presented. The semiconductor device includes a semiconductor substrate, spacers, and gates. The semiconductor substrate has pillar structures that have flat side surfaces. The spacers are on sidewalls only on the upper portions of the pillar structures. The gates surround lower portions of the pillar structures.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.