Abstract: An electronic device is provided. The electronic device includes a display, a communication module, and at least one processor operatively connected to the display and the communication module, wherein the at least one processor is configured to activate a virtual reality (VR) application, identify at least one marker image included in a VR content based on displaying the VR content related to a first external device connected through the communication module while the VR application is executed, identify an area for mirroring a screen of the first external device based on the at least one marker image, based on matching of account information included in the at least one marker image and account information of the VR application, and display a screen of the first external device on the area.

Abstract: A processor-implemented liveness test method includes detecting a face region in a query image, the query image including a test object for a liveness test, determining a liveness test condition to be applied to the test object among at least one liveness test condition for at least one registered user registered in a registration database, determining at least one test region in the query image based on the detected face region and the determined liveness test condition, obtaining feature data of the test object from image data of the determined at least one test region using a neural network-based feature extractor, and determining a result of the liveness test based on the obtained feature data and registered feature data registered in the registration database and corresponding to the determined liveness test condition.

Abstract: The present disclosure relates to an interposer. The interposer includes: a support body formed of a ceramic material, a connection electrode configured to the top surface and bottom surface of the support body, and a shielding member disposed at an outer surface of the support body. At least a part of the support body is disposed along the edge of a substrate, and electrically connects the substrate and a substrate. The interposer is formed of a ceramic material and thus make it possible to implement a fine pattern, to improve dimensional stability by preventing the bending deformation of ceramic green sheets, and to raise the reliability of signal transmission. Therefore, the interposer can contribute to implementing high performance of an electronic device and reducing the size of the electronic device.

Abstract: A semiconductor device includes a bit line structure, first and second capping patterns, first and second contact plug structures, and a capacitor. The bit line structure extends on a cell region and a dummy region. The first capping pattern is adjacent the bit line structure on the cell region. The second capping pattern is adjacent the bit line structure on the dummy region. The first contact plug structure is adjacent the bit line structure and the first capping pattern on the cell region, and includes a lower contact plug and a first upper contact plug sequentially stacked. The second contact plug structure is adjacent the bit line structure and the second capping pattern on the dummy region, and includes a dummy lower contact plug and a second upper contact plug sequentially stacked. The capacitor contacts an upper surface of the first contact plug structure on the cell region.

Abstract: A decoding device and a decoding method which relate to: receiving a codeword; estimating a number of errors included in the received codeword; and decoding the codeword based on the estimated number of errors using at least one of a first parity check matrix and a second parity check matrix, wherein the first parity check matrix corresponds to a first low-density parity check (LDPC) code, and the second parity check matrix corresponds to a second LDPC code, and wherein the first parity check matrix is based on a first code type, and the second parity check matrix is based on a second code type different from the first code type.

Abstract: A station for a cleaning device is provided. The station includes an accommodation chamber configured to be docked with the dust canister, a housing configured to have a dust bag disposed therein, a cover configured to open and close one region of the housing, a holder configured to be detachable to the dust bag and selectively communicate the dust bag with the accommodation chamber, and a lever configured to have one end disposed in one region of the housing and rotate in a first direction to selectively interfere with the cover. The lever rotates in a second direction opposite to the first direction to close the cover based on the dust bag being mounted on the holder and in communication with the accommodation chamber.

Abstract: A stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. The stretchable strain sensor is located in a path of light emitted from the light-emitting element. The optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. The photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.

Abstract: A generalized low-density parity-check (G-LDPC) encoder, including a plurality of generalized constraint (GC) encoders configured to perform a plurality of GC encoding operations in parallel based on a GC code having a quasi-cyclic (QC) structure including information variable nodes, inner parity variable nodes, and super check nodes configured to perform multiple condition checks, wherein each GC encoder of the plurality of GC encoders includes a plurality of first logic circuits configured to perform a GC encoding operation of the plurality of GC encoding operations; and an LDPC encoder configured to perform an LDPC encoding operation based on an LDPC code having the QC structure, wherein the LDPC encoder includes a plurality of single check nodes configured to perform a single parity check, wherein the each GC encoder is configured to receive information bits, and to determine parity bits of a portion of inner parity bits corresponding to the information bits by enabling only a portion of the plurality of

Abstract: An example electronic device may include at least one processor and a communication device.

Abstract: An example electronic device may include at least one processor and a communication device.

Abstract: a G-LDPC decoder is provided. The G-LDPC decoder includes: a generalized check node decoder configured to, in each of a plurality of iterations: group connected variable nodes into groups, the connected variable nodes being connected to an mth generalized check node among generalized check nodes; generate test patterns in each of one or more of the groups based on a first message received by the mth generalized check node from the connected variable nodes; and identify a value of a second message to be provided from the mth generalized check node to the connected variable nodes based on the test patterns; and a LDPC decoder circuitry configured to, in each of the iterations, update a value of an nth variable node, among the variable nodes, based on the second message received by the nth variable node from a generalized check node that is connected to the nth variable node.

Abstract: Disclosed is a magnetic memory device including a pinned magnetic pattern and a free magnetic pattern that are sequentially stacked on a substrate, a tunnel barrier pattern between the pinned magnetic pattern and the free magnetic pattern, a top electrode on the free magnetic pattern, and a capping pattern between the free magnetic pattern and the top electrode. The capping pattern includes a lower capping pattern, an upper capping pattern between the lower capping pattern and the top electrode, a first non-magnetic pattern between the lower capping pattern and the upper capping pattern, and a second non-magnetic pattern between the first non-magnetic pattern and the upper capping pattern. Each of the lower capping pattern and the upper capping pattern includes a non-magnetic metal. The first non-magnetic pattern and the second non-magnetic pattern include different metals from each other.

Abstract: A display device includes an optical module, a light emitting structure, a lower substrate including a display area, and in order within the display area a first area corresponding to the optical module, second area adjacent to the optical module, and a third area including the light emitting structure, a light-transmitting filling layer in the first area and corresponding to the optical module, a light blocking layer in the second area and defining an opening corresponding to the light-transmitting filling layer in the first area, and an upper substrate facing the lower substrate with the light emitting structure and the light blocking layer therebetween.

Abstract: Proposed are a method and an apparatus for setting the registration between an IoT controller and IoT controlee on the basis of a C2C connection in a wireless LAN system of a smart home environment. Particularly, the controlee receives detection information about the controlee from the controller. The controlee transmits a challenge request message for requesting the first information from the controller. The controlee receives a challenge response message including the first information from the controller. The controlee transmits a challenge confirm message to the controller.

Abstract: A semiconductor device including an active pattern; a gate structure connected to the active pattern; a bit line structure connected to the active pattern; a buried contact connected to the active pattern; a contact pattern covering the buried contact; a landing pad connected to the contact pattern; and a capacitor structure connected to the landing pad, wherein the buried contact includes a first growth portion and a second growth portion spaced apart from each other, and the landing pad includes an interposition portion between the first growth portion and the second growth portion.

Abstract: A semiconductor package includes a film substrate; a plurality of wires on an upper surface of the film substrate; an upper insulating film covering the plurality of wires on the upper surface of the film substrate and defining a plurality of pad openings and a mounting region opening such that, the plurality of pad openings expose at least a portion of an outer lead bonding portion of the plurality of wires along at least one of the first side surface or the second side surface and the mounting region opening exposes at least a portion of an inner lead bonding portion of the plurality of wiring; a semiconductor chip bonded to and electrically connected to the exposed inner lead bonding portion, and at least one support pattern on a lower surface of the film substrate and extending in the first direction to overlap with the plurality of pad openings.

Abstract: A processor-implemented method includes generating a preprocessed infrared (IR) image by performing first preprocessing based on an IR image including an object; generating a preprocessed depth image by performing second preprocessing based on a depth image including the object; and determining whether the object is a genuine object based on the preprocessed IR image and the preprocessed depth image

Abstract: A low density parity check (LDPC) decoder initializing variable nodes with a value of a codeword and outputting the updated variable nodes as decoded messages with reference to an irregular parity check matrix. The LDPC decoder includes a plurality of unit logic circuits operating in a single mode in which all the unit logic circuits update one variable node group including at least one variable node, or a multi-mode in which each of the unit logic circuits updates a plurality of variable node groups in parallel by updating different variable nodes, and a mode controller controlling the plurality of unit logic circuits to update a high-degree variable node group having a degree greater than a threshold degree among the variable node groups in the single mode, and update a low-degree variable node group having a degree less than or equal to the threshold degree among the variable node groups in the multi-mode.

Abstract: In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure.

Abstract: A foldable electronic device includes a first and second housings foldably coupled through a hinge, a flexible display supported by the first and second housings, a first speaker disposed in the first housing and a second speaker disposed in the second housing. The electronic device determines first and second states in which the first and second housings unfolded or folded. The electronic device controls sound frequency characteristics of the first and second speakers to have first sound frequency characteristics with the electronic device being in the first state. The electronic device controls sound frequency characteristics of the first speaker to have second sound frequency characteristics with the electronic device being in the second state. The electronic device may also control sound frequency characteristics of the second speaker to have third sound output frequency characteristics with the electronic device being in the second state.