Abstract: An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate.

Abstract: Inventive aspects include a method, apparatus, and system for reducing power switch cells in MTCMOS circuits. Such may include disposing columns of real and virtual power straps orthogonally over rows of logic cells. A first power switch cell can be disposed over a real and a virtual power strap in a first column, and collinear with a first row of logic cells. A second power switch cell can be disposed over a real a virtual power strap in a second column, and collinear with a fifth row of logic cells. A third power switch cell can be disposed over a real a virtual power strap in a third column, and collinear with a third row of logic cells. A fourth power switch cell can be disposed over a real a virtual power strap in a fourth column, and collinear with a seventh row of logic cells.

Abstract: An embodiment includes a method, comprising: receiving a layout of an integrated circuit having a plurality of regions; determining a utilization for each of the regions; for each region, selecting from among a plurality of switch cell organizations for the region in response to the corresponding utilization; and for each region, modifying the layout to include switch cells for the region according to the selected switch cell organization.

Abstract: An embodiment includes a method, comprising: receiving a layout of an integrated circuit having a plurality of regions; determining a utilization for each of the regions; for each region, selecting from among a plurality of switch cell organizations for the region in response to the corresponding utilization; and for each region, modifying the layout to include switch cells for the region according to the selected switch cell organization.

Abstract: Inventive aspects include a method, apparatus, and system for reducing power switch cells in MTCMOS circuits. Such may include disposing columns of real and virtual power straps orthogonally over rows of logic cells. A first power switch cell can be disposed over a real and a virtual power strap in a first column, and collinear with a first row of logic cells. A second power switch cell can be disposed over a real a virtual power strap in a second column, and collinear with a fifth row of logic cells. A third power switch cell can be disposed over a real a virtual power strap in a third column, and collinear with a third row of logic cells. A fourth power switch cell can be disposed over a real a virtual power strap in a fourth column, and collinear with a seventh row of logic cells.

Abstract: An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate.

Abstract: In an optical member holder and a projection exposure apparatus having the same, a light beam radiated from a light source may be formed into light having a desired shape by selecting one of a plurality of optical elements. An optical element holder may include a support member to support the plurality of optical elements, a first driving section to move or rotate the support member to select one of the optical elements, and a second driving section to rotate the selected optical element to adjust an arrangement direction thereof. The light formed by the selected optical element may be directed through a reticle.

Abstract: In an optical member holder and a projection exposure apparatus having the same, a light beam radiated from a light source may be formed into light having a desired shape by selecting one of a plurality of optical elements. An optical element holder may include a support member to support the plurality of optical elements, a first driving section to move or rotate the support member to select one of the optical elements, and a second driving section to rotate the selected optical element to adjust an arrangement direction thereof. The light formed by the selected optical element may be directed through a reticle.

Abstract: Embodiments of the present invention provide, among other things, a method of forming an alignment mark having a stepped structure without an additional process. The alignment mark may be used to prevent formation of a defect source in a semiconductor device.

Abstract: A structure, which may be provided on an overlay region for an overlay mark, may include a first pattern that may project from a peripheral portion of the overlay region that may be defined on a scribe lane of a substrate. A second pattern may project from a central portion of the overlay region.

Abstract: A semiconductor wafer has an alignment mark for use in aligning the wafer with exposure equipment during the manufacturing of a semiconductor device. The wafer is made by forming a chemical mechanical polishing target layer over an alignment mark layer, chemically-mechanically polishing the target layer to planarize the same, and prior to forming the chemical mechanical polishing target layer over the alignment mark layer, forming a dense pattern of lands or trenches in the alignment layer of dimensions and an inter-spacing preselected to inhibit a dishing phenomenon from occurring in the target layer as the result of its being chemically-mechanically polished. The lands or trenches may be disposed in at least a 2×2 array of rows and columns.

Abstract: A semiconductor wafer has an alignment mark for use in aligning the wafer with exposure equipment during the manufacturing of a semiconductor device. The wafer is made by forming a chemical mechanical polishing target layer over an alignment mark layer, chemically-mechanically polishing the target layer to planarize the same, and prior to forming the chemical mechanical polishing target layer over the alignment mark layer, forming a dense pattern of lands or trenches in the alignment layer of dimensions and an inter-spacing preselected to inhibit a dishing phenomenon from occurring in the target layer as the result of its being chemically-mechanically polished. The lands or trenches may be disposed in at least a 2×2 array of rows and columns.

Abstract: A semiconductor wafer has an alignment mark for use in aligning the wafer with exposure equipment during the manufacturing of a semiconductor device. The wafer is made by forming a chemical mechanical polishing target layer over an alignment mark layer, chemically-mechanically polishing the target layer to planarize the same, and prior to forming the chemical mechanical polishing target layer over the alignment mark layer, forming a dense pattern of lands or trenches in the alignment layer of dimensions and an inter-spacing preselected to inhibit a dishing phenomenon from occurring in the target layer as the result of its being chemically-mechanically polished. The lands or trenches may be disposed in at least a 2×2 array of rows and columns.